D&R Headline News (September 2018)

Headlines for Friday Sep. 28, 2018

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T2M announces its first Image Signal Processing (ISP) Technology for advanced mobile camera applications

T2M, the world’s largest independent global semiconductor IP provider, announced the launch of its first low-power digital image processor IP designed to perform advanced image correction and enhancement, resulting in superior image quality in today’s multi-megapixel cameras.

Headlines for Thursday Sep. 27, 2018

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M31 MIPI M-PHY is certified with ASIL-B safety level of ISO 26262 to provide safe and reliable automotive SoC design

M31 Technology announced today that its MIPI M-PHY Gear3 IP has been certified with the ASIL B safety level of ISO 26262 and will be used by international first-class automotive electronics manufacturers to provide safe and reliable automotive SoC design.

• GreenWaves Technologies Licenses Intrinsic ID Hardware Root of Trust for RISC-V AI Application Processor
• Andes to discuss news RISC-V offerings at the TSMC Open Innovation Platform Ecosystem Forum
• GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications

Headlines for Wednesday Sep. 26, 2018

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GEO Deploys Mixel's MIPI Solution in the World's First Edge Based Automotive Smart Viewing Camera Processor

Mixel announced today that GEO Semiconductor, Inc. (“GEO”), the market leader in camera video processors (CVP) for automotive viewing cameras, has licensed the Mixel MIPI® IP, incorporated it into the GW5 product family and achieved first-time silicon success.

• Arm announces new flagship IP and safety program for automotive
• Terasic chooses Enyx to offer ultra-low latency development framework and design services for their latest FPGA platform
• Spectral introduces NeuralRAM, memory architectures in 14nm FinFET tech node targeted for a wide range of AI algorithms
• GF Grabs AI Wins with FD-SOI
• China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018
• GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems
• Sankalp Semiconductor to Exhibit at Taiwan Innotech Expo 2018
• Achronix to Showcase Flexibility of Speedcore eFPGAs During TSMC OIP Ecosystem Forum

Headlines for Tuesday Sep. 25, 2018

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Imagination and GLOBALFOUNDRIES Collaborate to Deliver Ultra-Low-Power Connectivity Solutions for IoT Applications

Imagination Technologies and GLOBALFOUNDRIES (GF) announced today a joint collaboration to provide ultra-low-power baseband and radio frequency (RF) solutions for Bluetooth Low Energy® (BLE) and IEEE 802.15.4 technology, using Imagination’s Ensigma connectivity IP on GF’s 22nm FD-SOI (22FDX®) platform.

• Intel Adds to Portfolio of FPGA Programmable Acceleration Cards to Speed Up Data Center Computing
• Lattice Expands Ultra-Low Power sensAI Stack with Optimized Solutions for Always-On, On-Device AI
• sureCore Opens Low-Power SRAM IP Customization Service
• Floadia G1 eFlash IP has exceeded 30,000 wafers shipment at Powerchip for system LSI customers
• Chronos Tech Deploys Fabric to Seamlessly Integrate Diverse IPs in Next-Gen System on Chips

Headlines for Monday Sep. 24, 2018

• Boeing Defense, Space & Security Licenses Flex Logix's Embedded Field-Programmable Gate Array on GlobalFoundries 14nm Process
• Intilop to Showcase their 40G-10G TCP-UDP Acceleration Technology and Solutions at MIT's Lincoln Labs
• Synopsys and SMART Photonics Expand InP-Based PIC Design Automation

Headlines for Friday Sep. 21, 2018

• North American Semiconductor Equipment Industry Posts August 2018 Billings

Headlines for Thursday Sep. 20, 2018

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Renesas Expands Access to Robust Portfolio of IP Licenses

Renesas Electronics Corporation today announced it is expanding access to its extensive portfolio of intellectual property (IP) licenses that allow designers to meet a broad range of customized customer requirements in a rapidly changing industry.

Headlines for Wednesday Sep. 19, 2018

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Cadence Launches New Tensilica DNA 100 Processor IP Delivering Industry-Leading Performance and Power Efficiency for On-Device AI Applications

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence® Tensilica®, the first deep neural-network accelerator (DNA) AI processor IP to deliver both high performance and power efficiency across a full range of compute from 0.5 TeraMAC (TMAC) to 100s of TMACs.

• ARM's Greg Yeric on memory, logic and making it
• Report: Intel to outsource 14nm chip production to TSMC
• HDL Design House Appoints New Sales Representative for US and Canada
• Seven IC Products to Outpace Total 16% IC Market Growth in 2018

Headlines for Tuesday Sep. 18, 2018

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LG Electronics Selects Synopsys HDMI 2.1 IP with HDCP 2.3 Content Protection to Deliver Immersive Viewing Experiences

Synopsys today announced that LG Electronics (LG) has selected silicon-proven DesignWare® HDMI 2.1 Controller IP with HDCP 2.3 content protection to deliver ultra-high-definition (UHD) video and high-fidelity audio in its latest generation of multimedia system-on-chips (SoCs).

• ZCAN Licenses SonicsGN NoC and MemMax DRAM Scheduler for new Cryptocurrency Chip Design
• Ampere Announces Availability of eMAG for Hyperscale Cloud Computing and Unveils Aggressive, Multi-Generation Roadmap
• Arm delivers production-ready open source Bluetooth Low Energy software stack to unleash IoT innovation
• eSilicon Announces Availability of neuASIC IP Platform for AI ASIC Design
• Open-Silicon Appoints New VP of Engineering
• Cadence Achieves Amazon Web Services Industrial Software Competency Status for Its Cloud-Hosted Design Solution
• Graphcore Uses Synopsys Design Platform to Implement Colossus Chip to Accelerate AI Computing

Headlines for Monday Sep. 17, 2018

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Attopsemi's I-fuse OTP worked at 0.4V and 1uW read at 22nm process for IoT application

Attopsemi Technology Co., LTD, a leading OTP solution provider, announced today that it recently had One-Time Programmable (OTP) IP working at 0.4V and 1uW read for a battery-less 61GHz RFID tags application.

• VEXXHOST Leverages the Power of Arm Processors and OpenStack with New Virtual Machine Architecture Offering
• New Fabs Invest Over $220 Billion; 2019 to Mark All-Time Spending High
• Fraunhofer IIS introduces SDK for JPEG XS image coding
• intoPIX to show first TICO-XS hardware implementation at IBC 2018
• Gowin Semiconductor Unveils the Latest Embedded Memory Products for their Families of Programmable Logic Devices
• SoC-e's 1588Tiny IP Core now supports Layer-3 PTP operation
• TrueConnect 2018 - 2nd Annual Technical Conference of Truechip
• Innosilicon announces the World Best BTC Miner T2T+32T for shipment, 68W/TH

Headlines for Friday Sep. 14, 2018

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How much did Apple pay to settle with Imagination?

Apple has just announced its second applications processor since it said it would stop using intellectual property from graphics developer Imagination Technology and that it would eventually stop paying royalties. There have been no lawsuits.

• Facebook Builds Chip Team, ASIC
• Vodafone to co-operate on integrated SIM with Arm

Headlines for Thursday Sep. 13, 2018

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Arasan Announces it's 2'nd Generation MIPI C-PHY / D-PHY IP Combo Core for C-PHY v1.2 Specifications

Arasan today announced the immediate availability of its MIPI C-PHY / D-PHY Combo IP Core compliant to the C-PHY specification Version 1.2 while also being compliant to the D-PHY 1.2 Specification.

• eSilicon Announces Silicon Validation of 7nm 56G SerDes
• Apple Describes 7nm iPhone SoC
• Media Links Integrates TICO Lightweight Compression into its MDP Series
• Allegro DVT Announces Availability of Full Compliance Test Suite for Alliance for Open Media's New AV1 Video Codec
• MCUs Sales to Reach Record-High Annual Revenues Through 2022
• Nuvoton Launches NuMicro M2351 Series TrustZone Empowered Microcontroller Focusing on IoT Security
• Wasiela Brings Encryption, FEC and Connectivity IP to DesignShare

Headlines for Wednesday Sep. 12, 2018

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Smartlogic announces PCI Express Multifunction IP Core for Xilinx 7 Series

Smartlogic today announced the immediate availability of the new 2.0 Release of the Multifunction IP Core for PCI Express®.

• TSMC: Chip Scaling Could Accelerate
• Nextera, Adeas, and intoPIX team up for 4K video over ST 2110
• NAGRA announces integration of NexGuard watermarking and Inside Secure's downloadable security solution

Headlines for Tuesday Sep. 11, 2018

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Intel Acquires NetSpeed Systems for Chip Design

Intel today announced the acquisition of NetSpeed Systems, a San Jose, California-based provider of system-on-chip (SoC) design tools and interconnect fabric intellectual property (IP).

• Synopsys and Truphone Enable Secure Over-the-Air Provisioning with Integrated SIM IP and Managed Services Solution
• Allegro DVT Introduces Industry's First HEVC SHVC Encoder IP, Pushes Video Quality to New Levels
• NGCodec Leverages Accelize's Digital Right Management (DRM) Platform for Flexible and Secure Deployment of its Next-Generation Video Compression Solutions
• Renesas to Acquire Integrated Device Technology, to Enhance Global Leadership in Embedded Solutions

Headlines for Monday Sep. 10, 2018

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New Synopsys HPC Design Kit Delivers Superior Performance, Power, and Area Efficiency for DesignWare Embedded Vision Processor IP

Synopsys today announced the DesignWare® High-Performance Core (HPC) Design Kit for EV6x Processors to help designers meet the performance, power, and area requirements of their systems-on-chips (SoCs) for embedded vision (EV) and artificial intelligence (AI) applications.

• Worldwide Semiconductor Equipment Billings Reach $16.7 Billion in Second Quarter 2018, SEMI Reports
• Codasip Expands its Global Reach by Signing Channel Partnerships throughout Asia
• TSMC August 2018 Revenue Report
• New Chip Seen Boosting Huawei's Market Share
• UNH-IOL Meets Industry Need for 50, 100, 200 and 400 Gigabit Ethernet Testing Services
• Hex Five Security Adds MultiZone Trusted Execution Environment to the SiFive Software Ecosystem
• SoC-e's Managed Ethernet Switch now supports up-to 32 ports
• BrainChip Announces the Akida Architecture, a Neuromorphic System-on-Chip

Headlines for Friday Sep. 07, 2018

• UMC Reports Sales for August 2018

Headlines for Thursday Sep. 06, 2018

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Impressive World-Wide Syndicate Invests $65 Million In AI Platform Venture ThinCI's Oversubscribed Series C Funding Round

ThinCI Inc., an AI hardware startup developing computing platforms for the expanding AI/Machine Learning market has announced the successful close of its $65 Million Series C round.

• Synopsys Announces Support for the Open Neural Network Exchange Format in ARC MetaWare EV Development Toolkit
• Accellera Forms IP Security Assurance Working Group

Headlines for Wednesday Sep. 05, 2018

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Imagination and Chips&Media deliver integrated GPU and Video Codec IP with advantages of system level compression

Imagination Technologies and Chips&Media announce a new collaboration that will bring the industry’s best IP solutions for GPU and Video Codec to customers worldwide.

• GUC Monthly Sales Report - Aug 2018
• UltraSoC embedded analytics selected by Kraftway for solid state disk controller products
• Global Semiconductor Sales Increase 17.4 Percent Year-to-Year in July
• TSN Ethernet Subsystem Available from CAST Proven at IIC and LNI Plugfests
• Lattice Semiconductor Appoints Steve Douglass as Corporate VP, R&D
• Artosyn Selects Synopsys DesignWare Security IP for Drone SoC
• Sankalp Semiconductor to present technical paper at CDNLive Bangalore
• Achronix Presentation at D&R IP SoC China will Detail Accelerating Computing at the Edge with Speedcore eFPGAs

Headlines for Tuesday Sep. 04, 2018

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NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks

NXP Semiconductors has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving.

• China's Semiconductor Fab Capacity to Reach 20 Percent Worldwide Share in 2020
• Leti and VSORA Demonstrate 3GPP New Radio (5G NR) on Multi-Core Digital Signal Processor
• Palma Ceia SemiDesign Announces Silicon-Proven LTE NB-IOT Transceiver for IoT Applications
• Huawei Launches Kirin 980, the World's First Commercial 7nm SoC

Headlines for Monday Sep. 03, 2018

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Tiannengbo optimises their latest Mining Chip using Moortec's Embedded Temperature Sensor

Moortec, providers of complete In-Chip Monitoring PVT Subsystems announced today that Tiannengbo Information Technology have utilised Moortec’s Temperature Sensor IP to optimise performance and increase reliability in their latest mining ASIC.

• ADAS SoC: Show Me Your Benchmark
• Brite Semiconductor Appoints Dr. John Zhuang as Acting Chief Executive Officer
• Credo to Demonstrate 100G Mixed-Signal DSP for 100G DR1 & 400G DR4 Optical Modules at CIOE