D&R Headline News (July 2018)

Headlines for Tuesday Jul. 31, 2018

Top Story

Arm to Spend $600 Million to Widen IoT Ecosystem Offer

Processor IP vendor Arm is reported to be finalizing an agreement to acquire Mountain View, Calif.-based data analytics firm Treasure Data for $600 million. This follows its acquisition in June of Stream Technologies, a unified connectivity management platform for IoT devices, and its investment in San Jose-based SWIM.ai.

• Thalia-DA and Catena confirm successful tape-outs of first analog IP re-use projects
• Innosilicon's Bitcoin ASIC powered by Samsung's Low Power FinFET technology to achieve record breaking performance
• IP Cores, Inc. Announces One-Year Anniversary of the Delivery of XTS4 Cores for the Server Memory Encryption
• eMemory's Reprogrammable eNVM solution available on TowerJazz BCD platform

Headlines for Monday Jul. 30, 2018

Top Story

Chips&Media announced new ISP deal to provide 4K UHD (8Mpixel) resolution Image Signal Processing (ISP) IP

Chips&Media, Inc. a leading video IP company headquartered in Seoul, Korea, announced licensing contract to provide 4K (8Mpixel) resolution Image Signal Processing (ISP) IP with a Taiwanese SoC manufacturer.

• Rambus Appoints Sanjay Saraf to Board of Directors
• Second Quarter 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter - All-Time Quarterly High
• H1 2018 results: Inside Secure announces strong profitable growth
• Digital Blocks Extends its MIPI I3C Controller IP Core Family with I3C Master/Slave, I3C Master, and I3C Slave Releases.
• ONKYO Joins HEVC Advance to Expand HEVC/H.265 Video Compression Technology
• Moore's Law, China vs. Team USA
• Intel Claims Progress on 10nm Yields

Headlines for Sunday Jul. 29, 2018

Top Story

PLDA and HPE collaborate to develop Gen-Z semiconductor IP

Hewlett Packard Enterprise (HPE) and PLDA®, an industry leader in high-speed interconnect IP, today announced a joint collaboration to meet the challenges of next-generation connectivity for advanced workloads.

Headlines for Friday Jul. 27, 2018

• Chipus Brings Ultra-Low-Power IP to SiFive's DesignShare Ecosystem
• Sankalp Semiconductor Appoints Sathish Kumar Ganesan as Vice President Engineering

Headlines for Thursday Jul. 26, 2018

Top Story

Qualcomm-NXP deal off

As expected, China’s regulatory approval for the takeover of NXP by Qualcomm had not been received by the deadline of midnight New York time yesterday and the deal has been called off.

• Xilinx Reports Record Quarterly Revenues And EPS; Raises Fiscal Year 2019 Guidance
• ADASMark Autonomous Driving Benchmark Suite Is Now Available for Licensing From EEMBC
• Applied, ARM to develop CeRAM for neuromorphic applications
• Chinese chipmaker Tsinghua Unigroup to buy France's Linxens for $2.6 billion: sources
• Efinix Expands Executive Leadership Team and Board of Directors

Headlines for Wednesday Jul. 25, 2018

Top Story

Kandou Bus Closes Series B Investment Round

Kandou Bus, S.A., a world leader in development of SerDes IP and chip solutions, has completed its Series B investment round with a $15M investment from Bessemer Venture Partners and Walden Investment. The close of the Series B signifies Kandou’s accomplishment of critical research and development milestones and key design wins.

• Silicon Industry Veteran Joins SiFive Executive Team
• North American Semiconductor Equipment Industry Posts June 2018 Billings
• C-SKY selects UltraSoC embedded intelligence for Chinese developed AI SoC
• BrainChip Unveils the Akida Development Environment

Headlines for Tuesday Jul. 24, 2018

Top Story

Synopsys Targets 400G Hyperscale Data Centers with High-Performance Ethernet IP

Synopsys, Inc. (Nasdaq: SNPS) today announced the new DesignWare® 56G Ethernet PHY IP for emerging 400 gigabit-per-second (Gbps) hyperscale data center system-on-chips (SoCs). The advanced 56G Ethernet PHY architecture incorporates Synopsys' silicon-proven data converters with a configurable transmitter and digital signal processor (DSP)-based receiver to deliver the best power and performance tradeoffs for the target application.

• Dolphin Integration announces a new release of its innovative IDE for the RISC-V ecosystem
• ESD Alliance Reports EDA Industry Revenue Increase For Q1 2018
• Samsung Foundry and Arm Expand Collaboration to Drive High-Performance Computing Solutions
• Microsemi PolarFire FPGAs Enable Smallest, Lowest Power DisplayPort Implementations with New IP from Bitec
• Gowin Semiconductor Corp. announces LittleBee Family GW1NS Series GW1NS-2K FPGA SoC Device Engineering Samples and Development Board Available
• NXP and Dover Microsystems Join Forces to Deliver Unprecedented Network Security, Safety, and Privacy for Processors
• Cadence Selected for DARPA ERI Machine Learning Contract to Accelerate Electronic Design Innovation
• Samsung developing new GPU
• AI, China Dominate Semiconductor Funding

Headlines for Monday Jul. 23, 2018

• Cadence Introduces Voltus-XP Technology with Extensive Parallelism, Up to 5X Acceleration, and Increased Capacity for Power Signoff at Advanced Nodes
• Android Wants to Be Truly Free
• Will Robocars Need More than Ethernet?
• Data Center Scaling at Breakneck Pace

Headlines for Friday Jul. 20, 2018

• EASii IC (France) becomes Arm Approved Design Partner

Headlines for Thursday Jul. 19, 2018

Top Story

Ferroelectric Memory Company receives growth financing from eCAPITAL and HTGF

Ferroelectric Memory Company (FMC), an enterprise that commercializes technology for disruptive non-volatile memory solutions for microcontrollers, announced today the successful closing of a € 4.6 million growth financing led by eCAPITAL entrepreneurial Partners AG under participation of High-Tech Gründerfonds.

• Texas Instruments: Brian Crutcher resigned as CEO
• Stratix 10 FPGA: REFLEX CES launches an 800G acceleration card
• Semi Content in Electronic Systems Forecast to Reach 31.4% in 2018
• TSMC Reports Second Quarter EPS of NT$2.79
• Open-Silicon and Credo Demonstrate Solutions for Deep Learning and Networking Applications at TSMC OIP and Symposium in Amsterdam
• Credo Demonstrates Industry Leading SerDes on TSMC's 7nm Process at TSMC 2018 OIP Forum and Technology Symposium in Amsterdam
• Lattice Semiconductor Takes Additional Action to Reduce Operating Expenses; Company to Discontinue Millimeter Wave Business to Focus on Core Business Opportunities
• SWIM.AI Secures $10M in Series B Funding

Headlines for Wednesday Jul. 18, 2018

Top Story

Xilinx Announces the Acquisition of DeePhi Tech

Xilinx, Inc. (NASDAQ: XLNX) the leader in adaptive and intelligent computing, announced today that it has acquired DeePhi Technology Co., Ltd (DeePhi Tech), a Beijing-based privately held start-up with industry-leading capabilities in machine learning, specializing in deep compression, pruning, and system-level optimization for neural networks.

Headlines for Tuesday Jul. 17, 2018

Top Story

Is This the Moment for RISC-V?

At the GSA Executive Forum in Munich last month, Naveed Sherwani, CEO of SiFive, talked about the "democratization of silicon" as a result of deployment of open architectures, and how all microcontroller units will be based on RISC-V in the next three years.

• Rambus and Socionext Sign Broad Patent License Agreement
• HDL Design House Greece Joins HETIA

Headlines for Monday Jul. 16, 2018

• Arm joins industry leaders in commitment to fair enforcement of open source licenses
• AI Becomes the New Moore's Law

Headlines for Friday Jul. 13, 2018

Top Story

Intel to Acquire eASIC

Intel Plans to Expand Its Portfolio to Include Structured ASICs, which are Well Suited for High-Performance and Power-Constrained Applications

• ArcSoft and Cadence Partner to Develop AI and Vision Applications
• DSP Group and Inside Secure Collaborate on Development of Advanced Secured AI Processors
• Cadence Automotive Solution for Safety Verification Used by ROHM to Achieve ISO 26262 ASIL D Certification

Headlines for Thursday Jul. 12, 2018

• Moortec to exhibit at the TSMC Europe Open Innovation Platform Ecosystem Forum & Technology Symposium
• AMIQ EDA Announces its Design and Verification Tools Eclipse IDE Supports First Release of Accellera Portable Test and Stimulus Standard (PSS)

Headlines for Wednesday Jul. 11, 2018

• Veriest appoints Vukota Pekovic as General Manager, Serbia

Headlines for Tuesday Jul. 10, 2018

Top Story

Arteris IP Ncore and FlexNoC Interconnects and Resilience Packages Licensed by Mobileye for AI-Powered EyeQ Chips

Arteris IP today announced that Mobileye has purchased multiple licenses of Arteris IP Ncore Cache Coherent Interconnect, FlexNoC Interconnect, and the Ncore and FlexNoC Resilience Packages for functional safety and artificial intelligence (AI) hardware acceleration.

• Stratix 10 SoC: REFLEX CES is releasing to market its new version of the COM Express module based on Stratix 10 SoC technology from Intel PSG
• Terminus Circuits Brings Complete ASIC Solutions to DesignShare
• GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX Technology
• TSMC June 2018 Revenue Report
• Inside Secure Technology Chosen to Secure Kalray's Intelligent Processors for Autonomous Vehicles and Next-Generation Data Centers

Headlines for Monday Jul. 09, 2018

• EDA Takes to the Cloud (Sort of)
• UMC Reports Sales for June 2018
• Baidu Accelerator Rises in AI
• Cadence JasperGold Formal Verification Platform Enables Hitachi to Develop Measures for Fault Avoidance to Comply with IEC 61508 Series SIL 4 Requirements
• Hardware: Golden Age or Golden Ager?
• Renode 1.4 released: 64-bit RISC-V HiFive Unleashed support, multiple Silicon Labs targets, and more

Headlines for Friday Jul. 06, 2018

Top Story

Silex Inside eSecure Root-of-Trust Security IP Is Excellent Fit with RISC-V Cores

Silex Inside announces that its comprehensive eSecure IP solution is also available for RISC-V architectures. eSecure is a silicon proven IP module that turns ASIC, FPGA or SoC designs into fully secured applications that guarantee the authenticity and integrity of the hardware, software, data, and communication.

• Faraday Monthly Consolidated Sales Report - June 2018

Headlines for Thursday Jul. 05, 2018

• GUC Monthly Sales Report - June 2018

Headlines for Wednesday Jul. 04, 2018

Top Story

Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration

Synopsys, Inc. (NASDAQ: SNPS) and Siemens PLM Software today announced that they have agreed to collaborate on a wide range of electronic design automation (EDA) product interoperability projects for the benefit of their mutual customers. The collaboration spans a number of EDA domains from design to verification.

Headlines for Tuesday Jul. 03, 2018

Top Story

Silex Inside releases a secure connection engine

The newly released BA452 is a secure connection engine that can be used to off-load the compute intensive Public Key operations (Diffie-Helmann, Signature Generation and Verification).

• Cadence Full-Flow Digital and Signoff Tools Certified on Samsung Foundry's 7LPP Process Technology

Headlines for Monday Jul. 02, 2018

Top Story

CAST Releases TSN Ethernet Subsystem for Automotive and Industrial Applications

Semiconductor intellectual property provider CAST, Inc. concluded Design Automation Conference (DAC) week by announcing the only available IP subsystem implementing the latest IEEE standards for Time Sensitive Networking (TSN) over Ethernet.

• Global Semiconductor Sales in May Increase 21 Percent Year-to-Year
• Siemens-Mentor: How's It Working Out?
• Sonics Partners With SiFive To Support Agile RISC-V SoC Design Platform With IP Industry's Most Widely Used NoCs
• L&T Technology Services launches new NB-IoT Protocol Stack IP, collaborates with Cadence to facilitate smart connectivity
• Blu Wireless HYDRA 1.X mmWave IP validated in successful real-world trial
• UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor
• EDA Startup Rises From Ashes of ATopTech
• GLOBALFOUNDRIES to Deliver Socionext's Next Generation Graphics Controller for Advanced In-Vehicle Display Applications
• Inomize joins Arm Approved Design Partner program