D&R Headline News (January 2018)

Headlines for Wednesday Jan. 31, 2018

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Silex Inside releases JPEG 2000 AV over IP OEM boards

Silex Inside, formerly known as Barco Silex, a leading provider of AV over IP solutions, has extended its family of Audio/Video over IP OEM boards to include JPEG 2000 encoding and decoding.

• Synopsys Announces Verification IP and Test Suite for Arm AMBA ACE5 and AXI5
• Movellus Announces "True Digital" PLL, DLL, & LDO Generators
• Movellus Launches with Focus on Advancing Digital Design Tools to Implement Analog Functionality
• New Silicon Device Solutions from Omnitek
• JEDEC Publishes Universal Flash Storage (UFS & UFSHCI) Version 3.0 and UFS Card Extension Version 1.1
• Credo Demonstrates Robust 112G PAM4 Single Lane Electrical SerDes Techology at DesignCon 2018

Headlines for Tuesday Jan. 30, 2018

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Arteris IP and Synopsys Accelerate the Optimization of Heterogeneous Multicore Neural Network Systems-on-Chip

Arteris IP today announced the integration of its Ncore Cache Coherent IP with the Synopsys® Platform Architect™ virtual prototyping solution to provide designers of neural network and autonomous driving SoCs with the ability to analyze system-level performance and power consumption earlier in the design cycle for their next-generation multicore architectures.

• Horizon Robotics Licenses NetSpeed Interconnect IP for AI SoCs
• Custom Silicon Veteran Joins SiFive Executive Team

Headlines for Monday Jan. 29, 2018

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Synopsys' New ARC HS Development Kit Accelerates Software Development for ARC-based Systems

The ARC HS Development Kit is a ready-to-use software development platform that includes access to the embARC open source software packages on the embARC website, enabling designers to start software development prior to SoC availability.

• Xylon announces Motion JPEG Encoder
• China Foundry Seeks Shared Model
• Icron's Powerful Maverick KVM Extension Platform to be showcased by intoPIX at ISE 2018 Show in Amsterdam
• Microsemi Reportedly Mulls Sale
• SoC-e IP Cores support new Xilinx UltraScale+ devices

Headlines for Thursday Jan. 25, 2018

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Samsung Strengthens its Foundry Customer Support with New SAFE Foundry Ecosystem Program

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFETM) program.

• Rambus and Marvell Sign Patent License Agreement
• UltraSoC delivers industry's first RISC-V processor trace IP
• Gartner Says Samsung and Apple Extended Their Lead as Top Global Semiconductor Customers in 2017
• UMC Slashes Capex
• Xilinx Reports Record Revenues; Ninth Consecutive Quarter Of Revenue Growth
• Semiconductor Shipments Forecast to Exceed 1 Trillion Devices in 2018
• Imagination Announces Neural Network SDK
• Arasan Chip Systems Announces Immediate Availability of MIPI I3C HDK
• Startup Claims AI Design Wins

Headlines for Wednesday Jan. 24, 2018

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Andes Processors Are Not Susceptible to Meltdown and Spectre Attacks

Recent reports on two security vulnerabilities for processors spanning multiple instruction set architectures have brought the security of processor hardware to high attention worldwide. Andes announced today, after its thorough review, none of its processors are affected by either Meltdown or Spectre flaws.

• GLOBALFOUNDRIES Delivering 45nm RF SOI Customer Prototypes for 5G Applications
• SoC-e Announces New Release of Managed Ethernet Switch (MES) IP Core Supporting DLR for Ethernet/IP
• UMC Expects AI to Grow to $3 Billion Business
• North American Semiconductor Equipment Industry Posts December 2017 Billings
• Imagination announces hardware virtualized GPU core to meet automotive needs for cluster, HUD and infotainment

Headlines for Tuesday Jan. 23, 2018

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Eta Compute Secures $8 Million Series A Financing to Accelerate Development of the 3rd Generation of Neural Networks

Eta Compute today announced it has completed an $8 million Series A round of financing. The oversubscribed series was led by Walden International with additional participation from Acorn Pacific Ventures and Walden Riverwood Ventures.

• Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
• Synopsys DFTMAX LogicBIST Deployed by Renesas for In-System Automotive Test
• AI Silicon Preps for 2018 Debuts
• Codasip Announces Studio 7, Design and Productivity Tools for Rapid Generation of RISC-V Processors
• TIRIAS Research Publishes White Paper on ASIC Market

Headlines for Monday Jan. 22, 2018

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Starblaze Reaches Volume Production with Moortec's Temperature Sensor in their SSD Controller SoC

Moortec today announced that Starblaze Technology have employed Moortec’s 28nm Temperature Sensor IP in their STAR1000 high-end consumer and starter enterprise SSD controller which has recently reached volume production.

• SiFive Welcomes Former Intel Corporate VP to Executive Team
• TSMC Sees HPC Driving Business
• Israeli Semiconductor Consortium Licenses Flex Logix's Embedded FPGA Technology
• GUC Announces 20th Anniversary
• Inside Secure Protects New Interactive Video Application Developed by PodOp and HBO
• Thalia expands with new analog design engineering facility

Headlines for Friday Jan. 19, 2018

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Value of Semiconductor Industry M&A Deals Slows Dramatically in 2017

The historic flood of merger and acquisition agreements that swept through the semiconductor industry in 2015 and 2016 slowed significantly in 2017, but the total value of M&A deals reached in the year was still more than twice the annual average in the first half of this decade.

Headlines for Thursday Jan. 18, 2018

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Amphion Semiconductor releases enhanced 'Malone' video decoder IP for SoC implementation

Amphion today announced the release of the latest version of its highly successful, ‘Malone’ video decoder IP core optimized for SoC implementation. Architectural optimizations have enabled Amphion’s video SoC experts to realize further reductions in the size of the core area while maintaining the performance necessary to support the latest resolution and frame rate demands.

• MIPS Is Back, With An Eye on AI
• EUV, 7nm Road Maps Detailed
• TSMC Reports Fourth Quarter EPS of NT$3.83

Headlines for Wednesday Jan. 17, 2018

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Achronix Completes Production Silicon Validation of 16nm FinFET+ Speedcore eFPGA Technology

Achronix announced today that it completed full silicon verification of its Speedcore™ eFPGA production validation chip built on TSMC 16nm FinFET+ process technology.

• ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices
• Arteris IP Announces 8 New Licensees, 2 New Products in 2017
• VSORA Closes Series A Financing with Investment from Omnes Capital, Partech Ventures, Angel Investors
• Intrinsix and Silicon Catalyst Add Semiconductor Design and IP Access to Rapidly Expanding Semiconductor Startup Ecosystem
• Everspin Begins 40nm STT-MRAM Volume Production

Headlines for Tuesday Jan. 16, 2018

• Open-Silicon Receives TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper

Headlines for Monday Jan. 15, 2018

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Moortec announce their Embedded In-Chip Monitoring Subsystem on TSMC 12FFC

Moortec, specialist in embedded in-chip sensing, is pleased to announce the availability of their easy to integrate, high accuracy, embedded monitoring subsystem on TSMC’s 12nm FinFET Compact process technology (FFC).

• ESD Alliance Reports EDA Industry Revenue Increase For Q3 2017
• Xilinx Announces Availability of Automotive Qualified Zynq UltraScale+ MPSoC Family
• Gartner Says Worldwide Semiconductor Revenue Forecast to Grow 7.5 Percent in 2018
• Vidatronic Continues Expansion with New Office in Austin, Texas

Headlines for Friday Jan. 12, 2018

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Barco Silex leaves Barco and becomes Silex Inside

Barco Silex, a leading provider of Security and Video IP cores, has entered into an agreement with a group of private investors acquiring all shares of Barco Silex.

• Mentor Nucleus RTOS extends system reliability for Arm Cortex v8-A 64-bit processors on multicore SoCs
• Analog IC Market Forecast With Strongest Annual Growth Through 2022
• UMC Files Patent Infringement Lawsuit against Micron

Headlines for Thursday Jan. 11, 2018

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Synopsys Expands DesignWare IP Portfolio with Acquisition of Kilopass Technology

Synopsys today announced that it has acquired Kilopass Technology, Inc., a leading provider of antifuse one-time programmable (OTP) non-volatile memory (NVM) IP used in automotive, mobile, industrial, and Internet of Things (IoT) applications.

• Racyics takes FDSOI down to 0.4V

Headlines for Wednesday Jan. 10, 2018

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MIPS Returns to Silicon Valley To Drive Next Generation of Intelligent Applications

MIPS, provider of the widely used MIPS processor architecture and IP cores, announced it has returned to Silicon Valley as an independent company focused on processor innovations for a new generation of intelligent, connected platforms.

• TSMC December 2017 Revenue Report
• Global SoC Design Service Provider, Incise announces the appointment of T2M for global marketing, representation & business development

Headlines for Tuesday Jan. 09, 2018

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videantis introduces new processor and tools for deep learning

videantis today announced its new v-MP6000UDX visual processing architecture and v-CNNDesigner tool. The new processor increases deep learning algorithm performance by up to three orders of magnitude, while maintaining software compatibility with the already very powerful and successful v-MP4000HDX architecture.

• Memory differences remain as ST chooses Globalfoundries for FDSOI
• STMicroelectronics Selects GLOBALFOUNDRIES 22FDX to Extend Its FD-SOI Platform and Technology Leadership
• eSilicon announces 7nm FinFET ASIC design win
• Arteris IP FlexNoC Interconnect Licensed by Nationz Technologies for Ultra-Low Power Security IoT Chips
• Microsemi and Future Electronics Announce Avalanche Board for Designing with Microsemi's PolarFire FPGAs
• NVM Express Set for Busy 2018
• UMC Reports Sales for December 2017
• BaySand expands its "Programmable-In-ASIC" initiative with Efinix Quantum programmable accelerator technology
• IFI CLAIMS Announces 2017 Top U.S. Patent Recipients

Headlines for Monday Jan. 08, 2018

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CEVA Introduces ClearVox - Advanced Software Package Providing Enhanced Speech Intelligibility for Voice-Enabled Devices

CEVA today introduced ClearVox, a new software suite of advanced voice input processing algorithms aimed at enhancing speech intelligibility and voice clarity for voice-enabled devices. ClearVox is licensed exclusively for the CEVA-TeakLite-4 and CEVA-X2 audio/voice DSPs.

• Cadence Tensilica HiFi Audio DSP is the First DSP IP Core to Support Dolby Atmos for PCs
• Flex Logix Names Valy Ossman Technical Director, Solutions Architecture
• Dolphin Integration paves the way for the next generation of Digital microphones "CoolMic"
• Moortec Opens New European Design Centre in Poland
• Faraday Monthly Consolidated Sales Report - December 2017
• Sankalp Semiconductor expands internationally with its operations in Malaysia
• Wi-Fi Alliance introduces security enhancements
• GUC Monthly Sales Report - Dec 2017

Headlines for Friday Jan. 05, 2018

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CEVA Unveils NeuPro - A Family of AI Processors for Deep Learning at the Edge

CEVA today unveiled NeuPro™, a powerful and specialized Artificial Intelligence (AI) processor family for deep learning inference at the edge. The NeuPro family of processors is designed for smart and connected edge device vendors looking for a streamlined way to quickly take advantage of the significant possibilities that deep neural network technologies offer.

• Fabless IC Company Sales Top $100 Billion for First Time Ever
• WiLAN Reaches IP Framework Agreement with TSMC
• Xilinx Appoints Victor Peng As President And Chief Executive Officer
• Xilinx CEO Moshe Gavrielov Announces Retirement

Headlines for Thursday Jan. 04, 2018

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Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification

Hardent today announced plans to support HDMI controller manufacturers with adopting the new HDMI 2.1 specification Hardent’s portfolio of VESA Display Stream Compression (DSC) and Reed-Solomon Forward Error Correction (FEC) IP cores will accelerate product development time and enable companies to take advantage of key new features of HDMI 2.1 to develop next-generation displays.

• UltraSoC appoints Aileen Smith as Chief Strategy Officer
• MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest USB Type-C Connectors
• AImotive, Leading Provider of Camera-First Autonomous Driving Technology, Raises $38 Million USD Series C
• Gartner Says Worldwide Semiconductor Revenue Grew 22.2 Percent in 2017; Samsung Takes Over No. 1 Position

Headlines for Wednesday Jan. 03, 2018

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CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester

CEVA today announced that it has completed qualification testing of its Bluetooth 5 Low Energy (LE) IP, including all the new optional Bluetooth 5 features using the recognized Ellisys Bluetooth Qualifier (EBQ™) Compliance Tester.

• NGCodec Closes $8M Series A, Launches Live Broadcast H.265/HEVC Cloud Video Encoding and Demonstrates Cloud VR
• Global Semiconductor Sales Increase 21.5 Percent Year-to-Year in November

Headlines for Tuesday Jan. 02, 2018

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Arrow Accelerates IoT Leadership Position with eInfochips Acquisition

Arrow Electronics, Inc. (NYSE:ARW) announced today that it has signed a definitive agreement to acquire eInfochips, one of the world’s largest design and managed services companies.

• DSP Group, Emza and Himax Announce Industry's First AI based Human Presence IoT Visual Sensor for Consumer Appliances and Industrial Applications
• Faraday Signs Satris Group as Its Israeli Distributor
• eVaderis Completes Tape-Out of Innovative MRAM-Based, Memory-Centric MCU Demonstrator for Next-Generation IoT Applications