D&R Headline News (July 2017)

Headlines for Monday Jul. 31, 2017

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INVECAS Acquires Lattice's HDMI Design Team and Simplay Labs Subsidiary

INVECAS today announced that it has signed a definitive agreement, pursuant to which INVECAS will acquire Lattice Semiconductor Corporation’s (NASDAQ: LSCC) HDMI design team and Simplay Labs subsidiary, which oversees standards compliance and interoperability testing services.

• Azul Systems Collaborates with Qualcomm to Bring Enterprise-Grade Open Source Java on ARM to Datacenters
• Sierraware makes Global Platform compliant Trusted Execution Environment (TEE) available for MIPS-based devices
• Bluetooth SIG Announces Mesh Networking Capability

Headlines for Friday Jul. 28, 2017

• UMC Breaks into 14nm
• Blue Pearl Software Streamlines RTL Verification for Xilinx All Programmable FPGAs and SoCs

Headlines for Thursday Jul. 27, 2017

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OVH and Accelize Demonstrate the Value of FPGAs in the Cloud with GZIP Compression, from CAST, Achieving Acceleration Factors of >100x

Accelize and OVH, in partnership with CAST, today announced the availability of GZIP compression on FPGA-as-a-service.com, the industry’s first online platform for FPGA acceleration evaluation that enables cloud users to evaluate FPGA acceleration for compute-intensive applications.

• Mentor supports Xilinx Zynq UltraScale+ MPSoC Platform with updated embedded platform release
• Xilinx Sales Grow For 7th Consecutive Quarter; Advanced Product Sales Up 33% Year-Over-Year
• Truechip-Moving Towards 10 Years of Successfulness
• USB 3.0 Promoter Group Announces USB 3.2 Update
• eMemory Announces Validation of On-Chip Security IP on UMC Advanced Nodes

Headlines for Wednesday Jul. 26, 2017

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Sankalp Semiconductor to hire 300 engineers

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its plan to hire 300 engineers in the next 12 months. Sankalp plans to hire engineers for its India design centers in Bangalore, Hubli and Kolkata.

• MediaTek Standardizes on Synopsys' HAPS-80 Prototyping System
• IoT Growth Slower Than Expected

Headlines for Tuesday Jul. 25, 2017

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Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications

Cadence today announced the Cadence® Tensilica® HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs).

• Synopsys Launches Complete HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Computing SoCs
• Xylon releases New logiADAK-VDF Video Framework Version
• Value of Semiconductor Industry M&A Deals Slows Dramatically in 1H17
• Second Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Continue to Ship at Record Levels
• Report: Samsung Plans to Triple Foundry Market Share
• Rambus Reports Second Quarter 2017 Financial Results
• Cadence Reports Second Quarter 2017 Financial Results

Headlines for Monday Jul. 24, 2017

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Inside Secure announces new high-performance 400G MAC layer security (MACsec) IP for Datacenters and the Cloud

Inside Secure (Euronext Paris: INSD), at the heart of security solutions for mobile and connected devices, has released its newest MACsec IP cores that successfully tackle two major challenges in securing high-speed networking: power consumption and flexible line rate throughput in an optimal die area. Leading chipmakers today are already realizing the benefits of Inside Secure’s 400G MACsec IP in their devices (400 Gigabit/sec).

• Security a Must for Auto GbE Switch
• Enhanced Open Source Framework Available for Parallel Programming on Embedded Multicore Devices
• AMD's CTO on 7nm, Chip Stacks

Headlines for Friday Jul. 21, 2017

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Founders of DeepMind, OpenAI and Chief Scientist at Uber back Graphcore in new $30m funding round led by Atomico

Graphcore IPU products will lower the cost of accelerating AI applications, increase the performance of both training and inference by 10x to 100x compared to the fastest systems today and enable recent success in deep learning to evolve rapidly towards useful, general artificial intelligence.

• Flex Logix's EFLX Embedded FPGA Accelerates Processor Performance By 40-100X
• Neural Accelerator Battle Begins

Headlines for Thursday Jul. 20, 2017

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REFLEX CES Takes Its Autonomy with MBO Partenaires

The French specialist in complex electronic embedded systems associates with MBO Partenaires and takes its independence from the PLDA group. This spin-off, led by the manager Sylvain Neveu, allows the management team to hold the majority of the equity.

• Cadence Genus Synthesis Solution Enables Toshiba to Complete a Successful ASIC Tapeout with a 2X Logic Synthesis Runtime Improvement
• Innosilicon introduces next generation X11 miner, 30.2GH at 750W
• HDL Design House and AFuzion Synergy to Enhance DO-254 Projects
• Mentor Adds Veloce Strato Emulation Platform Software to Mentor Safe ISO 26262 Qualification Program

Headlines for Wednesday Jul. 19, 2017

• 2H17 DRAM, NAND ASP Growth to Cool, But Yearly Growth Strong
• S2C Prodigy Quad Virtex UltraScale FPGA Prototyping Logic Module Now Available for Large Scale Designs

Headlines for Tuesday Jul. 18, 2017

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Microsemi and Tamba Collaborate on New PolarFire Devices to Deliver Industry-Leading Low Power FPGA-Based 10G Ethernet Solution

Microsemi and Tamba Networks today announced their collaboration to incorporate Tamba Networks' Ethernet media access controller (MAC) in Microsemi's new cost-optimized, low power, mid-range PolarFire™ field programmable gate array (FPGA) to offer industry-leading low power FPGA-based 10G Ethernet solution.

• Solving Critical Bugs: Tracing from Power-Up for DesignWare ARC processors
• Cadence Functional Safety Verification Solution Adopted for ISO 26262-Compliant Automotive IC Development Flow at ROHM

Headlines for Monday Jul. 17, 2017

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Does NVMe Have a Place in Industrial Embedded and IoT?

Is NVM Express (NVMe) overkill for embedded, industrial applications? Until recently, that's been the consensus, according to Scott Phillips, vice president of marketing at Virtium. But as big players such as Intel and Micron push the interface specification forward, Phillips said many industrial customers are approaching the company and asking about NVMe.

• Green Hills Software INTEGRITY-178 tuMP Multicore Operating System Selected by Commercial & Military Flight Critical Equipment Supplier for DO-178B Level A Certification on the Xilinx Zynq Ultrascale+ MPSoC
• Dolphin Integration sets up a large range of sponsored IPs at 55 nm to reduce SoC power consumption by up to 70%
• Imagination announces MIPSfpga 2.0: a comprehensive set of materials for teaching CPU architecture

Headlines for Friday Jul. 14, 2017

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Chuang Fei Xin Anti-Fuse One Time Programming Solution Qualified In Silterra High Voltage Technology

SilTerra Malaysia Sdn. Bhd., a Malaysian home grown leading semiconductor wafer foundry, and Zhuhai Chuangfeixin Technology Co., Ltd. ("CFX"), an memory IP design house, jointly announced the production release of Anti-Fuse One-Time-Programming (OTP) IP in SilTerra’s 160nm and 110nm High Voltage technology.

• GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks

Headlines for Thursday Jul. 13, 2017

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VeriSilicon's Vivante Vision Processor IP Enables ADAS for Mass Market

VeriSilicon today announced that Shenzhen Goke Semiconductor Co., Ltd (SGKS) has selected VeriSilicon Vivante GC7000UL-VX for the SGKS6802X Advanced Driver-Assistance Systems (ADAS) chip, part of SGKS’s ADAS product line used by automotive electronic components partners.

• TSMC Logs First 10nm Sales
• Mentor Accelerates Android Development for Xilinx Zynq UltraScale+ MPSoC
• Veriest Solutions and CEVA Collaborate for Neural Network Signal Processing IP Project
• Semi Content in Electronic Systems Forecast to Set New Record in 2017
• Imec Aims 2-D FETs at Sub-5-nm Node
• Suppliers Beware: The Perils of Vertical Integration
• TSMC Reports Second Quarter EPS of NT$2.56
• Faraday Unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD Controller

Headlines for Wednesday Jul. 12, 2017

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Arasan Announces IP solutions for the Next Generation of Mobile Storage - UFS 3.0

Arasan extends its long history of support for JEDEC and MIPI standards with the availability of UFS 3.0 controller IP, supporting a maximum throughput of 11.6 Gbps with M-PHY HS-Gear 4 2-lane operation, providing the highest data transfer rate with low power consumption for advanced mobile applications such as smartphone and tablets.

• NGCodec Joins the Alliance for Open Media
• 200mm Fabs Thriving; SEMI's Updated 200mm Fab Report Now Available

Headlines for Tuesday Jul. 11, 2017

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Rambus Reportedly Exploring Sale Possibilities

Memory technology licensor and chip vendor Rambus Inc. is working with a financial advisor to study options for its sale, according to a report by the Bloomberg news service.

• Nagoya University and Cadence Collaborate to Port AUTOSAR-Compliant TOPPERS Automotive Kernel to Tensilica Processors and DSPs
• Gartner Says Worldwide Semiconductor Revenue to Reach $400 Billion in 2017
• Uniquify Joins FDXcelerator Program to Deliver DDR Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform
• U.S. Paves Roads to Trusted Fabs
• STMicroelectronics Partners with Kilopass For One-Time Programmable Anti-Fuse NVM Memory
• GUC Opens New Korea Office

Headlines for Monday Jul. 10, 2017

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Apple hits back at Imagination's 'misleading' statements, disputes timeline

The war of words between Apple and Imagination Technologies seems to be escalating. A few days after Imagination’s annual report accused Apple of making ‘unsubstantiated allegations,’ the Cupertino company has hit back.

• TSMC June 2017 Revenue Report
• The fastest C-Compiler for i251 from Dolphin Integration is now available with our free discovery license!
• IP-Maker NVMe IP, ready for persistent memories
• UMC Reports Sales for June 2017

Headlines for Friday Jul. 07, 2017

• Graphcore's 'Colossus' chip due before end of year
• Faraday Monthly Consolidated Sales Report- June 2017

Headlines for Thursday Jul. 06, 2017

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Imagination fades in 2016 semiconductor IP market

ARM continued to dominate a semiconductor intellectual property (IP) market that grew strongly in 2016, but Imagination struggled as its restructuring during that year hurt sales, according to a report from IPnest. The strongest growth companies were Rambus and Ceva.

• Imagination Technologies -- Full Year Results 2017
• GUC Monthly Sales Report - June 2017
• Foresight announces sale of IoT technology business Simulity Labs Limited to ARM
• ESD Alliance Reports EDA Industry Revenue Increase For Q1 2017
• Cista Design Inc. Selects Kilopass OTP NVM for Next Generation CMOS Image Sensor on SMIC Independently Developed 130nm Back Side Illumination Technology Platform
• China Makes Two IoT Calls
• AppoTech Ltd. Selects Andes Technology Corporation N968A CPU For Its Next Generation Audio Codec
• Baidu Deploys Xilinx FPGAs in New Public Cloud Acceleration Services
• Spectra7 Microsystems Inc. Announces Closing of $4.6 Million Bought Deal Financing and First Tranche of Private Placement of $1.3 Million
• Micron Fab Incident Disrupts DRAM Supply

Headlines for Tuesday Jul. 04, 2017

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Global Semiconductor Sales Increase 22.6 Percent Year-to-Year in May

SIA today announced worldwide sales of semiconductors reached $31.9 billion for the month of May 2017, an increase of 22.6 percent compared to the May 2016 total of $26.0 billion and 1.9 percent more than the April 2017 total of $31.4 billion.

Headlines for Monday Jul. 03, 2017

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eVaderis Joins FDXcelerator Program to Deliver Memory IP to GLOBALFOUNDRIES 22FDX Technology Platform

eVaderis today announced that it has joined GLOBALFOUNDRIES' FDXcelerator™ Partner Program to provide scalable, advanced memory IP to be compatible with GF's 22FDX® technology. The advanced memory IP is expected to offer performance and energy saving advantages over competing memory solutions.

• Perceptia Devices Appoints Vector and SMC as its Korean Representatives
• ARM and Hyper Team to Bring Secure Container for IoT, Edge and 5G