D&R Headline News (March 2018)

Headlines for Friday Mar. 30, 2018

Top Story

Silex Inside releases a high throughput, scalable and performant MACsec engine

In current networking technologies, source authentication, data integrity and confidentiality are becoming more and more important. There exist numerous software implementations for security protocol suites on nearly all OSI layers, but these implementations are not well suited for timing-critical, high throughput applications.

• SMIC Announces 2017 Annual Results
• Mobile Semiconductor Introduces 40nm ULP Memory Compiler Support

Headlines for Thursday Mar. 29, 2018

• Cryptocurrency mining demand sucking up TSMC IC production
• CoreHW partners with GLOBALFOUNDRIES in RF Ecosystem Program
• EU Project Delivers Open-Source Simulator for Cyber-Physical Systems

Headlines for Wednesday Mar. 28, 2018

Top Story

Mindtree announces BQB qualification of its Bluetooth Mesh v1.0 Software Stack and EtherMind Bluetooth v5.0 Software Stack & Profiles

Mindtree Ltd., has announced the BQB (Bluetooth Qualification Body) qualification of its Bluetooth Mesh v1.0 Software Stack along with its Bluetooth v5.0 Software Stack & Profiles.

• The Alliance for Open Media Kickstarts Video Innovation Era with "AV1" Release
• NVIDIA and Arm Partner to Bring Deep Learning to Billions of IoT Devices

Headlines for Tuesday Mar. 27, 2018

Top Story

Stock Relisting Could Be a Boon for Arm

Arm Holdings would gain much-needed visibility under a plan being floated by Softbank to re-list the processor IP firm on the stock market.

• Arteris FlexNoC Interconnect IP Powers DJI Drones
• Trump Presses China to Buy More U.S. Chips
• NEOTION and Invia join expertise in hardware-based security

Headlines for Monday Mar. 26, 2018

Top Story

Chips&Media was reportedly signed a contract to supply ISP IP package for IP cameras intended for surveillance market

Chips&Media was reportedly signed a contract with one of major SoC manufacturer in Asia to license Image Signal Processing (ISP) IPs for intended use in surveillance cameras.

• Innosilicon Announces the World's Most Powerful Dash Miner, 65GH/s, 1500W
• Secure Provisioning Solutions from Inside Secure Now Protecting Pay TV Services at Kiwisat
• Intrinsic ID Awarded EU Grant under Horizon 2020/SME Instrument Phase 2 Program for INSTET Project
• Omnitek adds AV over IP and video warp Chipsets
• EnSilica builds sales network to extend its design and supply services for the automotive sector
• Palma Ceia SemiDesign Establishes China Subsidiary for Development and Support
• eVaderis collaborates with Mentor on accelerating eMRAM IPs and Compilers development
• Pentek Announces Kintex UltraScale Co-processor Jade XMC for Signal Processing Applications

Headlines for Friday Mar. 23, 2018

Top Story

U.S. Companies Maintain Largest Share of Fabless Company IC Sales

Research included in the March Update to the 2018 edition of IC Insights’ McClean Report shows that fabless IC suppliers accounted for 27% of the world’s IC sales in 2017—an increase from 18% ten years earlier in 2007.

• EDA Chief Calls AI the New Driver
• North American Semiconductor Equipment Industry Posts February 2018 Billings
• IPC Urges Trump Administration to Take Measured Approach in Levying Higher Tariffs on Electronics from China
• Path to 2nm May Not Be Worth It
• SIA Statement on Trump Administration Section 301 Action on China

Headlines for Thursday Mar. 22, 2018

• SiFive Brings in Mobiveil as Newest Partner in the DesignShare Economy
• IEEE Publishes IEEE 802.3cc-2017 25 Gb/s Ethernet Standard for Enhanced Enterprise and Metro Network Applications Over Fiber

Headlines for Wednesday Mar. 21, 2018

Top Story

Synopsys Acquires Silicon and Beyond Private Limited to Expand High-Speed SerDes IP Portfolio

Synopsys, Inc. (Nasdaq: SNPS) today announced it has acquired Silicon and Beyond Private Limited, a leading provider of high-speed SerDes technology used in data intensive applications such as machine learning, cloud computing, and networking.

• Report: Globalfoundries asks China to probe TSMC
• GLOBALFOUNDRIES Launches RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications
• Synopsys Accelerates Development of Renesas R-Car V3H SoC that Achieves Cutting-edge Computer Vision
• GLOBALFOUNDRIES Names Ronald Sampson as General Manager of its Leading-Edge Silicon Manufacturing Facility in New York

Headlines for Tuesday Mar. 20, 2018

• Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd.
• Synopsys Announces Industry's Most Comprehensive Automotive ISO 26262 Certification for Design Platform
• Mobiveil Joins Gen-Z Consortium
• Imagination streamlines app and game development with GPU debugging as part of new PVRStudio IDE
• Imagination announces powerful new capabilities in PVRTune performance analysis tool for PowerVR GPUs
• Synopsys Introduces Breakthrough Fusion Technology to Transform the RTL-to-GDSII Flow
• Synopsys Enables Robust Design Optimization for Next-generation High-performance Computing, Mobile and Automotive Products with IC Compiler II and RedHawk Analysis Fusion

Headlines for Monday Mar. 19, 2018

Top Story

Xilinx Unveils Revolutionary Adaptable Computing Product Category

Xilinx today announced a new breakthrough product category called Adaptive Compute Acceleration Platform (ACAP) that goes far beyond the capabilities of an FPGA. An ACAP is a highly integrated multi-core heterogeneous compute platform that can be changed at the hardware level to adapt to the needs of a wide range of applications and workloads.

• Everspin Signs Long-term Patent License Agreement with Alps Electric
• Rambus to Develop Hybrid Memory System Architectures for Future Data Centers
• HiTrend selects Dolphin Integration's cache controller for its next generation of smart energy metering chips
• Accellera Announces Proposed Working Group to Define an IP Security Assurance Specification
• Xilinx CEO Outlines New Vision, Strategy for the Company
• SambaNova Systems Emerges From Stealth and Secures $56 Million in Series A Funding Led by Walden International and GV

Headlines for Friday Mar. 16, 2018

• Broadcom Eyes New Acquisition Targets
• Silicon Creations' PMA Technology Part of Microsemi Award-Winning FPGA

Headlines for Thursday Mar. 15, 2018

• Trump Precedent Won't Chill M&A
• IC Insights Raises 2018 IC Market Forecast from 8% to 15%

Headlines for Wednesday Mar. 14, 2018

Top Story

Eta Compute Launches Industry's First Neuromorphic Platform for Ultra-Low-Power Machine Intelligence at the Edge

Eta Compute today announced the availability of its latest System on Chip (SoC) platform. Silicon proven in TSMC 55nm ULP process, this ground-breaking product consumes only a fraction of the power of existing solutions and redefines the standard for ultra-low power embedded solutions.

• GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity
• Synopsys and Industry Technologists to Address the Path to 2-nm SoC Design
• EnSilica builds export drive with appointment of Asia Region Manager
• Stratix 10 FPGA: REFLEX CES is Shipping the Cloud Computing COTS Board "XpressGXS10-FH200G", and the Sargon Stratix 10 GX Development Kit
• Lattice Semiconductor Announces CEO Succession Plan
• Mobile Semiconductor Introduces 28nm Memory Compiler Support
• MIPI Alliance Welcomes Bosch and Qualcomm as Promoter Members

Headlines for Tuesday Mar. 13, 2018

Top Story

Arteris IP FlexNoC Interconnect Licensed by VeriSilicon for Multiple Chip Designs

Arteris IP today announced that VeriSilicon Holdings Co., Ltd. (VeriSilicon) has purchased multiple licenses of Arteris FlexNoC interconnect IP for use as the on-chip communications backbone of SoCs for the data center, automotive and other applications.

• Credo Demonstrates Robust, Low-Power 112G PAM4 Solutions at OFC 2018

Headlines for Monday Mar. 12, 2018

Top Story

Following Significant Technology, Capacity and Expansion Milestones, GLOBALFOUNDRIES' Sanjay Jha to Pass Baton to Industry Veteran Tom Caulfield

After more than four years as chief executive officer of GLOBALFOUNDRIES, Sanjay Jha will hand over the company’s top position to Dr. Thomas Caulfield, senior vice president and general manager and a highly-respected industry veteran.

• Fab Spending Poised For Remarkable Fourth Year of Growth
• Synopsys Advances Custom Platform to Accelerate Robust Custom Design
• Open-Silicon, Credo and IQ-Analog Showcase Complete End-to-End Networking ASIC Solutions at OFC 2018
• QuickLogic Joins RISC-V Foundation
• Mnano selects Dolphin Integration's six-channel Audio converter for its next generation of Smart Speakers
• CSEM selects ID-Xplore to accelerate analog design and technology porting at functional level
• Faraday Accelerates AI Revolution with Its FPGA-to-ASIC Conversion Service
• Xilinx Showcases Future of Optical Networking with Breakthrough Technology and Products at OFC 2018

Headlines for Friday Mar. 09, 2018

• UMC Reports Sales for February 2018
• TSMC February 2018 Revenue Report

Headlines for Thursday Mar. 08, 2018

Top Story

Interview with Rick O'Connor of RISC-V Foundation

The RISC-V Foundation was present at the Embedded World exhibition with its own booth that also hosted a number of companies within its growing ecosystem. eeNews caught up with Rick O'Connor, executive director of the foundation and asked why a new and open processor architecture was relevant to embedded applications.

• Corigine adds certified USB IP to SiFive's Growing DesignShare Economy to Accelerate Adoption of RISC-V
• Synopsys Collaborates with Samsung Foundry to Develop DesignWare IP for Samsung 8-nm FinFET Process
• Kneron Announces Low Power AI Processors NPU IP Series with the Lowest Power Consumption: Less Than 5mW
• Faraday Monthly Consolidated Sales Report - February 2018
• MIPI Alliance Expands Reach with New Automotive Working Group

Headlines for Wednesday Mar. 07, 2018

Top Story

CEVA First to Deliver Bluetooth 5 Dual Mode IP

CEVA today reinforced its leadership in the Bluetooth IP market with delivery of its RivieraWaves Bluetooth 5 dual mode IP to multiple licensees, including ASR Microelectronics.

• Wave Computing Adopts Low Power MIPS 64-bit Multi-Threaded Core
• GCT Semiconductor Licenses CEVA Bluetooth Low Energy IP for its LTE IoT SoC
• Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development
• M31 and Macroblock work together to deploy the global LED driver IC market
• Imperas Appoints Kevin McDermott as Vice President of Marketing
• Rambus Initiates Accelerated Share Repurchase Program
• Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra's IoT Platform
• Are the Major DRAM Suppliers Stunting DRAM Demand?
• Intrinsic ID and Technolution Awarded SBIR to Develop SEMIO IoT Security Platform

Headlines for Tuesday Mar. 06, 2018

Top Story

Synopsys Adds New Algorithms in DesignWare Security Protocol Accelerators to Increase Protection for IoT SoCs

Synopsys today announced that it has added the ChaCha20 and Poly1305 (RFC7539) algorithms to its DesignWare® Multipurpose Security Protocol Accelerator IP, enabling designers to efficiently implement the latest encryption and authentication functionality to protect their IoT system-on-chips (SoCs).

• Silvaco Completes Acquisition of NanGate
• Arm delivers compelling visual experiences to the mainstream
• January Semiconductor Sales Up 22.7 Percent Compared to Last Year

Headlines for Monday Mar. 05, 2018

Top Story

Palma Ceia Closes Series B Funding, Internet of Things Connectivity to be Accelerated

Palma Ceia SemiDesign (PCS), a fabless semiconductor company offering wireless chips, modules, systems and IP supporting emerging Machine-to-Machine (M2M) WiFi and cellular standards for the Internet of Things (IoT), today announced it has completed a Series B round of financing.

• GUC Monthly Sales Report - Feb 2018
• Trilinear Technologies and Avery Design Systems Team on DisplayPort IP Solutions
• Arm's John Ronco on IP for embedded
• Efinix Releases Trion Programmable Platform
• Microchip Technology To Acquire Microsemi
• Canaan-Creative employs Moortec's Temperature Sensor in their new ASIC aimed at HPC IC
• HCC Embedded Releases MISRA-Compliant Embedded Cryptography Suite and Manager
• 92 IC Wafer Fabs Closed or Repurposed From 2009-2017

Headlines for Thursday Mar. 01, 2018

• CEVA and Nokia Collaborate for 4.9G and 5G Technologies
• Brite Semiconductor Releases Gen2 DDR LP PHY IP