D&R Headline News (November 2018)

Headlines for Friday Nov. 30, 2018

Top Story

Arm Drops Cordio BLE IP

Arm is abandoning development of its Cordio hardware IP for low-power wide-area network (LPWAN) applications based on the NarrowBand IoT standard, but will continue to concentrate on the Cordio BLE software stack, EE Times has learned.

• Think Silicon Announces New NEMA | GUI-Builder to Empower Programmers of IoT, Embedded and Wearable Devices
• Samsung's Big Semi Capex Spending Keeps Pressure on Competition
• Truechip Announces First Customer Shipment of SD Express Verification IP
• Sankalp wins STPI Highest Exporter Award - ITES
• Brite Semiconductor, Naneng Microelectronics and Corigine Collaborate to Release Complete USB 3.0 IP Solution

Headlines for Thursday Nov. 29, 2018

Top Story

Perceptia Second-Generation Digital PLL IP Enters Mass Production

Perceptia Devices, Inc., a developer of innovative PLL and timing technology, today announced that its flagship high-end second-generation digital PLL has entered mass production in UMC's 40LP foundry process. The IP, dubbed pPLL08-5G, targets a performance point not achieved in conventional analog PLL, or even a first-generation digital PLL.

• IEEE Publishes IEEE 802.1CM-2018 Standard Addressing Time-Sensitive Networking for Fronthaul
• UltraSoC launches "any processor" lockstep solution for safety-critical systems
• IAR Systems and Andes collaborate to boost performance for RISC-V users
• MicroBT employs Moortec's 16nm Embedded Temperature Sensor in their HPC ASIC
• Wave Computing Raises $86M in Oversubscribed Series E Round To Fuel Global Expansion and Further Accelerate Wave's Cloud-to-Edge Strategy
• GLOBALFOUNDRIES Announces Industry's First 300mm SiGe Foundry Technology to Meet Growing Data Center and High-Speed Wireless Demands

Headlines for Wednesday Nov. 28, 2018

Top Story

Allegro DVT Launches a new High-Performance, Multi-Format Video Encoder IP for 4K/UHD Video Resolutions and Beyond

Allegro DVT, a leading provider of video encoding and decoding semiconductor IP solutions, today announced the availability of AL-E200, a new generation of video encoder IPs built around a higher performance architecture and featuring many new optional smart encoding features.

• Tempow and CEVA Partner to Deliver Low Power, Low Latency True Wireless Stereo Technology for Bluetooth Earbuds
• Xilinx's New FPGAs Address Evolving Threats, Fake ICs
• Efabless Launches the Chiplicity Design Partner Program Featuring Chipus Microelectronics, Sankalp Semiconductor and Symmid Corporation
• The Linux Foundation and RISC-V Foundation Announce Joint Collaboration to Enable a New Era of Open Architecture
• GUC Announces ShenZhen Office Opening
• Arm and AWS: Working together to "Re:Invent" the cloud
• Argon Design licenses Argon Streams AV1 to Realtek Semiconductor

Headlines for Tuesday Nov. 27, 2018

Top Story

PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cables Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost

The joint demonstration combines PLDA’s PCIe 4.0 IP solutions and Samtec interconnect to deliver PCIe 4.0 speed without the use of retimers or updated motherboard using MEGTRON 6 technologies, significantly reducing cost

• SureCore Joins the RISC-V Foundation
• AccelerComm opens office in Shanghai to exploit Asian market growth in telecommunications
• Zhuhai Chuangfeixin Introduces eNOR Embedded Flash Memory IP Solution and SPI NOR Flash Products on 65nm Floating-Gate Flash Process
• Sonova License and Deploy CEVA Bluetooth IP in SWORD 3.0 Wireless Chip for Hearing Aids
• Thales joins RISC-V Foundation to help secure open-source microprocessors

Headlines for Monday Nov. 26, 2018

Top Story

Only Qualcomm Reported to Post Slight Decline Among Top Ten Fabless IC Design Houses by 3Q18 Revenue, Says TrendForce

TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues for 3Q18, among which Qualcomm was the only one to post a slight decline. The other nine companies all registered year-on-year growth in their revenue, driven by segments like networking, data center, automotive application and consumer electronics.

• There's More to The RISC-V China Story
• PLDA Offers XpressRICH PCIe and CCIX Controller IP Through SiFive DesignShare Program
• IAR Systems Expands Support for Arm DesignStart with High Performance Tools for Arm Cortex-A5
• Express Logic Provides Support for Infineon TriCore Microcontrollers

Headlines for Thursday Nov. 22, 2018

Top Story

Winbond and Tiempo Secure join forces to offer the world's first fully CC EAL5+ certifiable Secure Element IP for IoT

Winbond Electronics Corporation and Tiempo Secure are announcing a complete solution for certifiable Secure Elements comprised of Tiempo Secure’s fully proven hard macro IP and Winbond’s certified secure flash. The combined solution offers cloud to IoT authentication and security, secured connectivity and IoT device privacy.

• Silex Insight joins RISC-V foundation

Headlines for Wednesday Nov. 21, 2018

Top Story

OPENEDGES' Memory Subsystem IP - DDR Controller & NoC interconnect licensed for high end 4K multimedia SoC

OPENEDGES, the leading IP provider in the memory subsystem, announced its ORBITTM memory subsystem IP – DDR memory controller & Network on-Chip (NoC) interconnect IP has been licensed again for the leading multimedia SoC company targeting for 4K surveillance & smart networking cameras.

• TSN IP Core making devices fit for real-time Ethernet
• Gear Radio Introduces Complete Bluetooth 5 Low-Power IP Solution for IoT SoC Applications
• UMC and Gear Radio Introduce 55nm Bluetooth 5 IP Platform
• North American Semiconductor Equipment Industry Posts October 2018 Billings

Headlines for Tuesday Nov. 20, 2018

Top Story

Cadence Announces Tapeout of GDDR6 IP on Samsung's 7LPP Process, Enabling Complete GDDR6 IP Solution

Cadence today announced the tapeout of a complete GDDR6 memory IP solution on Samsung’s 7LPP process. GDDR6 memory is targeted at very high-bandwidth applications including machine learning, AI, cryptocurrency mining, graphics, automated driving, ADAS and high-performance computing (HPC).

• Outlook Remains Bright for Automotive Electronic Systems Growth
• Blu Wireless Technology announces the HYDRA 2.X family of System IP for 802.11ay mmWave applications
• Xilinx Extends Functional Safety into AI-class Devices
• Toshiba Unveils 130nm FFSA Development Platform Featuring High Performance, Low Power and Low Cost Structured Array
• Sankalp Semiconductor announces ARM Empowered Design Suite

Headlines for Monday Nov. 19, 2018

Top Story

Attopsemi's I-fuse OTP Passed 250 degrees Celsius for 1,000hrs Wafer-level Burn-in Studies on GLOBALFOUNDRIES 22FDX FD-SOI Technology

Attopsemi Technology announced today that the company’s 256Kb OTP (One-Time Programmable) IP passed 250°C and 1,000 hours wafer-level burn-in studies. When programming I-fuse™ within the specifications, no defect was found in tens of millions I-fuses™ after several stress conditions. Moreover, the post-stressed I-fuse™ resistance has very minor changes.

• PixArt Imaging selects voltage regulators IPs from Dolphin Integration for its ultra-low power MCU Sensor in 40 nm
• Mobileye's New EyeQ5: How Open is Open?
• Attopsemi's I-fuse OTP worked at 0.4V and 1uW read on GLOBALFOUNDRIES 22nm FD-SOI for Fraunhofer Institute for Photonic Microsystems' (IPMS) battery-less 61GHz RFID tags
• Moortec to showcase its advances in PVT in-chip monitoring for 40nm, 28nm, 16nm, 12nm and 7nm at ICCAD in Zhuhai China
• aiCTX Closes Pre-A Investment Round With Baidu Ventures
• IAR Systems, Secure Thingz and Renesas Electronics collaborate on solutions for reliable industrial IoT security

Headlines for Friday Nov. 16, 2018

• SiFive Appoints VP to Growing SoC IP Group
• Xilinx and Mipsology Release Integrated Solution for High-Performance Inference in Data Center

Headlines for Thursday Nov. 15, 2018

Top Story

Why RISC-V Lags in China

China does appear to have many "buyers" interested in RISC-V cores. But as I hunt for "developers" trying to leverage the RISC-V instruction set, I'm coming up short in Shanghai.

• Q&A with ST CEO: Who He Is, What He's Done
• Xilinx Advances State-of-the-Art in Integrated and Adaptable Solutions for Aerospace and Defense with Introduction of 16nm Defense-Grade UltraScale+ Portfolio
• QuickLogic Announces eFPGA Now Available on TSMC 40nm Process
• Verne Global introduces Arm architecture via Marvell ThunderX2 processor-based servers to hpcDIRECT
• GLOBALFOUNDRIES, indie Semiconductor Deliver Performance-Enhanced Microcontrollers for Automotive Applications
• RISC-V Momentum Seen Growing in China
• Achronix Unveils New "eFPGA Accelerator" Programs for Researchers and Test-Chip Developers

Headlines for Wednesday Nov. 14, 2018

• Micron and Achronix Deliver Next-Generation FPGAs Powered by High-Performance GDDR6 Memory for Machine Learning Applications
• Achronix Finalist for the Global Semiconductor Alliance's 2018 Most Respected Private Semiconductor Company Award
• Cortus S.A.S Appoints Mr. Gordon Yang Guo-dong as Vice President of Business Development
• IntelliProp to Demo PCIe to Gen-Z Bridge at SC18
• Cadence Delivers Advanced Packaging Reference Flow for Samsung Foundry Customers
• Nexell Licenses Intrinsic ID Hardware Root of Trust for AI Application Processor

Headlines for Tuesday Nov. 13, 2018

Top Story

Arasan completes its Total IP Solution for the UFS 3.0 Standard with immediate availability of its MIPI M-PHY 4.1 IP Core

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of it’s M-PHY IP Compliant to MIPI M-PHY 4.1 Specifications supporting speeds of upto 11.6gpbs.

• Xilinx Extends Data Center Leadership with New Alveo U280 HBM2 Accelerator Card; Dell EMC First to Qualify Alveo U200
• Nine Top-15 2018 Semi Suppliers Forecast to Post Double-Digit Gains
• Imagination reveals next step in PowerVR automotive strategy

Headlines for Monday Nov. 12, 2018

Top Story

Moortec's 7nm In-Chip Monitoring Subsystem IP chosen by Esperanto Technologies to optimise performance and reliability in its high-performance AI Chip

Moortec Semiconductor Ltd, providers of complete In-Chip PVT Monitoring Subsystems announced today that Esperanto Technologies have selected their complete 7nm Embedded In-Chip Monitoring Subsystem IP for Process, Voltage and Temperature Sensing to optimise performance and increase reliability for their AI Supercomputer-on-a-Chip.

• HPC Systems Inc. Expands the Science Cloud Offering with the Latest Arm-based HPC
• Andes Technology and INVECAS Announce Partnership to Win RISC-V-Based SoC Designs for Advanced Processes
• Spin Memory's MRAM Design-Enhancing Endurance Engine Licensed by Arm
• Spin Memory Announces $52 Million Series B Funding Round
• Nextera and Adeas Announce Village Island as Distributor for IP Cores in Japan
• Open-Silicon, SiFive and Credo Showcase End-to-End Solutions for HPC and Networking Applications at SC18 in Dallas
• Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution
• DINI Group announces immediate availability of the DNVUPF4A - Prototyping for 5G
• Hex Five adds MultiZone Security to the Andes RISC-V Cores on GOWIN FPGAs

Headlines for Friday Nov. 09, 2018

• UMC Issues Follow-up Statement Regarding Recent Legal Developments
• TSMC October 2018 Revenue Report
• UMC Reports Sales for October 2018

Headlines for Thursday Nov. 08, 2018

Top Story

NSCore Inc. Addresses the IoT Market Need for an NVM IP Solution in Advanced Process Technology Nodes

NSCore Inc. Addresses the IoT market need for an NVM IP Solution in advanced process nodes using Hi-k Metal Gate with their Multi-Time Programmable (MTP) Non-Volatile Memory (NVM) IP Solution

• CEVA, Inc. Announces Third Quarter 2018 Financial Results
• What NXP Lost and Regained Post-Qualcomm
• Dr. Jesse Zhixi Fang Appointed as Chair of the RISC-V Foundation China Advisory Committee to Accelerate Adoption of the RISC-V ISA in China

Headlines for Wednesday Nov. 07, 2018

Top Story

Judge Rules Qualcomm Must License Modem Patents

A U.S. federal judge issued a preliminary ruling requiring Qualcomm license some of its modem IC patents to competitors including Intel and Samsung.

• Third Quarter Silicon Wafer Shipments Increase, Set New Quarterly Record
• Imperas Empowers RISC-V Community with riscvOVPsim
• SMIC Reports 2018 Third Quarter Results
• Pinnacle Imaging Systems and ON Semiconductor Collaborate on New HDR Surveillance Solution Using Xilinx Technology to Push the Boundaries of High Dynamic Range Video
• Vidatronic Announces ACCUREF Series of Ultra-Precise, Extremely Low-Power Voltage and Current Reference IP Cores
• New Mentor Symphony platform addresses nanometer-scale SoC mixed-signal verification challenges
• AMD Unveils World's First 7nm Datacenter GPUs
• Perceptia Devices Strengthens Europe Sales Network

Headlines for Tuesday Nov. 06, 2018

Top Story

Corigine and New H3C Enable Mass Deployment of High-Performance Network Routers

Corigine, Inc. and New H3C Group (New H3C) today announced their collaboration in launching the best-in-class network routers for broad deployments in carriers, enterprise, campus, and data center networks.

• Synopsys Extends Synthesis Leadership with Next-Generation Design Compiler
• Synopsys Unveils Fusion Compiler, Enabling 20 Percent Higher Quality-of-Results and 2X Faster Time-to-Results
• Everspin and SilTerra join forces to create new manufacturing center for MRAM
• Dr. John Zhuang Appointed as CEO of Brite Semiconductor
• Arm Kigen solutions see further adoption and achieve GSMA accreditation
• sureCore names Roger Bailey VP Worldwide Sales

Headlines for Monday Nov. 05, 2018

Top Story

Wave Computing Turbo Boosts "MIPS" with Licensable AI Subsystems, An Expanded Ecosystem & New Product Roadmap

Wave Computing today announced its strategy for its AI-enabled MIPS® offering and ecosystem. MIPS is already widely known as an industry-standard technology that has been designed into thousands of products with billions of units shipped worldwide.

• Silex Insight unveils high-throughput version of Chacha20-Poly1305 authenticated encryption
• Arm's Data Center Two Step
• Knowledge Transfer, or IP Theft?
• GUC Monthly Sales Report - Oct 2018
• Who's Who in AI SoCs
• FABU America, Developer of SoCs for Autonomous Driving, Selects Agnisys IDesignSpec to Create an Executable Design Specification
• SMIT Acquires S2C, a Hardware-based Verification Systems and Software Company
• Esperanto Technologies Secures $58 Million in Series B Investment for AI Chips
• PathPartner to showcase a spectrum of innovations in Automotive ADAS and Internet of Things at Electronica 2018
• AMF Photonics SiP Process Design Kit Available for Synopsys OptoDesigner Photonic IC Layout Solution
• Samsung Still Spending Heavily on Capex

Headlines for Friday Nov. 02, 2018

Top Story

Imagination delivers industry's first visually lossless image compression for GPUs with a guaranteed reduction in memory footprint

Imagination Technologies announces the groundbreaking PowerVR PVRIC4, the new generation of its powerful image compression technology which will enable SoC customers targeting devices such as DTVs, smartphones and tablets to reduce costs without a discernible loss of image quality.

• New Architectures Bringing AI to the Edge
• Chipmaker Results Point Toward Correction
• Quarterly Year-over-Year Growth Slows Substantially for IC Market
• UMC Issues Statement in Response to Recent Indictment and Civil Complaint
• Montage LZ Technologies Selects Rambus CryptoMedia Core to Secure Set-Top Box Chips

Headlines for Thursday Nov. 01, 2018

Top Story

VeriSilicon Announces Ultra Low Power BLE 5.0 RF IP Based on GLOBALFOUNDRIES 22FDX FD-SOI Process for IoT Applications

VeriSilicon Holdings Co., Ltd. (VeriSilicon) today announced its Bluetooth Low Energy (BLE) 5.0 RF IP based on GLOBALFOUNDRIES 22FDX® FD-SOI process.

• GLOBALFOUNDRIES Introduces Avera Semi, a Wholly Owned Subsidiary to Deliver Custom ASIC Solutions
• Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth