D&R Headline News (August 2017)

Headlines for Thursday Aug. 31, 2017

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Siemens to Acquire TASS International, Adding Automated Driving Solutions to Portfolio

emens will acquire TASS International, a global provider of simulation software, plus engineering and test services aimed primarily at the automotive industry, and focused on autonomous driving, integrated safety, advanced driver assistance systems (ADAS), and tyre modeling.

• Mentor extends functional safety assurance program to key design, verification and analog/mixed signal products
• Socionext Partners with Advantech to Offer High-Density, Low-Cost Media Cloud Server Solutions
• Qualcomm and Himax Technologies Jointly Announce High Resolution 3D Depth Sensing Solution

Headlines for Wednesday Aug. 30, 2017

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S3 Semiconductors refocuses on design-to-delivery custom chip service for industrial applications

S3 Group has announced a change in strategy for its custom semiconductor business, S3 Semiconductors (S3semi). It will now focus on industrial and communications OEMs, converting their electronic systems and boards into mixed-signal integrated circuits and delivering packaged and tested chips, rather than just design services and IP.

• Faraday Launches Its New FPGA to ASIC Turnkey Service
• Samsung to Invest $7 Billion in China Fab

Headlines for Tuesday Aug. 29, 2017

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Kilopass Anti-Fuse NVM OTP IP Designed into Tire Pressure Sensor SoC Manufactured on TSMC 55LP Process Node Now Shipping in High Volume

The chip is being manufactured on the TSMC 55LP (low power) nm process node. Meeting the standards defined by Automotive Electronic Council AEC-Q100, the Kilopass OTP NVM provides program code storage for the TPS that is expected to increase demand as new applications beyond automotive adopt the technology.

• Lattice Semiconductor Further Expands CrossLink Applications with Modular IP Cores
• Synopsys Silicon-Proven DesignWare Bluetooth Low Energy Link Layer and PHY IP Achieve Bluetooth 5 Qualification
• Chief of Qualcomm's Licensing Business to Step Down
• Movidius Beefs up HW Acceleration in AI Chip
• Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications
• Inside Secure completes the acquisition of Meontrust and enters Security-as-a-Service market
• New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market

Headlines for Monday Aug. 28, 2017

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Silvaco Announces Completion of SoC Solutions Acquisition

Silvaco, Inc. today announced it has completed the acquisition of SoC Solutions, a privately held company providing semiconductor IP and services located in the greater Atlanta, Georgia area.

• Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box
• TowerJazz and Tacoma Announce a Partnership for a New 8-inch Fabrication Facility in Nanjing, China

Headlines for Thursday Aug. 24, 2017

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Sondrel Announces 10M GBP Investment in European Semiconductor Sector

Sondrel today announced its target to hire 100 electronic engineers in Europe, amounting to an investment of ten million pounds into the semiconductor sector over the next 3 years. This comes swiftly on the heels of the acquisition of the IMGWorks team from Imagination Technologies; a move that increased the engineering headcount of the company to over 250 in July of this year.

• Intel Delivers Real Time AI in Microsoft's New Accelerated Deep Learning Platform
• Everspin Appoints Semiconductor Storage Veteran Kevin Conley as CEO
• Cambricon employs Moortec's embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips
• North American Semiconductor Equipment Industry Posts July 2017 Billings

Headlines for Wednesday Aug. 23, 2017

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Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 7FF

Moortec Semiconductor, specialists in embedded in-chip sensing, are pleased to announce the availability of their easy to integrate, embedded monitoring subsystem on TSMC’s 7nm FinFET (FF) process.

• Semiconductor Industry Capital Spending Forecast to Jump 20% in 2017
• Brite Semiconductor partners with SaberTek, Inc. to develop low-cost transceiver chips for WiSUN and 802.11ah

Headlines for Tuesday Aug. 22, 2017

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Worldwide Semiconductor Market growth is expected to be up 17 percent in 2017 after 1.1 percent growth in 2016.

The Worldwide semiconductor market was up 1.1% in 2016 to US$338.9 billion, an alltime high. The year 2017 was forecasted on last year to be strong with 11.5% growth to US$378 billion.

• THINCI Inc. Will Present Its Next-Generation Graph Streaming Processor Architecture At the Hot Chips Symposium

Headlines for Monday Aug. 21, 2017

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Codasip Announces Latest RISC-V Processor

Codasip today announced the newest addition to their Berkelium (Bk) family of RISC-V processors. The Codasip Bk-1 processor is an FSM processor targeted at the Internet of Things (IoT) by offering ultra-low power, the lowest cost of all comparable embedded processors, and optimal performance/power efficiency.

• Pinnacle Imaging Systems Launches Denali-MC HDR Image Signal Processor IP Core
• Qualcomm Details ARM Server SoCs
• MediaTek selects MIPS for LTE modems
• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC OIP Ecosystem Forum in Santa Clara
• SiFive and Rambus to Provide IP to the 'DesignShare' Economy

Headlines for Thursday Aug. 17, 2017

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Synopsys Posts Financial Results for Third Quarter Fiscal Year 2017

Synopsys, Inc. (Nasdaq: SNPS) today reported results for its third quarter of fiscal year 2017. Synopsys reported revenue of $695.4 million, compared to $615.2 million for the third quarter of fiscal year 2016, an increase of 13.0 percent.

Headlines for Wednesday Aug. 16, 2017

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Sankalp Semiconductor awarded with ISO 9001: 2015 certification

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions, today announced its upgradation to ISO 9001:2015 certification. By meeting the extensive criteria for the ISO 9001: 2015 standards, the company reinforces its ability to deliver IC design services with continuous improvements in its offerings and customer delivery processes.

• DRAM, NAND Flash, Automotive Analog/Logic Among Best-Growing ICs
• SiFive Appoints Naveed Sherwani as CEO
• Uniquify Announces Silicon Success for Latest Timing Controller (T-CON) for DTV
• Achronix to Attend HOT CHIPS: A Symposium on High Performance Chips

Headlines for Monday Aug. 14, 2017

• Two Senior-Level Appointments Boost EnSilica's Rapidly Expanding SoC Design and Supply Services

Headlines for Thursday Aug. 10, 2017

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EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal

EnSilica, a leading independent provider of semiconductor solutions and IP, and Solomon Systech, a leading provider of touch and display ICs and system solutions, have entered into a multi-year licensing agreement for EnSilica’s range of highly-configurable, high-performance, and low-power eSi-RISC processor IP.

• TSMC July 2017 Revenue Report

Headlines for Wednesday Aug. 09, 2017

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Mie Fujitsu and SST Announce Automotive Platform Development on 40 nm Technology

Mie Fujitsu Semiconductor Limited (MIFS), a Japanese pure-play foundry company, and Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, today announced their plans to develop an automotive platform on 40 nm technology using SuperFlash® memory technology licensed by SST

• GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications
• IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND
• UMC Reports Sales for July 2017
• DENSO licenses Imagination's newest MIPS CPU and PowerVR GPU to drive enhanced in-vehicle electronic processing
• USITC Institutes Section 337 Investigation of Certain Mobile Electronic Devices and Radio Frequency and Processing Components Thereof

Headlines for Tuesday Aug. 08, 2017

• Synopsys and Morpho Collaborate to Accelerate Deep Learning Processing for Embedded Vision Applications

Headlines for Monday Aug. 07, 2017

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PLDA Announces vDMA, a Highly Efficient Many-Channel DMA Engine Engineered for Virtualized Systems in Data Centers, to be demonstrated at Flash Memory Summit 2017

PLDA, the industry leader in PCI Express® interface IP solutions, today announced their vDMA™ IP Core, a highly efficient many-channel DMA engine specifically engineered for SoCs that power tomorrow’s virtualized data centers.

• Cadence Full-Flow Digital and Signoff and Verification Suite Optimized to Support Arm Cortex-A75 and Cortex-A55 CPUs and Arm Mali-G72 GPU
• Everspin Announces Sampling of the World's First 1-Gigabit MRAM Product
• Faraday Monthly Consolidated Sales Report - July 2017

Headlines for Friday Aug. 04, 2017

• Palma Ceia Announces Complete PHY Solution for HaLow 802.11ah, Supporting IoT WiFi Connectivity
• Mobiveil Announces FPGA-Based SSD Platform for 3D NAND Flash Devices, Upgrades NVMe, PCI Express Controllers to Support Latest Specifications

Headlines for Thursday Aug. 03, 2017

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Avery Design Systems Announces NVMe 1.3 and NVMe-MI Verification IP Updates

Avery Design Systems Inc., an innovator in functional verification productivity solutions, today announced availability of updates to its NVMe VIP supporting NVMe 1.3 and support for new NVMe-Management Interface (NVMe-MI) over PCIe 4.0 or SMBus 3.0.

• GLOBALFOUNDRIES, Silicon Mobility Deliver the Industry's First Automotive FPCU to Boost Performance for Hybrid and Electric Vehicles
• CEVA, Inc. Announces Second Quarter 2017 Financial Results
• Global Unichip Achieves SGS-TUV ISO26262 Certification
• Significant Mid-Year Revision to 2017 IC Market Forecast
• Artificial Machines Standardizes on Mentor EDA Design Solutions to Develop Smart Machine IP
• Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017

Headlines for Wednesday Aug. 02, 2017

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Epostar Chooses PLDA's PCIe Controller for their Next-Generation NVMe-based SSD Controller

PLDA®, the industry leader in PCI Express® interface IP solutions today announced that EpoStar®, the industry expert in NVMe applications, has created a platform combining PLDA’s PCIe XpressRICH3-AXI™ IP controller with EpoStar’s leading NVMe IP into a high-performance SSD controller designed for enterprise and client SSD applications.

• UltraSoC delivers industry's first debug and analytics solution for ARM's AMBA 5 CHI Issue B coherency architecture
• Vidatronic Contributes Expertise to AMD's Latest High-Performance Processors

Headlines for Tuesday Aug. 01, 2017

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Synopsys Interface IP Portfolio on 16-nm FinFET Process Meets Stringent Automotive AEC-Q100 Grade 1 Temperature Requirements

Synopsys, Inc. (Nasdaq: SNPS) today announced that its 16-nm FinFET DesignWare® Interface IP for LPDDR4 multiPHY, MIPI D-PHY and Multi-Protocol 10G PHY supporting PCI Express 3.1 and Ethernet have met the AEC-Q100 Grade 1 temperature requirements.

• Moortec Semiconductor announces new sales representatives in Japan