D&R Headline News (June 2018)

Headlines for Friday Jun. 29, 2018

• Rambus Announces Departure of Ron Black as Chief Executive Officer; Luc Seraphin Appointed Interim CEO

Headlines for Thursday Jun. 28, 2018

Top Story

Inside Secure and Andes join forces to deliver secure IoT solutions to chipmakers for greater China and Asia markets

Inside Secure and Andes Technology are announcing a strategic partnership to bring the most advanced security capabilities to chipmakers for IoT applications and cloud connectivity.

• Rafael Micro Licenses Cadence Tensilica Fusion F1 DSP for Low-Power NB-IoT Modem IC
• BlueX License CEVA Bluetooth Low Energy IP for BX2400 Wearable SoC

Headlines for Wednesday Jun. 27, 2018

• Rambus Renews License With IBM
• Mentor extends support of tools and solutions for Samsung Foundry's 8LPP and 7LPP process technologies
• China's Semi Capex Forecast to be Larger than Europe and Japan Combined in 2018
• Where Do FPGAs Stand in Auto IC Race?
• Cadence Perspec System Verifier Supports New Accellera Portable Test and Stimulus Specification 1.0
• Arteris IP Achieves Major Milestone: 100th Customer

Headlines for Tuesday Jun. 26, 2018

Top Story

7nm networking platform delivers unprecedented performance and configurability for data center ASICs

eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the availability of a complete, highly configurable 7nm IP platform targeted for networking and data center applications.

• Daimler AG Selects Xilinx to Drive Artificial Intelligence-Based Automotive Applications
• Arbe Robotics Selects Synopsys' IP to Enable its High-Resolution Imaging Radar to Achieve the Highest Automotive Safety Level for Autonomous Vehicles
• Flex Logix EFLX4K IO eFPGA Core Enables Very Wide Bus Connections for Networking Applications
• Silicon Creations' SerDes Technology Helps Power Leading-Edge 8K TV
• General Processor Technologies Announces AI Accelerator and DSP for Digital and Image Processing
• Spectral releases Silicon proven High Speed Low Power SRAM compilers in the 40/45nm CMOS/RFSOI process nodes targeted for a wide range of IOT & 5G Applications
• Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment - SAVE
• Optimum Semiconductor Unveils New Image Recognition SoC

Headlines for Monday Jun. 25, 2018

Top Story

Cadence Delivers the First Broad Cloud Portfolio for the Development of Electronic Systems and Semiconductors

Cadence Design Systems, Inc. (NASDAQ: CDNS) today launched the Cadence® Cloud portfolio, the first broad cloud portfolio for the development of electronic systems and semiconductors.

• Eta Compute and ROHM Semiconductor Collaborate to Create Low Power Wi-SUN Compatible Sensor Nodes
• Arteris IP and Magillem Partner to Create Integrated System-on-Chip Architecture Environment
• NetSpeed launches SoCBuilder - AI-powered design and integration platform to accelerate SoC designs
• Flex Logix Improves Deep Learning Performance By 10X With New EFLX4K AI eFPGA Core
• C-SKY Microsystems Selects QuickLogic as Their Strategic eFPGA Partner by Signing Master Technology License Agreement
• Moortec Supporting Today's Connectivity Boom with IoT Specific Embedded In-Chip Monitoring Subsystem Solution
• CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World's First eNB-IoT Rel14 Solution
• 9 of the Top 12 Smartphone Suppliers Headquartered in China
• Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications
• Gidel Launches Lossless Compression IP that Reduces Storage Needs by Over 50%, Utilizing Only 1% of the FPGA, with Low Power Consumption
• Synopsys RedHawk Analysis Fusion Certified for Samsung Foundry's 10LPE, 8LPP, 7LPP Advanced-Node Designs
• Synopsys Custom Design Platform Accelerates Robust Custom Design for Samsung Foundry's 7LPP Process Technology
• Truechip Collaborates with Gowin Semi for Verification of USB Type C & PD
• Cadence Collaborates with Amazon Web Services to Deliver Electronic Systems and Semiconductor Design for the Cloud
• Synopsys' ASIP Designer Tools Enables RIKEN to Successfully Develop Application-Specific Instruction-Set Processor in Less Than Six Months
• WiLAN Subsidiary Acquires Patent Portfolio from MagnaChip
• Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform
• SiFive Unveils E2 Core IP Series for Smallest, Lowest Power RISC-V Designs

Headlines for Friday Jun. 22, 2018

Top Story

XTERCONNECT & GENIATECH Partner with CORTUS to enable Secure IoT Solutions based on Dash7 Technology

XTERCONNECT and GENIATECH having already developed a range of professional industrial IoT solutions using LoRa technology have entered into a Strategic and Industrial Partnership with CORTUS to develop and deliver a range of secure products and solutions for IoT using its CIoT25 Low Power Internet of Things Platform based on Dash7 technology.

• Siemens acquires Austemper Design Systems for breakthrough IC functional safety technology
• True Circuits Attends Design Automation Conference, Celebrates 20 Years of Timing Excellence!
• Vatics Standardizes on Synopsys' Fusion Technology for its Next-Generation Multimedia SoC Design
• Arm and Samsung Foundry push the possibilities of semiconductor manufacturing

Headlines for Thursday Jun. 21, 2018

Top Story

NetSpeed unveils Orion AI - Delivering extreme performance and ultimate efficiency for next-gen AI SoCs

NetSpeed Systems today announced the release of Orion AI, the industry’s first SoC interconnect solution targeted specifically for AI-enable SoC applications. It includes advanced features such as multicast and broadcast to improve performance and efficiency in AI-enable SoCs and accelerator ASICs used for datacenters, autonomous vehicles, AR/VR, and advanced video analytics.

• Intel CEO Brian Krzanich Resigns, Board Appoints Bob Swan as Interim CEO
• UltraSoC embedded analytics and Imperas virtual platforms combine to enhance multicore development and debug
• Silexica raises $18m in Series B funding to advance software development solutions for autonomous driving
• SoftBank confirms sell-off of ARM China stake
• Synopsys Delivers PrimePower Power Analysis to Accelerate Robust SoC Design
• Andes Certifies Imperas Models and Simulator as a Reference for Andes RISC-V Cores

Headlines for Wednesday Jun. 20, 2018

Top Story

M31 Receives ISO 26262 Development Process Certification and Enters Advanced Automotive Electronics Market

Technology Corporation (stock code: 6643), a global Silicon Intellectual Property (IP) boutique, today announced that it has obtained the certificate for vehicle functional safety - ISO 26262 development process from the German certification organization SGS-TÜV.

• North American Semiconductor Equipment Industry Posts May 2018 Billings
• PLDA Announces Second Annual "PLDA Design Day", in Shanghai, China - a Free Design Workshop, 100% Focused on PCIe Design
• T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018
• Achronix to Demonstrate Embedded FPGA Solutions at Design Automation Conference
• QuickLogic to Exhibit at DAC 2018

Headlines for Tuesday Jun. 19, 2018

Top Story

Arasan Announces SD Card UHS-II PHY IP for 12nm SoC Designs

Arasan today announced the immediate availability of its SD Card UHS-II PHY for 12nm SoC designs compliant to the latest 4.1 Specification supporting speeds of up to 3.12 Gbps.

• Intrinsic ID Names Kumi Thiruchelvam Vice President, Europe & Asia Sales
• Flex Logix EFLX1K eFPGA Cores Enable Array-Efficient Reconfigurable Logic on 40nm to 180nm Nodes
• CCIX Consortium Enables Next Generation Compute Architectures with the Availability of Base Specification 1.0
• Inside Secure to Provide Secure Provisioning Solutions to NationalChip
• Moortec will be exhibiting their In-Chip Monitoring Subsystem IP at DAC 2018 in San Francisco

Headlines for Monday Jun. 18, 2018

Top Story

Artosyn License and Deploy CEVA-XM4 Intelligent Vision Platform for Embedded AI SoC

CEVA, today announced that Artosyn Microelectronics, a leading supplier of drone and robots system-on-chip (SoCs) in China has licensed and deployed the CEVA-XM4 intelligent vision platform to power the computer vision and deep learning workloads of its upcoming AR9X01 artificial intelligence (AI) SoC.

• Broadcom lays off 1,100; may lay off more
• Black Pepper Spices up the Arm Approved Design Partner Program
• Synopsys Unveils Next-Generation ZeBu Server 4
• Wave Computing Extends AI Lead by Targeting Edge of Cloud Through Acquisition of MIPS
• Dolphin Integration presents its know-how in EDA for safe Power Regulation Networks implementation at ENIAC's THINGS2DO E.U. project final review

Headlines for Thursday Jun. 14, 2018

Top Story

Arm Ready to Sacrifice Profits for Long-Term IoT Growth

Arm is better positioned as a privately held company to take a strategic approach for long-term growth as it addresses the IoT market, according to Rajeev Misra, CEO of SoftBank’s $100B Vision Fund and a director of the SoftBank Group.

• Creonic's Quality Management System Achieves ISO 9001:2015 Certification
• Costs Dog PCIe Speed Gains
• Veea Acquires Virtuosys to Bolster Edge Computing Platform, Advancing IoT-Enabled Devices and Smart Applications
• AI Startup Wave Computing To Buy MIPS
• Synopsys Fusion Technology Enables Lower Power, Smaller Area, and Higher Performance on Samsung Foundry 7LPP Process with EUV
• Synopsys IC Validator Certified by Samsung Foundry for 7nm Signoff Physical Verification
• SystemC Ecosystem gets boost with Accellera's new SystemC CCI 1.0 Standard
• Industrial Internet and Connected Vehicles Drive IoT Sales Through 20211

Headlines for Wednesday Jun. 13, 2018

Top Story

Chips&Media launches HEVC/H.264 combined codec IP (Single Core) optimized for UHD (4K, 60 FPS)

Chips&Media, Inc. a leading video IP company headquartered in Seoul, Korea, announced the introduction of WAVE521C, a new codec IP with single core based integrated HEVC and H.264.

• Arm Expands IoT Connectivity and Device Management Capabilities with Stream Technologies Acquisition
• Xpeedic's IRIS Certified for EM Simulation in GLOBALFOUNDRIES 22FDX Process
• Shanghai Huali Microelectronics Corporation (HLMC) Announces Collaboration with Adesto and CNE around RRAM Technology for RFID, Stand Alone NVM and Microcontroller Applications

Headlines for Tuesday Jun. 12, 2018

Top Story

Cambricon Licenses NetSpeed Fabric IP for Its Next-Gen Artificial Intelligence Products

NetSpeed Systems today announced that Cambricon Technologies, a leader in China’s AI market, has licensed NetSpeed’s Interconnect IP for use in its next generation system-on-chips (SoCs).

• National Instruments Adopts AccelerComm's 5G NR Polar IP
• Semiconductor Equipment Record Spending Streak To Continue Through 2019
• CAST Adds JPEG-LS Decoder to Lossless Image Compression IP Core Suite
• Faraday Exhibits AI FPGA-to-ASIC Solution and IoT SoC Platform at DAC 2018
• HunterSun Corporation Licenses AndesCore N1068A-S for Its HS6601 Single-Chip Bluetooth SoC Targeting Wireless Audio Applications
• Globalfoundries Cuts 5% of Workforce
• Baum Launches New Version of Power Modeling, Analysis Solutions for Hardware Design
• Breker Verification Systems Unveils Next-Generation Trek5 with Fully Compliant Support for Accellera Portable Stimulus Standard

Headlines for Monday Jun. 11, 2018

• MIPS I6500-F First High Performance 64 Bit Multi-Cluster CPU IP to Receive ISO 26262 and LEC 61508 Certification
• Mentor Veloce hardware emulation platform now available on Amazon Web Services
• Fraunhofer's xHE-AAC Audio Codec Software Extends Native AAC Support In Android P For Better Quality At Low Bitrates

Headlines for Friday Jun. 08, 2018

Top Story

PowerVR Series2NX neural network accelerator cores set the standard for performance and cost-efficiency

Imagination Technologies announces two neural network cores, the AX2185 and AX2145, designed to enable high-performance computation of neural networks at very low power consumption in minimal silicon area.

• TSMC May 2018 Revenue Report
• UMC Reports Sales for May 2018
• Wally Rhines: Deep Learning Will Drive Next Wave of Chip Growth
• Real Intent Awarded U.S. Patent for Methods and Systems for Correcting X-pessimism in Gate-level Simulation or Emulation
• Credo Demonstrates Robust 200G & 400G Connectivity Product Solutions at Computex 2018

Headlines for Thursday Jun. 07, 2018

Top Story

Cortus Asserts Intellectual Property Claims Against Microsemi, a Wholly Owned Subsidiary of Microchip Technology Inc. (Nasdaq: MCHP)

Cortus S.A.S (“Cortus”) has asserted breach of contract, copyright infringement and trade secret misappropriation claims in ICC arbitration against Microsemi, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), which is a Licensee of Cortus under a Software License Agreement.

• Arteris IP Announces CodaCache Standalone Last Level Cache
• AI Comes to ASICs in Data Centers
• Arm Sells Stake in China JV as EU Warns of Unfair Practice
• Intento Design Cooperates with STMicroelectronics to Accelerate Analog Design and Migration of FD-SOI Chips at Functional Level
• Faraday Monthly Consolidated Sales Report - May 2018

Headlines for Wednesday Jun. 06, 2018

Top Story

Hailo Raises $12.5 Million Series A Round to Develop Deep Learning Processor for Embedded AI Applications

Hailo, a company developing a proprietary chip for deep learning on edge devices, today announced the completion of a $12.5 million Series A round.

• Sonics Partners With Synkom To Incorporate NoC and EPU IP Into Its Leading Semiconductor Design Services For Japan Customers
• IEEE Announces Formation of Two New IEEE 802.11 Study Groups
• Global Semiconductor Sales Increase 20 Percent Year-to-Year in April; Double-Digit Annual Growth Projected for 2018
• Globalfoundries to add another NVM to FDSOI
• Mobiveil and Avery Design Systems Partner to Provide SoC Designers a Fully Verified and Compliant PCIe 5.0 IP Solution
• TSMC Shareholders Approve NT$8 Cash Dividend and Elect Board of Directors; Board of Directors Elect Mark Liu as Chairman and C.C. Wei as CEO and Vice Chairman
• PLDA to Demonstrate Industry's First PCIe 4.0 Switch Platform with Multiple Downstream Ports during PCI-SIG DevCon 2018

Headlines for Tuesday Jun. 05, 2018

Top Story

eSilicon revolutionizes machine learning ASIC platform (MLAP) market

eSilicon announced today at the Machine Learning and AI Developer’s Conference a fundamentally new approach to building application-specific integrated circuits (ASICs) for artificial intelligence (AI)/neural network applications called the neuASIC platform.

• GUC Monthly Sales Report - May 2018
• Synopsys Delivers AI-enhanced Digital Design Platform Bringing Artificial Intelligence to Design Implementation
• Sankalp Semiconductor to Exhibit at Design Automation Conference - 2018

Headlines for Monday Jun. 04, 2018

Top Story

PLDA Announces Availability of XpressRICH5 PCIe 5.0 Controller IP

PLDA today announced availability of their XpressRICH5™ PCIe® 5.0 Controller IP. PLDA’s XpressRICH5 supports rev. 0.7 of the PCIe 5.0 Specification and is available for ASIC, SoC and FPGA implementation, allowing early adopters to seamlessly improve their link throughtput to 32 GT/s per lane and reduce their overall latency.

• Dolphin Integration makes available in free download its innovative IDE SmartVision, for the RISC-V ecosystem
• IP Cores, Inc. Announces Modifications of the 400 Gbps MACsec IP Cores
• Automotive IC Market on Pace for Third Consecutive Record Growth Year
• Arm Targets Laptop Performance
• Avery Design Systems Fast Tracks PCI Express 5.0 VIP
• Worldwide Semiconductor Equipment Billings in First Quarter 2018 Reach Record $17.0 Billion, SEMI Reports
• Irwin Jacobs on Qualcomm and Moore
• PathPartner to Showcase Innovations in Face Recognition and Automotive Vision at TU-Automotive, Detroit 2018

Headlines for Friday Jun. 01, 2018

Top Story

Arm announces new suite of IP for premium mobile experiences

For Small Screens to Large: Introducing a New Suite of IP for Premium Mobile Experiences

• Cadence Full-Flow Digital and Signoff Tools and Verification Suite Provide Optimal Results for 7nm Arm Cortex-A76 CPU Designs