D&R Headline News (April 2018)

Headlines for Monday Apr. 30, 2018

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Synopsys and TSMC Collaborate to Deliver DesignWare Foundation IP for Ultra-Low Power TSMC 22-nm Processes

Synopsys today announced its collaboration with TSMC to develop DesignWare® Foundation IP for TSMC's 22-nanometer (nm) ultra-low power (ULP) and ultra-low leakage (ULL) processes. DesignWare Foundation IP, including logic libraries, embedded memories, and one-time programmable (OTP) non-volatile memories (NVM) on TSMC's 22-nm processes, enables designers to significantly reduce power consumption while meeting performance requirements for a wide range of applications.

• Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications
• PLDA Announces XpressCCIX Controller IP Supporting The Cache Coherent Interface For Accelerators (CCIX) Standard
• UltraSoC selected by Andes for RISC-V development with trace and debug
• SST and UMC Announce Qualification of Embedded SuperFlash Technology on 40 nm CMOS Process
• TSMC Certifies Synopsys Design Platform for High-performance 7-nm FinFET Plus Technology
• Synopsys Digital and Custom Design Platform Certified for TSMC's Most Advanced 5-nm Process Technology for Early Design Starts

Headlines for Friday Apr. 27, 2018

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eMemory introduces more security features to its eNVM IP for TSMC 7nm Process

eMemory today announced the successful verification of its secure eNVM IP for TSMC’s advanced processes, and the company is introducing more security features to the eNVM solution for TSMC’s 7nm process technology in the coming months.

• Intel Delays 10nm Volume Production Until 2019
• Samsung, GF Ramp FD-SOI
• GlobalSign's Cloud-based, Highly Scalable PKI Solution integrated with Arm Mbed Cloud
• Achronix's Speedcore eFPGA Devices to be Highlighted at TSMC 2018 North America, China Technology Events in May
• Arbe Robotics Selects GLOBALFOUNDRIES for its High-Resolution Imaging Radar to Enable Safety for Autonomous Cars

Headlines for Thursday Apr. 26, 2018

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Mobile Semiconductor's 22nm ULL Memory compiler Joins the GLOBALFOUNDRIES FDXcelerator Partner program

Mobile Semiconductor, a Seattle WA based company, today announced the inclusion of its new 22nm ULL (Ultra Low Leakage) memory compilers in the industry leading GLOBALFOUNDRIES FDXceleratorTM Program. This new embedded SRAM technology on 22nm FDX offers the best in class memory solution using the GLOBALFOUNDRIES low leakage FDSOI bit cells and ultra-low leakage devices.

• New MIPI SyS-T Consolidates and Streamlines Embedded Software Debugging in Mobile
• Cyient Acquires Semiconductor Firm AnSem N.V.
• SEMI Reports 2017 Global Semiconductor Materials Sales of $46.9 Billion
• Achronix's Increased Revenue, Expanding Workforce Drives Move to Larger Corporate Headquarters
• Sankalp Semiconductor to Participate in Panel Discussion at "The Annual SOI Silicon Valley Symposium"
• Innovium Closes $77M in Series D Funding to Drive Commercial Volume Ramps and Innovative Product Roadmaps
• Silicon Creations Showcases Latest IP Portfolio at TSMC Technology Symposium
• Xilinx Reports Record Annual And Quarterly Revenues

Headlines for Wednesday Apr. 25, 2018

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M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process

M31 Technology Corporation (Taiwan stock code: 6643), a global Silicon Intellectual Property (IP) boutique, today announced its collaboration with TSMC to deploy the full range of IP for TSMC 22nm ULP/ULL technology.

• Partner in Imagination's owner convicted of insider trading
• TSMC Continues to Dominate the Worldwide Foundry Market
• North American Semiconductor Equipment Industry Posts March 2018 Billings

Headlines for Tuesday Apr. 24, 2018

• Cadence Reports First Quarter 2018 Financial Results
• Accelerators Unite ARM, IBM, X86
• eMCOS AUTOSAR, an AUTOSAR-Compliant Scalable RTOS, Receives ISO 26262 Functional Safety Standard Certification at Highest ASIL D Safety Integrity Level

Headlines for Monday Apr. 23, 2018

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PLDA Announces New Test And Validation Platforms For PCIe

PLDA®, the industry leader in PCI Express® interface IP solutions today announced the launch of a new Test and Validation Platform line of products, aimed at creating easier and faster routes to PCIe® 4.0 design

• Solarflare and NovaSparks Launch Pure-FPGA Tick-To-Trade Development Platform That Slashes Man-Years of Effort
• Exostiv Labs now supports Intel Stratix 10 FPGA
• Algodone Signs a Strategic Partnership with Accelize
• Gartner Says Worldwide Semiconductor Revenue Grew 21.6 Percent in 2017 as Samsung Takes Over No. 1 Position
• Arm Mbed Simplifies IoT Security, Development and Device Management
• Algodone, a Silicon Activation Licensing Technology Provider to the Semiconductor Industry, Expands Executive Team
• Facebook to design own processors
• Alibaba Adds Embedded CPU Core Designer
• GlobalFoundries choose INNOSILICON as cooperative partner
• Dongwoon Anatech Licenses Codasip's Bk3 RISC-V Processor for Motor Control ICs for Mobile Camera
• Xylon Launches Three New FMC Expansion Boards Featuring High-Speed Serial Links for FPGA Based Multi-Camera Automotive Application Development
• Fujitsu choose INNOSILICON as cooperative partner

Headlines for Thursday Apr. 19, 2018

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T2M announces availability of Bluetooth SIG qualified v5 Bluetooth Low Energy Controller, Stack and Profiles IP from Mindtree

T2M announced the availability of Mindtree’s BQB (Bluetooth Qualification Body) qualified Bluetooth v5 Controller, Stack and Profiles (Declaration ID #D038059 and #D038060). This makes Mindtree the first company to qualify a full featured Bluetooth Low Energy 5 IP with TCRL 2 Specifications.

• Qualcomm Begins Layoffs
• Microsemi Collaborates with MathWorks to Deliver First Integrated FPGA-in-the-Loop Workflow for PolarFire and SmartFusion2 FPGA Development Boards
• TSMC Reports First Quarter EPS of NT$3.46
• IEEE Publishes Standard Revision for SystemVerilog - Unified Hardware Design, Specification and Verification Language
• Intel Chip Performs 10 Trillion Calculations per Second

Headlines for Wednesday Apr. 18, 2018

• Titan IC delivers innovative technology for Deep Packet Processing Module in IRD-100 for Strategic Partner Looking Glass
• Macnica's ST2110 IP Core Successfully Adopted by Sencore for its New SDI over IP Converter
• Microsemi's Mi-V Ecosystem Continues to Expand as New Member Antmicro Joins to Develop Mi-V RISC-V Processor Subsystems for PolarFire FPGAs

Headlines for Tuesday Apr. 17, 2018

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New Flexible SoC Solution from Arm to Enable Rapid Development of Secure IoT Devices

The Arm SDK-700 System Design Kit is a comprehensive SoC system framework for designing secure SoCs for rich IoT nodes, gateways, and embedded applications. This solution enables partners to build secure devices within a common software development environment, while enabling the diversity and differentiation for their business to thrive in new IoT applications.

• Titan IC has licensed its RegEx Processor to Silicom Ltd for advanced FPGA SmartNIC platforms
• IoT Security Milestone for Intrinsic ID Authentication: More Than 100 Million Devices Protected
• Synopsys Extends HAPS Prototyping Family with New Desktop Prototyping Solution
• Inside Secure's Root of Trust Engine Secures eWBM's System-on-Chip for IoT Market
• Arm Backs New Cybersecurity Tech Accord to Protect Consumers and Businesses

Headlines for Monday Apr. 16, 2018

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Rambus Launches CryptoManager RISC-V Root of Trust Programmable Secure Processing Core

Rambus Inc. (NASDAQ: RMBS) today announced the availability of the CryptoManager Root of Trust, a fully programmable hardware security core built with a custom RISC-V CPU.

• Synopsys and Arm Extend Collaboration to Improve Power, Performance, and Time to Results for Arm's Latest IP and Synopsys Tools
• No NN-dedicated hardware on Qualcomm IoT processors
• EnSilica becomes Arm Approved Design Partner

Headlines for Thursday Apr. 12, 2018

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Lip-Bu Tan on AI, China & Moore

There’s still room for investing in accelerators for machine learning, one of several semiconductor segments China hopes to dominate, according to Lip-Bu Tan, a veteran investor. Wearing his hat as chief executive of Cadence Design Systems, he’s bullish on the silicon roadmap and says EDA companies need to move up to the systems level.

• China's Unigroup plans to spend $60 billion, says report
• Dover Microsystems Brings Secure Silicon IP to DesignShare
• Faraday Leads ASIC Industry with Supporting Major Projector Technologies
• DapTechnology Releases 1394/AS5643 IP for Microsemi IGLOO2 and SmartFusion2 FPGA Devices
• Cadence: Last Holdout for Vision + AI Programmability
• Spectral Edge, the image fusion technology specialists, secures $5.3 million in further funding from existing investors Parkwalk Advisors and IQ Capital

Headlines for Wednesday Apr. 11, 2018

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Cadence Boosts Vision and AI Performance with New Tensilica Vision Q6 DSP IP

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica® Vision Q6 DSP, its latest DSP for embedded vision and AI built on a new, faster processor architecture. The fifth-generation Vision Q6 DSP offers 1.5X greater vision and AI performance than its predecessor, the Vision P6 DSP, and 1.25X better power efficiency at the Vision P6 DSP’s peak performance.

• Adoption of Intel FPGAs for Acceleration of Enterprise Workloads Goes Mainstream
• Aldec's HES UltraScale+ Reconfigurable Accelerator and Northwest Logic's PCI Express Cores Provide Proven PCI Express Solution
• CEVA-XM6 Computer Vision and Deep Learning Platform Honored by Vision Systems Design 2018 Innovators Awards Program
• Chip Designers Bank on AI, Bitcoin
• JPEG XS - Image coding for video over IP transmission in production quality
• Semiconductor Leaders' Marketshares Surge Over the Past 10 Years
• Cadence Expands Virtuoso Platform with Enhanced System Design, Advanced Node Support down to 5nm, and Simulation-Driven Layout

Headlines for Tuesday Apr. 10, 2018

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CAST and Achronix Enable Processing from Data Center to the Edge with Lossless Compression IP

Achronix Semiconductor Corporation, a leader in field programmable gate array (FPGA)-based hardware accelerator devices and embedded FPGA (eFPGA), announced its collaboration with CAST Incorporated, a semiconductor intellectual property company focusing on semiconductor IP for electronic system designers. CAST’s high performance lossless compression IP

• Faraday Monthly Consolidated Sales Report - March 2018
• Ittiam Licenses its i265 HEVC Codec to Microsoft Azure to Offer High Quality Video Encoding and Decoding Services
• TSMC March 2018 Revenue Report
• UMC Reports Sales for March 2018
• Partnering with Accelize, Nagase provides a Content-Oriented Find and Replace Accelerator Function on AccelStore for Cloud-based Data Analytics Acceleration
• Accelize Launches AccelStore: A Platform-Independent Marketplace that Brings FPGA-based Workload Acceleration to all Cloud Users
• Arm Under Attack in AI

Headlines for Monday Apr. 09, 2018

Top Story

Design Services Need Uber-izing

A wide swath of semiconductor design services companies are seeking their breakout moment. Samir Patel thinks that he has found one in the ability to customize standard products for an increasingly applications-centric chip market.

• GUC Monthly Sales Report - Mar 2018
• Samsung early with 7nm process, says report.
• MediaTek Announces World's First Complete 56G PAM4 SerDes, Silicon-Proven on 7nm for ASIC services
• intoPIX to unveil newest JPEG-XS compression tech at NAB Show 2018 in Las Vegas - A World First
• CAST and Accelize Make GZIP Compression Instantly Available via Cloud-Based FPGA Accelerators
• Flex Logix Validates EFLX 4K eFPGA IP Core on TSMC16FFC; Evaluation Boards Available Now
• Codasip Welcomes Jerry Ardizzone to Executive Team as Vice President of Worldwide Sales
• PathPartner Technology unveils FPGA based HEVC & HEIF 4K Decoder on Amazon AWS EC2 Cloud
• Dolphin Integration augments the TSMC IP Ecosystem at 40 nm ULP eFlash with new TITAN Read Only Memory
• intoPIX demonstrates TICO implemented SMPTE 2110 IP running 4K live on FPGA CPU and GPU

Headlines for Friday Apr. 06, 2018

• Arastu Systems evolving in the Industry with a strategic roadmap

Headlines for Thursday Apr. 05, 2018

Top Story

China shows it takes Imagination opportunity seriously

The appointment of Leo Li as the next CEO of intellectual property licensor Imagination Technologies Ltd. (Kings Langley, England) demonstrates to me that China takes seriously the investment of £550 million in cash (about $740 million), made in the company last year.

• SEMI Reports 2017 Global Semiconductor Equipment Sales of $56.6 Billion
• The Low Profile PCIe Board XpressGXA10-LP 1150 and 1151 Versions Are Providing HPC, Finance and Networking Markets a Cost-Effective, Low-Latency Solution
• Nantero Expands NRAM Product Development, Signs New Customers
• Fraunhofer IIS Audio System Selected for Chinese 3D Audio Standard for UHD TV
• China startup releases AI processors then raises $100 million
• NVMEngines to Exhibit and Present at IP SOC 2018; Company to Be Renamed Numem
• HEVC Advance Highlights Momentum with Newest Licensors and Licensees

Headlines for Wednesday Apr. 04, 2018

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Silvaco IP Revs Up Silicon Catalyst's Semiconductor Startup Ecosystem

Silvaco, a leading EDA and IP provider, and Silicon Catalyst, the world’s only startup incubator focused exclusively on solutions in silicon, announce that they are teaming up to provide silicon proven IP, a critical element to the rejuvenated semiconductor startup ecosystem.

• Tortuga Logic to Develop Novel Hardware Security Solutions with Support from DARPA Program
• ESD Alliance Reports EDA Industry Revenue Increase For Q4 2017
• Neotion partners with Texplained creating stronger Secure by Design ICs

Headlines for Tuesday Apr. 03, 2018

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Imagination Technologies Group Ltd. Announces CEO Succession

Imagination Technologies announces today that Dr. Leo Li is to become Chief Executive Officer.

• Global Semiconductor Sales Up 21 Percent Year-to-Year in February
• IP-Maker to launch new NVMe host IP Family

Headlines for Monday Apr. 02, 2018

Top Story

SiFive Secures $50.6 Million Funding to Advance RISC-V Based Semiconductors

SiFive, the leading provider of commercial RISC-V processor IP, today announced it raised $50.6 million in a Series C round led by existing investors Sutter Hill Ventures, Spark Capital and Osage University Partners alongside new investor Chengwei Capital, and strategic investors including Huami, SK Telecom and Western Digital and other companies that are among the most respected and iconic companies in the industry.

• Excluded from M&A, China Focuses on Expansion
• Sankalp Semiconductor to Present & Exhibit at Design & Reuse IPSoC Santa Clara 2018
• eMemory, Europractice IC Service form eNVM IP partnership