D&R Headline News (May 2018)

Headlines for Thursday May. 31, 2018

Top Story

Synopsys' Latest ARC MetaWare EV Development Toolkit Release Speeds Application Software Development for Embedded Vision Systems

Synopsys today announced a new release of its DesignWare® ARC® MetaWare EV Development Toolkit, an integrated programming environment that accelerates application software development for the DesignWare ARC EV6x family of embedded vision processors.

• Synopsys Enables Tapeout Success for Early Adopters of Arm's Latest Premium Mobile IP, Including Cortex-A76 and Mali-G76 Processors
• intoPIX to showcase 8K and best-in-class AV-over-IP compression technologies at InfoComm 2018
• TrendForce Reports Top 10 Semiconductor Foundries Worldwide for 1H18, TSMC Ranks First with an Estimated Market Share of 56.1%
• USB-IF Publishes HID Standard for Braille Displays

Headlines for Wednesday May. 30, 2018

• Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification
• Technolution to engage in space-proof data processing by taking over Recore Systems' activities
• Imec demonstrates compatibility of state-of-the-art 0.8V-transceiver, with industry standard Arm Cordio IP for BLE 5
• Rambus Announces New Senior Vice President of Global Market Development
• Real Intent's New Verix SimFix Software Delivers First Intent-Driven Remedy for Verification Pessimism

Headlines for Tuesday May. 29, 2018

• GLOBALFOUNDRIES Enters Volume Production of Ultra High Voltage Process Technology for Industrial and Power Applications
• IP Cores, Inc. Announces Additional Shipments of its Reed-Solomon Codec for 400G Ethernet

Headlines for Monday May. 28, 2018

Top Story

Dolphin Integration announces the availability of its RISC-V subsystem: RV32 Tornado

Dolphin Integration announces the availability of its RISC-V subsystem called RV32 Tornado. This MCU subsystem has been designed to fit the IoT requirements in terms of area and low-power consumption.

• Inuitive licenses Inside Secure's Root-of-Trust to Secure Mobile and XR Virtual Augmented Reality solutions
• Kandou Announces Availability of Glasswing USR SerDes IP

Headlines for Friday May. 25, 2018

Top Story

Resurgence in 8051 Microcontroller Applications Drives New IP Cores Sales for CAST

CAST, Inc. has seen a significant upswing in licenses for the venerable 8051 microcontroller, as today’s designers rediscover that the simplicity, low-power operation, small silicon area, and relatively inexpensive cost of this 8-bit MCU are an excellent match for the demands of many modern products.

• Silex Inside HDMI over IP OEM solution is interoperable with AES67 and SMPTE 2110 standards

Headlines for Thursday May. 24, 2018

• Chip Industry Maps Heterogeneous Integration
• Andes Technology Corporation and XtremeEDA Corporation Cooperate to Develop Joint Design Wins on Emerging RISC-V Designs
• North American Semiconductor Equipment Industry Posts April 2018 Billings
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2018
• Agnisys to Present Functional Safety, Machine Learning, IoT Solutions, and More at the Design Automation Conference in San Francisco
• Intel to Spend $5 Billion on 10nm Fab in Israel

Headlines for Wednesday May. 23, 2018

Top Story

Arasan and Test Evolution announce Industry's first C-PHY / D-PHY Combo Compliance Analyzer with Arasan's Total MIPI IP Solution

Arasan Chip Systems is proud to announce the immediate availability of Test Evolution IP110 series C-PHY / D-PHY Combo protocol analyzers built using Arasan’s Total MIPI IP Solutions including C-PHY / D-PHY Combo IP cores.

• ST's New CEO Not Ruling Out Acquisitions in Quest for Growth
• IP Cores, Inc. Announces Shipment of a 32-bit Version of its Ultra Low Power FFT IP Core
• Samsung Plans 3nm Gate-All-Around FETs in 2021
• Chipus grows its battery charger IP family
• SmartDV Announces OpenCAPI Verification IP (VIP)
• Imagination appoints PowerVR veteran to lead business unit
• Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation
• HDL Design House and Mentor Workshop at Aviation Electronics Europe 2018
• Cadence Full-Flow Digital and Signoff Tools Certified on Samsung's 8LPP Process Technology
• Synopsys Design Platform Certified for Samsung 8LPP Process Technology
• GLOBALFOUNDRIES Announces Industry's Most Advanced Automotive-Qualified Production FD-SOI Process Technology

Headlines for Tuesday May. 22, 2018

Top Story

Arm Gives Glimpse of AI Core

Arm sketched the inner workings of its machine-learning core at a press and analyst event here. Engineers are nearly finished with RTL for the design with hopes of snagging a commitment within weeks for use in a premium smartphone in 2019 or later.

• Can Mobileye Validate 'True Redundancy'?
• Brite Semiconductor Joins SiFive's DesignShare Program
• Open-Silicon Achieves ISO 9001:2015 Certification
• Semi Capex Forecast to Exceed $100B for the First Time in 2018

Headlines for Monday May. 21, 2018

Top Story

Rambus takes aim at ARM in IoT security

Rambus has moved from being a patent and technology licensing company to a product and now an IoT services company that wants to take on ARM. Nick Flaherty talks to Jerome Nadel, the chief marketing officer, on where the company is heading, from cold computing to secure tokens.

• Ultra-Low Power Lattice sensAI Leads Mass Market Enablement of Artificial Intelligence in Edge Devices
• Dolphin Integration introduces new Dual Port memory compilers in TSMC 40 nm
• Microsemi Deal May Spur Broader ReRAM Adoption

Headlines for Thursday May. 17, 2018

Top Story

Synopsys Introduces Industry's First ASIL D Ready Embedded Vision Processor IP for ADAS Applications and Self-Driving Vehicles

Synopsys today announced its new automotive safety integrity level (ASIL) B, C, and D Ready DesignWare® EV6x Embedded Vision Processors with Safety Enhancement Package (SEP) to accelerate the development of automotive system-on-chips (SoCs).

• Arm Drives Smart Utilities for KEPCO's Behind the Meter Project
• Startup Maps AI into Flash Array
• SiFive Inc. and Andes Technology Corporation Join Forces to Promote RISC-V
• CTAccel Joins Accelize Ecosystem to Make FPGA-Based Image Transcoding Acceleration Available on AccelStore
• Crossbar Announces Licensing Relationship Agreement With Microsemi

Headlines for Wednesday May. 16, 2018

Top Story

New VDC-M (VESA Display Compression-M) IP Cores Launched By Hardent

Hardent, a VESA® member and leading provider of video compression IP cores, has today announced the launch of VDC-M encoder and decoder IP cores supporting the new VESA Display Compression-M standard.

• Thirteen Top-15 1Q18 Semi Suppliers Register Double-Digit Gains
• VESA Publishes Display Compression Standard for Mobile Applications
• MIPI Alliance and VESA Enable Next Generation of High-Performance Displays for Mobile, AR/VR, Automotive, Other Applications
• T2M and Mindtree to showcase cutting-edge BQB-qualified Mesh SW and Bluetooth 5 IP at Bluetooth Asia, Shenzhen
• Stars of IP Party Returns to San Francisco

Headlines for Tuesday May. 15, 2018

Top Story

Flex Logix Co-Founders Awarded Interconnect Patent For Connecting Any Kind Of RAM Between eFPGA Cores To Create Application-Optimized eFPGA Arrays

Flex Logix® Technologies announced that an additional switch interconnect patent, U.S. Patent 9,973,194, was issued today to Flex Logix, naming its co-founders Cheng Wang and Geoff Tate as the inventors.

• Presto Engineering Joins GLOBALFOUNDRIES Ecosystem as ASIC Partner
• Concentrating Intelligence to Realize Autonomous Driving
• True Circuits Provides Low Power PLL Technology to SiFlower in China
• NetSpeed Furthers Leadership in Industrial, Factory Automation and Safety-critical Flight Systems with IEC 61508 Certification
• Achronix to Demonstrate Versatility of Speedcore eFPGA Devices Next Week at SEE/MAPLD and Embedded Vision Summit
• Andes Technology Corporation Records a Cumulative 2.5 Billion SoC Shipments Containing Its CPU IP Since Inception

Headlines for Monday May. 14, 2018

Top Story

SMIC to start 14nm risk production in H1 2019

SMIC says it will start risk production on 14nm in H1 2019, reports Digitimes.

• MagnaChip and YMC to Offer Cost Effective 0.13 micron Multiple-Time Programmable (MTP) IP Solutions
• First Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter to Record Level
• Synopsys IC Validator Certified by GLOBALFOUNDRIES for Signoff Physical Verification
• Crossbar ReRAM Enabling AI at the Edge
• Socionext Develops AI Accelerator Engine Optimized for Edge Computing
• GF Seeks Fab, ASIC Partners
• Dolphin Integration joins the RISC-V Foundation

Headlines for Friday May. 11, 2018

Top Story

Qualcomm reported to be dumping Arm-based server chips

In a blow to Arm’s multi-decade effort to get its cores into servers, Qualcomm is reported by Bloomberg to be giving up on its Arm-based server chip programme.

• TSMC April 2018 Revenue Report

Headlines for Thursday May. 10, 2018

Top Story

Adesto Announces Acquisition of S3 Semiconductors

Adesto Technologies (NASDAQ: IOTS), a leading provider of innovative application-specific semiconductors for the IoT era, announced it has acquired Dublin-based S3 Semiconductors, a global supplier of mixed-signal and RF application specific integrated circuits (ASICs) and an extensive library of design IP.

• Sankalp Semiconductor Strengthens Management Team
• Express Logic's X-Ware IoT Platform Brings Industrial-Grade IoT Device Connectivity to the AndesCore N25 and NX25 RISC-V Processors
• Silvaco Announces Relocation of Headquarters within Santa Clara
• Chipus concludes important milestone in the development of analog IP in SilTerra I18L technology

Headlines for Wednesday May. 09, 2018

Top Story

ARM loses IP market share to fast-growing followers

ARM, the undisputed leader in intellectual property core licensing, lost market share in 2017, according to market research from IPnest.

• videantis moves into new office to support growth
• MIPI Alliance Introduces Set of Touch Specifications to Standardize Touch Integration in Mobile Designs
• CEVA, Inc. Announces First Quarter 2018 Financial Results
• Arasan Announces Industries First MIPI I3C Master IP Core compliant to the I3C HCI Specifications v1.0
• UMC Reports Sales for April 2018
• Antmicro reveals partnership with Thales on the disruptive RISC-V open ISA
• Movellus Closes Funding from Intel Capital for Digital Tool Expansion Technology
• Flexera Provides Seamless Monetization Support for Arm Ecosystem
• Gfast Leader Sckipio Raises $50M to Date with New $10M Funding
• IntelliProp Announces NVMe-to-SATA Bridge IP Core
• SMIC Reports 2018 First Quarter Results

Headlines for Tuesday May. 08, 2018

Top Story

SiFive Announces Investment from Intel Capital

SiFive, the leading provider of commercial RISC-V processor IP, today announced that Intel Capital participated in its recent Series C funding round. The investment was revealed at the Intel Capital Global Summit, at which SiFive CEO Naveed Sherwani pushed for the democratization of the semiconductor industry.

• Silvaco Joins Arm Approved Design Partner Program
• NetSpeed and Northwest Logic Partner to Boost Performance in Hyperscale and Automotive SoCs
• AI Semiconductor Company Syntiant Demonstrates Analog Neural Network for Always-on Battery-powered Devices, Closes A Round Funding Led by Intel Capital
• Silex Inside upgrades IP offering for compatibility with Chinese security standards
• Comcores Announce Availability of flexible eCPRI IP solution

Headlines for Monday May. 07, 2018

Top Story

Chips&Media Unveils its first Computer Vision IP

Chips&Media Inc., a leading global video IP provider, announced the launch of its first Computer Vision IP, detecting objects with a capability to process 4K resolution at 60 frames per second input in real-time.

• Texas Instruments Expands Lead Among Top Analog Suppliers in 2017
• UltraSoC analytics IP selected by Esperanto Technologies for RISC-V many-core parallel processing in AI and ML applications
• Microsemi and SiFive Launch HiFive Unleashed Expansion Board, Enabling Linux Software and Firmware Developers to Build RISC-V PCs for the First Time
• eWBM selects Dolphin Integration's Single port SRAM and thick oxide standard cell library at GF 55 LPx
• NetSpeed and Esperanto Partner to Power SoCs for Artificial Intelligence
• True Circuits Signs Multi-year PLL License with Canaan Creative in China
• NovaSparks Introduces Pure FPGA Optmized Market Data Distribution For Microwaves Networks
• Rambus, GigaDevice, THG Ventures Form Reliance Memory to Develop RRAM
• QuickLogic Launches Comprehensive QuickAI Platform for Endpoint AI Applications
• Faraday Monthly Consolidated Sales Report - April 2018
• StreamDSP Announces Availability of VITA 17.3 sFPDP Gen 3 IP Core
• GUC Monthly Sales Report - Apr 2018

Headlines for Friday May. 04, 2018

• Xylon Appoints Sam Kasgorgis New VP of Sales and Marketing for North America
• OpenMedReady framework will promote data provenance, security, privacy and consent in remote patient monitoring
• Cambricon Selects Synopsys HAPS for Next-Generation Artificial Intelligence Processor Product

Headlines for Thursday May. 03, 2018

Top Story

AI Gets New Benchmark

Google and Baidu collaborated with researchers at Harvard and Stanford to define a suite of benchmarks for machine learning.

• Cadence Shortens Automotive Verification Closure with New Verification IP for UFS 3.0, CoaxPress, and HyperRAM
• DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface
• Algo-Logic Systems Introduces Ultra-low-latency Tick-to-Trade System with Multi-leg Turbo Spreader
• Cadence Innovus Implementation System Speeds Development of New Realtek DTV SoC Solution
• Aldec and Tamba Networks Release Ultra Low Latency Ethernet Solution for UltraScale+ FPGA at The Trading Show 2018

Headlines for Wednesday May. 02, 2018

Top Story

Control of Arm's China business transferred to Chinese investors

Control of Arm’s operations in China has been transferred to a jv controlled by Chinese investors.

• New MIPI I3C Host Controller Interface Speeds Sensor Integration
• New Arm IP Helps Protect IoT Devices from Increasingly Prevalent Physical Threats
• Alliance Ventures and Definvest acquire stakes in Kalray
• TSMC's Roadmap Full, But Thin
• Jim Keller Joins Intel to Lead Silicon Engineering
• Global Semiconductor Sales Up 20 Percent Year-to-Year in Q1
• Arm Physical IP to Accelerate Mainstream Mobile and IoT SoC Designs on TSMC 22nm ULP/ULL Platform
• Samsung Electronics Partners with Avnet ASIC Israel to Strengthen Customer Support at the Forefront of ASIC Design Services
• Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and Wafer-on-Wafer stacking technology

Headlines for Tuesday May. 01, 2018

Top Story

Cadence Prototypes First IP Interface in Silicon for Preliminary Version of DDR5 Standard Being Developed in JEDEC

The Cadence test chip was fabricated in TSMC’s 7nm process and achieves a 4400 megatransfers per second (MT/sec) data rate, which is 37.5 percent faster than the fastest commercial DDR4 memory at 3200MT/sec.

• Imperas and Andes Extend Partnership, Delivering Models and Virtual Platforms for Andes RISC-V Cores with New AndeStar V5m Extensions
• Sondrel and NetSpeed Team Up to Deliver the Fastest, Lowest-risk Route to SoC Solutions
• Arteris FlexNoC Licensed by Canaan Creative for Artificial Intelligence ASICs
• New MIPS I7200 Processor Core Delivers Unmatched Performance and Efficiency For Advanced LTE/5G Communications And Networking IC Designs
• Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation
• eSilicon deep learning ASIC in production qualification
• Cadence Supports New TSMC WoW Advanced Packaging Technology
• Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium