D&R Headline News (August 2018)

Headlines for Friday Aug. 31, 2018

• Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC China 2018
• Cadence Full-Flow Digital Tool Suite Achieves GLOBALFOUNDRIES 22FDX Certification
• Socionext Establishes "ForteArt" to Enhance Sound Quality in Wide Range of Applications

Headlines for Thursday Aug. 30, 2018

Top Story

Jon Peddie Research reports the Q2'2018 GPU shipments

Overall GPU shipments decreased -1.5% from last quarter, AMD decreased -12.3%, Nvidia decreased -7% and Intel, increased 3%.

• SMIC Announces Unaudited 2018 Interim Results
• Yocto Project Welcomes New Members, Advances Open Source Embedded Systems Through Momentum
• MRAM Makes a Move into the Embedded Space

Headlines for Wednesday Aug. 29, 2018

Top Story

Apple Goes Vertical & Why It Matters

As part of EE Times’ look at Apple’s march to becoming the first trillion-dollar company, I will look at their “modern” semiconductor work.

• Rambus and Infineon Renew Patent License Agreement
• Frontier collaborates with NXP on new Smart IoT software licensing business
• Memory ICs to Account for 53% of Total 2018 Semi Capex

Headlines for Tuesday Aug. 28, 2018

Top Story

Faraday ASIC Service Leverages Samsung FinFET Platform to Target Next-generation Applications

Faraday Technology today announced that it is leveraging Samsung FinFET platforms to extend its ASIC design solutions in next-generation applications, such as artificial intelligence (AI), 5G/infrastructure networking, blockchain, cloud storage, high-performance computing (HPC), AR & VR, and high-end imaging.

• Analysis: Outpaced by TSMC, GloFo cuts its cloth
• Gartner Says Huawei Secured No. 2 Worldwide Smartphone Vendor Spot, Surpassing Apple in Second Quarter 2018
• RoodMicrotec selected as key partner for EnSilica automotive ASIC project
• GLOBALFOUNDRIES Reshapes Technology Portfolio to Intensify Focus on Growing Demand for Differentiated Offerings
• Lattice Semiconductor Appoints Jim Anderson as CEO
• Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification

Headlines for Monday Aug. 27, 2018

Top Story

GOWIN Semiconductor Corp. Announces RISC-V Microprocessor Implementation for GOWIN FPGA Solutions and Expands Sales Channels in the Americas Region

GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, announces their development of RISC-V Microprocessor IP implemented in their current ARORA® Family GW-2A FPGA products.

• Synopsys Delivers 10X Performance in Formal Property Verification with Breakthrough Machine Learning Technology
• Drone.io Announces Official Support for Arm Architectures

Headlines for Friday Aug. 24, 2018

• North American Semiconductor Equipment Industry Posts July 2018 Billings

Headlines for Thursday Aug. 23, 2018

Top Story

Worldwide Semiconductor Revenue Hit Record $120.8 Billion in Q2 2018, IHS Markit Says

Global semiconductor industry revenue grew 4.4 percent, quarter over quarter, in the second quarter of 2018, reaching a record $120.8 billion. Semiconductor growth occurred in all application markets and world regions, according to IHS Markit.

• Apple, Intel Good Partners, For Now
• Apple, Qualcomm in Fatal Attraction
• Fujitsu Presents Post-K CPU Specifications
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2018

Headlines for Wednesday Aug. 22, 2018

Top Story

Imagination Technologies: Life after Apple

It seems that 2017 was a year of major disruption in Apple’s established U.K. supplier roster. The one most impacted by this is Imagination Technologies, who supplied its PowerVR graphics processing unit (GPU) chips.

• Flex Logix Partners with Quantum Leap Technical Sales To Meet Strong Demand for EFLX Embedded FPGA Throughout North America
• Apple-TSMC Sole-Source Embrace Holds Risk for iPhone Maker

Headlines for Tuesday Aug. 21, 2018

Top Story

Soitec and MBDA to Acquire Dolphin Integration Assets

Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, and MBDA, announce the joint acquisition of Dolphin Integration.

• IP Cores, Inc. Announces an Update for Its True Random IP Core
• ASIC Design Services Adds Core Deep Learning IP to SiFive DesignShare Program

Headlines for Monday Aug. 20, 2018

Top Story

Seven Top-15 1H18 Semi Suppliers Register ≥20% Gains

Samsung extends its number one ranking and sales lead over Intel to 22%.

• SiFive Announces First Open-Source RISC-V-Based SoC Platform With NVIDIA Deep Learning Accelerator Technology
• Esperanto Technologies Expands AI Engineering Leadership Team
• Xilinx Unveils its Vision for the Future of Computing, Details New Programmable Engine Fabric and Multiple AI Technologies

Headlines for Friday Aug. 17, 2018

Top Story

Accelerating mobile and laptop performance: Arm announces Client CPU roadmap

Over the last five years, advances in Arm technology have brought desktop-class PC performance into our smartphones, fundamentally changing how we use technology in our daily lives. This is a direct result of Arm’s annual cadence of introducing new world-class CPU designs, which have delivered double-digit gains every year in instructions-per-clock (IPC) performance since 2013.

• Skyworks Closes Acquisition of Smart Interface Innovator Avnera Corporation

Headlines for Thursday Aug. 16, 2018

Top Story

Size of Semiconductor Acquisitions May Have Hit Limit

Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism among more countries, and growing global trade frictions.

• SK Telecom Deploys Xilinx FPGAs for AI Acceleration, Achieves 5X Performance/16X Performance-per-watt over GPUs
• Bluespec, Inc. Releases a New Family of Open-Source RISC-V Processors

Headlines for Wednesday Aug. 15, 2018

Top Story

Arasan Announces NAND Flash Controller PHY and I/O Pad IP compliant to ONFI 4.1 Specifications

Arasan today announced the immediate availability of its NAND Flash Controller PHY and I/O Pad IP for 12nm SoC designs compliant to the latest ONFI 4.1 Specifications. The PHY IP is also backward compatible with ONFI 4.0 and 3.2 specifications.

• IBM and Synopsys Accelerate Post-FinFET Process Development with DTCO Innovations
• Faraday Unveils the Industry's Smallest USB 2.0 OTG PHY IP

Headlines for Tuesday Aug. 14, 2018

• The Linley Group Microprocessor Report Details eSilicon 7nm IP
• OPENEDGES Joins SiFive's DesignShare
• Antmicro and SiFive join forces to propose complete RISC-V offering
• Cadence Palladium Z1 Enterprise Emulation Platform Enables GUC to Accelerate SoC Design
• UltraSoC selects MosChip to support its growth in India
• SEMI Integration of ESD Alliance Underway

Headlines for Monday Aug. 13, 2018

Top Story

Argon Design Releases Argon Streams AV1

Argon Design Ltd announced today that it has released Argon Streams AV1. This release coincides with the formal release of the AV1 Bitstream and Decoding Process Specification by the industry wide consortium Alliance for Open Media.

• Intel in the Cloud Post-Moore's Law
• Startup AI Chip Passes Road Test

Headlines for Friday Aug. 10, 2018

• DRAM Sales Forecast to Top $100 Billion This Year with 39% Market Growth
• TSMC July 2018 Revenue Report

Headlines for Thursday Aug. 09, 2018

Top Story

Andes Technology forms a Multinational Alliance with ASIC Design Service Companies to Provide RISC-V Total Solutions

Andes Technology has created a RISC-V core licensing project and has signed joint promotion agreements to form a multinational design service alliance with several top ASIC/SoC design service companies. The alliance is expected to continue expanding eventually reaching 20 or more companies globally in the following several months.

• UMC Reports Sales for July 2018
• SMIC Reports 2018 Second Quarter Results
• Skyworks to Acquire Smart Interface Innovator Avnera Corporation

Headlines for Wednesday Aug. 08, 2018

Top Story

PLDA Announces Integration of their PCIe 3.0 Controller IP into Kazan Networks' NVMe Over Fabric Fuji ASIC, Providing a Dramatic Increase in Scalability and Flexibility for Storage Applications

PLDA, the industry leader in PCI Express® IP solutions and Kazan Networks, a leader in advanced storage technology based on the NVMe over Fabric (NVMe-oF™) standard, today announced the integration of PLDA’s XpressRICH3™ PCI Express Controller IP into Kazan’s Fuji NVMe-oF Bridge ASIC

• QuickLogic Collaborates with ETH Zurich to Integrate eFPGA into PULP Platform
• Arm targets any number of devices and any type of data
• CEVA, Inc. Announces Second Quarter 2018 Financial Results
• Mobiveil Inc. and SiFive, Inc. partner to develop RISC-V based configurable SSD Platform For Data Center and Enterprise storage Applications
• India Startup Preps RISC-V, AI Cores

Headlines for Tuesday Aug. 07, 2018

Top Story

Avery Design Systems Pairs PCIe and NVM Express VIP with Teledyne LeCroy Summit Protocol Exercisers

Avery Design Systems today announced integration of the company’s flagship PCI Express® (PCIe®) and NVM Express® (NVMe) VIP solutions with Teledyne LeCroy Summit Z3-16™and Z416™ Protocol Exercisers.

• FADU Launches Industry Leading SSD Solutions Powered by SiFive RISC-V Core IP
• eSilicon Licenses Industry-Leading SiFive E2 Core IP for Next-Generation SerDes IP
• Achronix and Mentor Partner to Provide Link Between High-Level Synthesis and FPGA Technology
• eMemory's 2nd Generation NeoMTP Enables a Wide Range of Power Management Applications on DB HiTek's BCD Process
• Lekha Wireless appoints T2M for global marketing, representation and business development

Headlines for Monday Aug. 06, 2018

Top Story

Arm acquires Treasure Data to set the stage for IoT transformation

The Internet of Things (IoT) will give businesses superpowers. Whether it’s an energy provider drawing data from its infrastructure to sense failures; a sensor-equipped building anticipating and then proactively dealing with occupants’ needs; or a retailer using data streams from its stores and warehouses to streamline operations – IoT systems can be transformational.

• Lessons from the Broadcom-Qualcomm Debacle
• Q'comm-NXP Break-Up: There Will Be Fallout
• Where Did Qualcomm Go Wrong?
• Mid-Year Global Semiconductor Sales Up 20.4 Percent Compared to 2017
• TSMC Details Impact of Computer Virus Incident
• GUC Monthly Sales Report - July 2018
• UMC and Avalanche Technology Partner for MRAM Development and 28nm Production
• IntelliProp to Demo Gen-Z 1.0 Compliant IP at Flash Memory Summit 2018

Headlines for Thursday Aug. 02, 2018

Top Story

Wave Computing Announces Strategic Collaboration with Broadcom For Next-Generation AI DPU ASIC

Wave Computing today announced a strategic collaboration with Broadcom Inc.. The companies will collaborate to bring Wave’s next-generation dataflow processing unit (DPU) to market at the leading-edge 7nm process node.

• MIPI Alliance to Advance Autonomous Driving, other Automotive Applications with New Data Interface Specifications at 12-24 Gbps and Beyond
• Microsemi Announces Sampling of Industry's Highest Performing Enterprise Gen 4 PCIe Controller
• Numem exhibits and presents at MRAM Developer Day
• UltraSoC brings SEGGER J-Link to embedded debug and analytics environment
• WiLAN Provides Litigation Update
• Arasan to demonstrate its SD Card UHS-II PHY IP and eMMC 5.1 PHY IP for 12nm SoC Designs at the 2018 Flash Memory Summit
• Numem exhibits at the Flash Memory Summit
• Stratix 10 FPGA: REFLEX CES adds 26G Acceleration hardware to the "XpressGXS10-FH200G" line already shipping.

Headlines for Wednesday Aug. 01, 2018

Top Story

Nurlink and Vidatronic Collaborate to Develop SoC for Internet of Things (IoT) Applications

Vidatronic, Inc., a leading developer of CMOS power management and radio frequency (RF) power intellectual property (IP) cores, today announced a collaboration with RF system-on-a-chip (SoC) design company, Nurlink Technology, to develop an unprecedented SoC solution built to power wireless communication systems for the Internet of Things (IoT).

• Qualcomm Vets Join Blockchain RISC-V Chip Developer