D&R Headline News (November 2017)

Headlines for Thursday Nov. 30, 2017

Top Story

Synopsys Delivers a Complete HDMI 2.1 IP Solution with HDCP 2.2 Content Protection

Synopsys, Inc. (Nasdaq:SNPS), today announced its complete DesignWare® HDMI 2.1 IP solution with High-Bandwidth Digital Content Protection (HDCP) 2.2 consisting of controllers, PHYs, verification IP, IP Prototyping Kit, and IP Subsystem as well as Linux software drivers.

• Semiconductor Industry Continues Upward Trend Toward Record Year, IHS Markit Says
• MIPI Alliance Releases MIPI CCS, a New Specification that Streamlines Integration of Image Sensors in Mobile Devices
• With its Modular Switch and End-System IP Technology combining both AFDX and PTP protocols SILKAN hits its target
• Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2017
• Inside Secure delivers strong customer authentication for Visma Solutions
• RISC-V Processor Developer Suite Announced by Imperas

Headlines for Wednesday Nov. 29, 2017

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RISC-V Spins into Drives, AI

Storage giant Western Digital announced that it will standardize on RISC-V processors and has invested in Esperanto Technologies, a startup designing high-end SoCs and cores using the open-source instruction set architecture.

• Lattice will migrate products to FDSOI
• Intrinsic ID Names Alpesh Saraiya as Senior Director Product Management
• Samsung Starts Mass Production of Its 2nd Generation 10nm FinFET Process Technology
• Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning, based on the open RISC-V standard
• Western Digital To Accelerate The Future Of Next-Generation Computing Architectures For Big Data And Fast Data Environments
• SiFive Joins FDXcelerator Program to Bring RISC-V Core IP to GLOBALFOUNDRIES' 22FDX Process Technology
• Cadence Announces Availability of Industry's First PCI Express 5.0 Verification IP

Headlines for Tuesday Nov. 28, 2017

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Codasip Announces Bk5-64, a New 64-bit RISC-V Processor

Codasip today announced that it has expanded its Berkelium processor portfolio to include the Bk5-64, its first implementation of the 64-bit RISC-V ISA.

• Minima Processor Reduces SoC Energy Consumption for Near-Threshold Voltage Design
• Amazon Web Services Names Intrinsic ID Advanced Tier Technology Partner in AWS Partner Network
• HDMI Forum Releases Version 2.1 of the HDMI Specification
• Inside Secure Selected by Neopost to Protect Online Postage Transactions
• Titan IC launches "Hyperion F1 10G RegEx File Scan" on AWS Marketplace
• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Grenoble 2017
• SiFive and Microsemi Expand Relationship with Strategic Roadmap Alignment and a Linux-Capable, RISC-V Development Board

Headlines for Monday Nov. 27, 2017

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Flex Logix Co-Founder Cheng Wang Awarded Three FPGA Interconnect Patents

Flex Logix Technologies announced today that three interconnect patents have been issued to Cheng Wang, co-founder of Flex Logix. These patents highlight the breakthrough interconnect technology that enables Flex Logix to design eFPGA in a new process node in ~six months and achieve high densities similar to FPGA chips.

• Intrinsix Cryptographic IP Selected by DARPA for Use in Chips Program, Featuring RISC-V Security Processor
• TTTech collaborates with Intel to develop FPGA-based TSN solution for Industrial Automation
• EnSilica's RADAR Imaging Co-processor addresses problem of automotive data overload to accelerate development of self-drive cars
• Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
• Digital Blocks DB9000 Display Controller & Processor IP Core Family Extends Leadership Across Medical, Industrial, Aerospace, Automotive, Communications, Computer, Monitor, Consumer, IoT, AR/VR Headsets, Wearables, Signage, and Cinema Applications

Headlines for Saturday Nov. 25, 2017

• Global Unichip Achieves Critical ISO 13485:2016 Certification for Medical Device Components

Headlines for Thursday Nov. 23, 2017

• GUC Announces Nanjing Office Opening

Headlines for Wednesday Nov. 22, 2017

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Analyst Warns on Semiconductor Stock Valuations

The market capitalization of publicly-traded semiconductor companies has risen dramatically over the past three years, driven largely by a frenzy of merger and acquisition activity and the performance of the chip market as a whole, according to International Business Strategies (IBS).

• Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost
• North American Semiconductor Equipment Industry Posts October 2017 Billings
• Cybertrust Japan Selects CryptoManager IoT Security Service from Rambus

Headlines for Tuesday Nov. 21, 2017

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Siemens strengthens IC market commitment with acquisition of Solido Design Automation

Siemens has entered into an agreement to acquire Saskatoon, Canada-based Solido Design Automation Inc., a leading provider of variation-aware design and characterization software to semiconductor companies worldwide.

• Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications
• Overall GPU shipments increased 9.3% from last quarter, AMD increased 8% Nvidia increased 30%
• Nano Global, Arm Collaborate on Artificial Intelligence Chip to Drive Health Revolution by Capturing and Analyzing Molecular Data in Real Time

Headlines for Monday Nov. 20, 2017

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Marvell and Cavium to Combine Creating an Infrastructure Solutions Powerhouse

Marvell Technology and Cavium today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Marvell will acquire all outstanding shares of Cavium common stock in exchange for consideration of $40.00 per share in cash and 2.1757 Marvell common shares for each Cavium share.

• iPhone X's TrueDepth Module Dissected
• Argonne to install Comanche system to explore ARM technology for high-performance computing
• Synapse Design Acquires Tech Vulcan to Address Fast Growth and Provide Increased Customer Access to Design Centers
• Andes Announces Advanced SoC Development Environments for V5 AndesCore N25 and NX25 Processors with Tool Partners
• AI to Spur Uptick in ASIC Design Starts
• Cadence Appoints Anirudh Devgan as President
• Huawei Unveils Xilinx FPGA-Powered Cloud Server to North America at SC17
• Sankalp Semiconductor receives STPI Highest Exporter award
• Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017
• Andes and Imperas Partner to Deliver Models and Virtual Platforms for Andes RISC-V Cores
• Embedded Tools provider Ashling joins RISC-V Foundation

Headlines for Friday Nov. 17, 2017

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Truechip and Uniquify Achieve Sign-off Verification of DDR Interface IP

Truechip, the Verification IP (VIP) specialist and Uniquify, a leading system-on-chip (SoC) fabless manufacturer and DDR memory system IP provider, today announced sign-off verification success for Uniquify’s DDR interface IP using Truechip VIP technology.

• Qualcomm Extends Cash Tender Offer for All Outstanding Shares of NXP

Headlines for Thursday Nov. 16, 2017

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Barco Silex VC-2 HQ compression cores at the heart of IMAGENICS 4K HDMI-over-coax extender

Barco Silex, the leading provider of IP cores for the audiovisual industry, announces that IMAGENICS, a major manufacturer of high-quality professional A/V products, has licensed its VC-2 HQ cores for video compression. The cores have been integrated in HDMI 2.0 transmitter and receiver modules and are instrumental in allowing the long-range transmission of 4K video over coax cabling with visually lossless quality and minimal latency.

• Enyx Premieres the First TCP and UDP Offload Engines for Intel Stratix 10 FPGA On REFLEX CES XpressGXS10-FH200G Board
• Faraday Unveils M1+ Library with Enhanced Routability on UMC 28HPC Process
• Global Unichip Successfully Tapes Out 16nm TCAM Compiler

Headlines for Wednesday Nov. 15, 2017

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Kilopass Achieves 1000-Hour Qualification on Mie Fujitsu Semiconductor Highly Demanded 40nm Low Power Process

Kilopass Technology today announced that it successfully achieved 1000-hour qualification and characterization on the 40nm Low Power Process of Mie Fujitsu Semiconductor, a Japan-based pure-play foundry company.

• GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions
• Inuitive Adopts Synopsys' Embedded Vision Processor IP to Accelerate Computer Vision and Deep Learning Algorithms
• Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC
• SMIC Reports 2017 Third Quarter Results
• Will Samsung's 2017 Semi Capex Deliver Knockout Blow to Competition?
• GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
• PA Semi, Apple "Interconnect" at Startup
• Inside Secure Unveils Industry's First Root-of-Trust Solution based on RISC-V Processor
• Inside Secure Joins RISC-V Foundation
• VESA Rolls Out DisplayID Version 2.0 Standard to Optimize Plug-and-Play Connectivity for Leading-Edge Displays
• Andes Technology N9 CPU Designed in Customer's SoC Shipping in Home Smart Speaker Artificial Intelligence Device

Headlines for Tuesday Nov. 14, 2017

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UltraSoC selected by Microsemi for growing RISC-V product range

UltraSoC today announced that Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, has licensed UltraSoC’s universal analytics and embedded intelligence platform for use in an expanding range of Microsemi products based on the RISC-V open source processor architecture.

• Analog Bits to Provide Precision PLL and SERDES IP to DesignShare for SiFive Freedom Platform
• ArterisIP Drives Artificial Intelligence & Machine Learning Innovation for 15 Chip Companies
• Socionext Starts Offering Graphics IP "SEERIS"
• S3 Semiconductors Expands Sales Rep Network
• Rambus Selects Codasip Studio for SDK Development of RISC-V Processor
• Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
• Broad/Qual/NXP Battle Begins
• Sequoia backs Graphcore as the future of Artificial Intelligence processors
• SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard
• Spin Transfer Technologies Announces Allowance of U.S. Patent For Next-Gen MRAM

Headlines for Monday Nov. 13, 2017

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Open-Silicon Expands Networking IP Portfolio to Address High-Bandwidth Ethernet Endpoint and Ethernet Transport Applications

Open-Silicon today announced the availability of a comprehensive IP subsystem targeted at high-bandwidth networking applications. The subsystem expands on Open-Silicon’s existing high speed chip-to-chip Interlaken interface IP to include Ethernet Physical Coding Sublayer (PCS), Flex Ethernet (FlexE) and multi-channel multi-rate Forward Error Correction (FEC) IPs targeted for Ethernet endpoint and Ethernet transport applications.

• Announcing the Opening of the Global Unichip Corporation Tainan Office
• Synopsys and CEA Announce Partnership to Develop Emulation Solutions for Automotive Applications

Headlines for Friday Nov. 10, 2017

• UMC Reports Sales for October 2017
• TSMC October 2017 Revenue Report

Headlines for Thursday Nov. 09, 2017

Top Story

iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals

Teardown engineers at IHS Markit (Nasdaq: INFO) have completed their preliminary physical dissection of the new Apple iPhone X and found that the US version of the smartphone with 64 gigabytes (GB) of NAND memory carries a bill of materials (BOM) of $370.25. The iPhone X was purchased from Verizon, where the phone retails for $999.

• Barco Silex Partners with Intrinsic ID for North American Representation
• Power Efficient Implementation of CommSolid's CSN130 NB-IoT IP Solution Supported by Zephyr RTOS
• Growth in automotive brings videantis third Deloitte Technology Fast 50 award
• Qualcomm Datacenter Technologies Announces Commercial Shipment of Qualcomm Centriq 2400 - The World's First 10nm Server Processor and Highest Performance Arm-based Server Processor Family Ever Designed
• EasyIC announces it is now a member of the Xilinx Alliance Program

Headlines for Wednesday Nov. 08, 2017

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Codasip and Avery Partner to Improve Regression Test Methodology of RISC-V Processors

Codasip, the leading supplier of RISC-V® embedded CPU cores, today announced its partnership with Avery Design Systems, the provider of cutting-edge verification intellectual property (VIP) solutions for SoC and IP companies.

• Spectral Edge appoints new CTO, accelerating development of smartphone imaging technology
• AMD Delivers Semi-Custom Graphics Chip For New Intel Processor
• Veriest announces expansion in Europe and opens new offices in Serbia
• RISC-V Ecosystem Surpasses 100 Members Globally, Paving the Way for the Next 50 Years of Computing Design and Innovation
• Lattice Semiconductor Reports Third Quarter 2017 Results
• Third Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; another Quarterly Record
• Faraday Monthly Consolidated Sales Report - October 2017
• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ICCAD in Beijing

Headlines for Tuesday Nov. 07, 2017

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Inside Secure acquires SypherMedia to boost its Silicon IP business and root-of-trust offering

Inside Secure today announced that it has acquired SypherMedia, a California-based leading security solutions and services provider, for up to US$10 million, including a potential earn-out of up to US$3 million.

• SiFive and eMemory Bring Embedded Memory to the DesignShare Economy to Accelerate Development of RISC-V Silicon
• Intellifusion Licenses ArterisIP FlexNoC Interconnect IP for Machine Learning and Visual Intelligence Systems-on-Chip
• MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications
• True Circuits Signs Five Year PLL License with Tsinghua University in China
• True Circuits Attends the TSMC 2017 China OIP Ecosystem Forum

Headlines for Monday Nov. 06, 2017

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Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion

Broadcom today announced a proposal to acquire all of the outstanding shares of Qualcomm Incorporated (NASDAQ: QCOM) ("Qualcomm") for per share consideration of $70.00 in cash and stock.

• Crypto Bugs in IEEE Standard Expose Intellectual Property in Plaintext
• HiSilicon Selects Cadence Tensilica Vision P6 DSP for its Latest Kirin 970 Mobile Application Processor
• Broadcom, Qualcomm Groked
• GUC Monthly Sales Report - Oct 2017
• Flex Logix Names Fan Mo Technical Director Of FPGA CAD Software Development

Headlines for Friday Nov. 03, 2017

• Synopsys to Enhance Software Integrity Platform with Acquisition of Black Duck Software
• Xilinx Announces Intention to Invest $40M in Expansion of Research, Development, and Engineering Operations at EMEA Headquarters in Ireland

Headlines for Thursday Nov. 02, 2017

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Cadence to Expand High-Speed Communications IP Portfolio with Acquisition of nusemi inc

Cadence today announced that it has acquired nusemi inc, a company focused on the development of ultra-high-speed Serializer/Deserializer (SerDes) communications IP.

• Architectures Battle for Deep Learning
• China FPGA strategy takes shape
• Hardent Delivers Interoperable VESA DSC IP Solution for the New Arm Mali-D71 Processor
• Faraday Reports EPS NT$0.50 for Third Quarter 2017
• Mercury Systems Announces Safety Certifiable Graphics for Xilinx Zynq UltraScale+ MPSoC
• Xilinx Announces Appointment of Two New Directors
• UltraSoC embedded analytics selected by ELVEES for video, security and safety applications across ARM and MIPS platforms
• Synopsys Accelerates FIPS 140-2 Certification with NIST-Validated Cryptography IP Software Library
• CEVA, Inc. Announces Third Quarter 2017 Financial Results
• Cadence Joules RTL Power Solution Enables Socionext to Accelerate Low-Power HEVC 4K/60p Video Codec Chip Development
• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem Forum in Shenzhen
• Asic Land Co. Ltd Licenses Andes Technology Corp. N1337 with Single-Precision Floating-Point Unit for Voice Recognition Application
• FADU Completes Verification of next generation NVMe eSSD using S2C's Prodigy Virtex UltraScale Prototyping Platform