D&R Headline News (February 2018)

Headlines for Wednesday Feb. 28, 2018

Top Story

GOWIN Semiconductor selects PLDA XpressRICH3 Controller IP as the PCIe interface block in their FPGA product line

PLDA®, the industry leader in PCI Express® interface IP solutions, today announced that GOWIN Semiconductor, a leading semiconductor company in China, has chosen PLDA’s PCIe ASIC IP for their upcoming FPGA product line. GOWIN offers a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits.

• Imec and Cadence Tape Out Industry's First 3nm Test Chip
• GreenWaves Technologies Unveils GAP8, the Industry's Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge
• S3 Semiconductors joins Arm Approved design partner program
• Trinamic Licenses Codasip's Bk3 RISC-V Processor for Next Generation Motion Control Applications

Headlines for Tuesday Feb. 27, 2018

Top Story

Neural Network Inference Engine IP Core Delivers >10 TeraOPS per Watt

VeriSilicon Expands Leadership in Deep Neural Network Processing with Breakthrough NN Compression Technology VIP8000 NN Processor Scaling from 0.5 to 72 TeraOPS

• Truechip Announces First Customer Shipment of PCIe Gen 5 and JESD204C Verification IP
• Northwest Logic's Expresso 4.0 Controller Core and Fidus Systems' Zynq UltraScale+ Platform demonstrates PCIe 4.0 Support
• GLOBALFOUNDRIES Strengthens 22FDX eMRAM Platform with eVaderis' Ultra-low Power MCU Reference Design
• AccelerComm and Achronix Enable Fast Time to Market with 5G Polar Code for Speedcore eFPGAs
• Flex Logix Co-Founder Cheng Wang Awarded Interconnect Patent For Tiling of eFPGA Cores to Create Wide Range of Larger eFPGA Arrays
• Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development
• Maxim's Dynamic Speaker Management Technology Running on the CEVA-TeakLite-4 Ultra-Low-Power DSP Provides the Ultimate Sound Experience from Micro Speakers
• Nuance Voice Activation Technology Now Available for CEVA-TeakLite Family, World's Lowest Power Audio/Voice DSPs
• Single-Chip Custom Solutions for the IoT Edge
• Sonics Partners With Inomize To Enable Automotive Chip Design For ISO 26262 Standard
• OPENAIRINTERFACE software stack powering 5G use-cases exhibited at Mobile World Congress Barcelona
• Ashling and Imperas Partner to Extend the RISC-V Ecosystem
• RISC-V RV64GC High-Performance Extendable Platform Kit For Fast Linux Execution Released by Imperas

Headlines for Monday Feb. 26, 2018

Top Story

Goodix Announces Entry into the Growing NB-IoT Market with Its Acquisition of German-Based CommSolid

Goodix Technology, a world leader in biometric & human interface technologies announces its acquisition of CommSolid - the technology leader in the Cellular IP market.

• GEO Semiconductor Selects Cadence Tensilica Vision P5 DSP for Their Most Advanced Automotive Smart Viewing Camera Processor
• Qualcomm Taps Samsung's 7nm EUV for 5G
• Lattice Releases Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications
• Synopsys Delivers Industry's First Complete UFS 3.0 IP Solution for High-Performance Embedded and Removable Storage
• CEO interview: Flex Logix' Geoff Tate on licensing FPGA
• Huawei Enters Patent License Agreement for Fraunhofer IIS MPEG-4 Audio Patent Portfolio
• North American Semiconductor Equipment Industry Posts January 2018 Billings
• Avery Design Systems Announces SimXACT 5.0 for Improved X-Verification
• Metrics Partners with Avery to Expand Cloud Verification with Robust VIP Portfolio
• Dream Chip Technologies Demonstrates Superior Power Efficiency with Automotive Driver Assistance SoC on GLOBALFOUNDRIES 22FDX Technology
• Inside Secure to Provide Secure Provisioning Solutions to ALi Corporation
• Ceragon License CEVA DSPs for Full 5G Wireless Backhaul
• CEVA Extends its IP Platforms for Bluetooth and Wi-Fi with RISC-V
• Intel Ships Industry's First 58G PAM4-Capable FPGA Built for Multi-Terabit Network Infrastructure and NFV
• IAR Systems enables high-performance machine learning based on latest neural network library from Arm
• Sequans Introduces New NB-IoT Only Platform: Monarch N
• Magillem Partners with Imperas
• AMIQ EDA Announces its Design and Verification Tools Eclipse IDE Supports Cadence Perspec System Verifier using System Level Notation

Headlines for Friday Feb. 23, 2018

• CEVA and mPerpetuo Partner to Deliver Halide Support for CEVA Vision Processors
• Barefoot Networks and Xilinx to Showcase Unprecedented Programmability and Visibility for 5G Networks

Headlines for Thursday Feb. 22, 2018

Top Story

CEVA Introduces PentaG - A Comprehensive 5G New Radio Enhanced Mobile Broadband IP Platform for Smartphones, Fixed Wireless Access and Embedded Devices

Compliant to the 3GPP 5G New Radio (NR) Release-15 and software upgradable for Release-16, PentaG is targeted at smartphones, fixed wireless access and the many other embedded devices that can take advantage of multi-gigabit data rates to enable services and use cases such as 4K video streaming, augmented reality, virtual reality, autonomous driving and home

• Blu Wireless Technology inside CCS self-organising mmWave access and backhaul solution
• New Arm Mbed IoT Device Platform capabilities enable companies to get more from their data
• PSA: Next steps toward a common industry framework for secure IoT
• Gartner Says Worldwide Sales of Smartphones Recorded First Ever Decline During the Fourth Quarter of 2017
• Integrated Circuit Technology Advances Continue to Amaze
• SoC-e's MTSN Switch IP Core solution now supports 802.1AB (LLDP)
• Vidatronic, Inc. Awarded National Science Foundation Grant for the Development of High Performance CMOS Transmitters for Wireless Applications
• WuQi Technologies is the latest licensee of CCww's NB-IoT UE protocol-stack software
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2018

Headlines for Wednesday Feb. 21, 2018

Top Story

Arm delivers integrated SIM identity to secure next wave of cellular IoT devices

Arm has a vision of a trillion connected devices by 2035, and each of these devices will need a secure identity, enabling stakeholders to establish trust – for example, allowing a service provider to trust its device base so it can authenticate devices, provide value added services and if needed, issue security updates.

• 48 Arteris IP Engineers Attain ISO 26262 Functional Safety Practitioner Certification by exida

Headlines for Tuesday Feb. 20, 2018

Top Story

CEVA Announces Industry's First 802.11ax Wi-Fi IPs

Building on its market leadership in Wi-Fi IP, CEVA is the first company to offer licensable 802.11ax solutions, providing its customers with a comprehensive platform to integrate the latest Wi-Fi standard into their next-generation product designs.

• Software-Based GPS Receiver from Galileo Satellite Navigation Now Available on Cadence Tensilica Fusion F1 DSP
• UltraSoC and Lauterbach RISC-V collaboration furthers vendor-neutral debug and development environment
• Qualcomm Enters into Amended Definitive Agreement with NXP
• QuickLogic Announces Partnership with Aldec for eFPGA Simulation Flow
• Microsemi to Showcase Third-Party IP Offerings for Machine Vision Applications Using its Cost-Optimized, Low Power Mid-Range PolarFire FPGAs at Embedded World
• PRO DESIGN Introduces Zynq UltraScale+ Based FPGA SoC and IP Prototyping Platform

Headlines for Monday Feb. 19, 2018

• Top 10 Semiconductor R&D Spenders Increase Outlays 6% in 2017

Headlines for Thursday Feb. 15, 2018

Top Story

Machine learning interview with Jem Davies of Arm

Processor IP licensor ARM has announced a dedicated machine learning processor core and eeNews Europe spoke with Jem Davies, general manager of the machine learning group at ARM, and Dennis Laudick, vice president of marketing for machine learning (ML), to find out more.

• Moortec Appoints Mark Davitt ex Sidense Sales Director to grow PVT Monitoring Sales in North America
• Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
• Synopsys to Showcase its Industry Leading Electronic Design, IP, and Software Security Solutions at Embedded World 2018
• OneSpin Announces Immediate Availability of OneSpin 360 EC-FPGA Tool Qualification Kit Certified for ISO 26262, IEC 61508, EN 50128
• Silicon Library Adopts Averant's Solidify Automated Checks Using CDC Inc. EDA Cloud Services

Headlines for Wednesday Feb. 14, 2018

Top Story

Solid State System Co., Ltd. selects Andes AndesCore N9 for Its SSS6131 USB 3.1 Gen 1 Flash Controller Highly Demand for Storage Application

Andes Technology Corporation, the leading Asia-based supplier of small, low-power, high performance 32/64-bit embedded CPU cores, today announced that Solid State System Co., Ltd. (3S) has licensed the mid-range AndesCore™ N903A for the SSS6131 USB 3.1 Gen 1 flash controller chip.

• MIPS and NetSpeed Partner to Deliver Solutions for AI and ML SoCs
• Qualcomm Preps Silicon as a Service
• Dolphin Integration Appoints Christian Dupont as CEO
• SiFive Appoints CFO to Executive Team
• Arteris IP FlexNoC Interconnect Licensed by Arbe Robotics for Automotive Imaging Radar Chipset
• IntelliProp Announces Q1 2018 Release of Gen-Z IP Cores Supporting Rev 1.0 Specification
• VESA Highlights Growing Adoption of DisplayPort over USB-C, New Codec for Handheld Device-Specific Display Interface Compression at Mobile World Congress
• Gen-Z Consortium Announces the Public Release of its Core Specification 1.0

Headlines for Tuesday Feb. 13, 2018

Top Story

Arm's Project Trillium Offers the Industry's Most Scalable, Versatile ML Compute Platform

Arm today announced Project Trillium, a suite of Arm IP including new highly scalable processors that will deliver enhanced machine learning (ML) and neural network (NN) functionality.

• Silvaco to Showcase Platform Products at Embedded World 2018
• ASICs Unlock Deep Learning Innovation: Live Seminar in Silicon Valley
• TSMC Board of Directors Proposes NT$8 Cash Dividend per Share

Headlines for Monday Feb. 12, 2018

• New IC Manufacturing Lines to Boost Total Industry Wafer Capacity 8%
• Intrinsic ID to Demonstrate Hardware Root of Trust for IoT Security at Embedded World
• Defacto Technologies Announces Synapse Design in collaboration with a major semiconductor company Reduces Simulation Time by 5X When using Defacto's RTL Design Solutions
• UMC Reports Sales for January 2018
• TSMC January 2018 Revenue Report

Headlines for Thursday Feb. 08, 2018

Top Story

MIPI Alliance Releases MIPI UniPro v1.8 with Increased Performance and Improved Quality of Service

The MIPI Alliance today released MIPI UniPro v1.8, an update to the versatile transport layer that is used to interconnect chipsets and peripheral components in mobile-connected devices.

• Synopsys Expands Photonic Design Solution with the Acquisition of PhoeniX Software
• Siemens continues to invest in IC industry with planned acquisition of Sarokal Test Systems
• SMIC Reports 2017 Fourth Quarter Results
• Faraday Reports Gross Margin 54.6% for 4Q2017, Reaches 10-Year High 2017 EPS of NT$3.40 on Revenues of 5.34bn

Headlines for Wednesday Feb. 07, 2018

Top Story

Arm acquires ChaoLogix for security reasons

Processor IP licensor Arm Ltd. (Cambridge, England) has acquired ChaoLogix Inc. (Gainsville, Florida) for an undisclosed sum of money and folded the company into its security operations.

• SiFive Launches World's First Linux-Capable RISC-V Based SoC
• NetSpeed Collaborates with Cadence to Optimize IP for Advanced Automotive SoC Designs
• Faraday Monthly Consolidated Sales Report - January 2018
• SoC-e releases IEC 61850/62351 SASCrypt IP Core
• Malta Tour Shows GF Rising
• NetSpeed and Synopsys Collaborate to Enable Early Architectural Exploration of Advanced ADAS and Datacenter SoCs

Headlines for Tuesday Feb. 06, 2018

Top Story

Sonics NoC Customer Starblaze Technology Reaches Volume Production With STAR1000 SSD Controller SoC

Sonics announced that its Chinese customer, Starblaze Technology, has reached volume production in TSMC’s 28HPC process technology with the STAR1000 solid state storage device (SSD) controller system-on-chip (SoC).

• RISC-V processor Mr Wolf arrives to solve problems
• Annual Silicon Volume Shipments Remain at Record Highs
• CEVA, Inc. Announces Fourth Quarter and Year End 2017 Financial Results
• Taiwanese IP Firm Bets on Crypto Technology
• Maxim Selects Methodics as IP Lifecyle Management Platform to Enable Enterprise IP-Centric Design Approach Across Global Design Network

Headlines for Monday Feb. 05, 2018

Top Story

Ampere Launches to Accelerate Hyperscale Cloud Computing Innovations

Today a new company, Ampere™, was launched to address memory performance, cost, space and power constraints for emerging hyperscale cloud applications and next-generation data centers. Ampere was born in and built for private and public clouds and delivers customers reliable 64-bit Arm® server processors with high memory performance and substantially lower power and total cost of ownership (TCO).

• Broadcom Presents Best and Final Offer for Qualcomm of $82.00 Per Share
• Annual Semiconductor Sales Increase 21.6 Percent, Top $400 Billion for First Time
• Can Ex-Intel President Succeed with Old ARM SoC?
• intoPIX & Macnica Technology revolutionize AV signal distribution at ISE 2018: Integrating the new ST 2110 standards with intoPIX ultra-low latency compression technologies
• Xilinx to Showcase 8K and AV over IP Solutions at ISE 2018
• GUC Monthly Sales Report - Jan 2018
• Sankalp Semiconductor opens a New Design Center in Ahmedabad

Headlines for Friday Feb. 02, 2018

• Mobile System on Chip Designs, Embedded Processing Lift MPU Market
• Chip Heads Gauge Silicon Roadmap
• NVM Express, Inc. Elects Cavium, Cisco, Dell, Facebook, Intel, Microsemi and NetApp to Promoter Board for 2018

Headlines for Thursday Feb. 01, 2018

• M31 and Innovative Logic USB 3.1 Gen 2 IP got Certification from USB-IF
• Metrics Announces Pay-by-Minute Cloud Simulator & Verification Manager
• Cadence Reports Fourth Quarter and Fiscal Year 2017 Financial Results
• AI Expands Role in Design