D&R Headline News (January 2019)

Headlines for Thursday Jan. 31, 2019

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Feature-rich RISC-V IDE Available for Free Download

Andes Technology today announced the free download of its AndeSight Integrated Development Environment (IDE) to accelerate software development for RISC-V based SoC. AndeSight IDE is a professional IDE based on Eclipse with many useful Andes add-on features, developed and widely used over the past 13 years, which provides an efficient way to develop embedded applications for RISC-V based SoC.

• Hardent and Xilinx Collaborate to Deliver Complete 8K Ready DisplayPort 1.4 IP Subsystem
• Sital's Enhanced Reliability FPGA IP powers NASA's GEDI on board communications
• Annual Silicon Shipments Hit Record High, Market Exceeds $10 Billion for First Time Since 2008
• VIS To Acquire GLOBALFOUNDRIES' Fab 3E In Singapore
• Bluespec Returns from Landmark RISC-V Summit; CTO Nikhil Leads Discussion on ISA Formal Spec

Headlines for Wednesday Jan. 30, 2019

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Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology

Rambus Inc. today announced the tapeout of its GDDR6 PHY on TSMC 7nm FinFET process technology and is available from Rambus for licensing today.

• eSilicon and Wild River Technology Announce Advanced SerDes Test System
• AdaCore Joins the RISC-V Foundation to Provide C and Ada Compilation Support
• Sankalp Semiconductor Appoints Abhijit Dutta as Head of Mixed Signal Solutions

Headlines for Tuesday Jan. 29, 2019

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CEVA Locates More Success with Bluetooth 5.1 IP

Supporting the headline new feature of Direction Finding via Angle of Arrival (AoA) and Angle of Departure (AoD) for enhanced location services, the RW-Bluetooth 5.1 IP is available in both Bluetooth Dual Mode and Bluetooth Low Energy flavors.

• Rambus Reports Fourth Quarter and Fiscal Year 2018 Financial Results
• Zhuhai Chuangfeixin Announces Antifuse eFPGA IP
• eSilicon Announces Technical Advisory Board
• Arteris IP Adds 20 New Licensees and Releases Three New Products in 2018

Headlines for Monday Jan. 28, 2019

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MosChip announces acquisitions to strengthen Semiconductor Business Unit & CEO appointment

MosChip Semiconductor Technology, a Hyderabad-based leading Semiconductor & IoT technology company, has approved definitive agreements/arrangements for the acquisition of four companies, namely, Gigacom Semiconductor LLC, California, USA, Gigacom Semiconductor Pvt. Ltd, Visakhapatnam, FirstPass Semiconductors Pvt. Ltd, Hyderabad, and Institute of Silicon Systems Pvt. Ltd, Hyderabad.

• Semiconductor Unit Shipments Exceeded 1 Trillion Devices in 2018
• China, Chips, and 2019 Still Unclear
• Silicon Creations Relies on Silvaco's Custom Design Flow for New Advanced FinFET Designs
• Dolphin Integration appoints Philippe Berger as Chief Executive Officer

Headlines for Friday Jan. 25, 2019

• North American Semiconductor Equipment Industry Posts December 2018 Billings

Headlines for Thursday Jan. 24, 2019

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Imagination's New CEO Plots Turnaround Strategy

Ron Black, the recently appointed CEO of Imagination Technologies, is well aware that the prahics IP vendor has something to prove.

• Eta Compute selects IAR Embedded Workbench as the Preferred Toolchain for new neural network-based AI SoCs
• GOWIN Semiconductor Licenses Intrinsic ID's BroadKey to Deliver Hardware Root of Trust for IoT Security
• Synopsys' New ARC EM Software Development Platform Accelerates Software Development for IoT, Sensor Fusion, and Voice Recognition Applications
• Multicore Association Releases Version 2 Specification for Advanced Tool Support with Multicore Processors
• Xilinx Reports Record Revenues And EPS In Fiscal Third Quarter

Headlines for Wednesday Jan. 23, 2019

• NXP's Reger Re-defines CTO's Role
• Hailo Expands Series A Round to $21M and Launches Hailo-8 Fast Track Program for Select Customers
• Global GDP Growth Increasingly Important Driver of IC Market Growth
• DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly
• Inomize is selected to develop and supply HP Indigo next generation ASIC for Digital Press

Headlines for Tuesday Jan. 22, 2019

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Arteris IP FlexNoC Interconnect Licensed by NETINT Technologies for PCIe 4.0 Enterprise SSD Controllers

Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that NETINT Technologies has licensed Arteris IP FlexNoC Interconnect for use in its enterprise SSD storage system controllers with on-chip video processors.

• Soitec Expands Collaboration with Samsung Foundry on FD-SOI Wafer Supply
• TSMC's Outlook Underscores Foundry Market Challenges

Headlines for Monday Jan. 21, 2019

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MorningCore Technology Licenses Flex Logix's Embedded Field-Programmable Gate Array on TSMC's 12FFC Process

Flex Logix Technologies, Inc., announced today that MorningCore Technology, a subsidiary of China telecommunications giant Datang, is licensing EFLX4K eFPGA for TSMC’s 12nm FinFET Compact technology (12FFC) process and the EFLX Compiler for programming the eFPGA.

Headlines for Friday Jan. 18, 2019

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Value of Semiconductor Mergers and Acquisitions Falls Considerably

The historic flood of merger and acquisition agreements that swept through the semiconductor industry in 2015 and 2016 slowed significantly in 2017 and then eased back further in 2018, but the total value of M&A deals reached in the last year was still nearly more than twice the annual average during the first half of this decade.

• Updated HBM Standard Geared for HPC, Networking
• Q'comm Exec: "Automotive Changed Our DNA"

Headlines for Thursday Jan. 17, 2019

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Rambus Acquires Memory Technology Assets of Diablo Technologies

Rambus Inc. (NASDAQ: RMBS), today announced it has acquired the assets of Diablo Technologies to broaden its portfolio in the hybrid DRAM and Flash memory markets, further establishing its position as an industry leader.

• TSMC Reports Fourth Quarter EPS of NT$3.86
• Xilinx Technology to Power Baidu Brain Edge AI Applications
• First Battery-Free Bluetooth Sticker Sensor Tag Demonstrated at NRF

Headlines for Wednesday Jan. 16, 2019

• Mentor's Catapult HLS enables Chips&Media to deliver deep learning hardware accelerator IP in half the time

Headlines for Tuesday Jan. 15, 2019

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Arteris IP FlexNoC Interconnect Licensed by Baidu for Kunlun AI Cloud Chips for Data Center

Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Baidu has licensed Arteris IP FlexNoC Interconnect for use in its high-performance Kunlun AI cloud chip for data center.

• UltraSoC appoints new VP of Global Sales as demand surges for embedded analytics solutions
• Arasan Announces availability of its Total UFS 3.0 IP Solution for Xilinx FPGA's
• HDL Design House Webinar: Reducing Integration and Verification Effort in SoC Design
• Semiconductor Leaders' Marketshares Swell Over the Past 10 Years
• Silvaco Inc. Achieves Fourth Consecutive Year of Double-Digit Growth in Sales Bookings and GAAP Revenue

Headlines for Monday Jan. 14, 2019

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Apple Testifies in Q'comm Patent Case

Qualcomm and Apple faced off in San Jose District Court Friday in the ongoing dispute over patents. An Apple executive suggested Qualcomm’s royalties were more than $10 per iPhone.

• Apple's $1 Billion Baseband Deal
• Habana Labs Achieves First-Pass Silicon Success for High-Performance AI Processor SoC Using DesignWare IP
• zGlue Takes Moore's Law Beyond the Possibilities of System-on-Chips with Custom Chips on Demand
• Aldec shortens time of ASIC design prototype bring-up in FPGA with HES-DVM Proto mode
• CEVA Opens New Research and Development Center in Bristol, U.K.
• Flash Memory Remains Primary Target for Capex Spending
• UMC retreats from China DRAM venture, Report says
• A New DSP Approach to Accelerate 5G and AI Design Development
• New Generation OTP/MTP/NVM from UK Artificial General Intelligence Cosmos IP total solution
• IDT Licenses Intrinsic ID's QuiddiKey Hardware Root of Trust for IoT Security
• CEVA Celebrates 10 Billion CEVA-powered Devices Shipped by Ringing the Nasdaq Opening Bell

Headlines for Thursday Jan. 10, 2019

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IFI CLAIMS Announces 2018's Top U.S. Patent Recipients

IFI CLAIMS Patent Services, provider of a leading global patent data platform, today released its annual analysis of U.S. patent activity for 2018

• Semis Hope for Soft Landing
• Silicon Valley Company unveils the first automotive architecture exploration platform with Time-Sensitive Networking (IEEE802.1Q) protocol
• Faraday Unveils ASIC Success in Factory Automation
• Weebit Nano and Silvaco Form Development Program Partnership to Create ReRAM Models and Design Tools
• TSMC December 2018 Revenue Report
• Innovium Selects Synopsys' IC Validator for Physical Signoff

Headlines for Wednesday Jan. 09, 2019

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Imagination Technologies delivers new AI, graphics and connectivity technology for 2019

The company, which creates and licenses technologies used in many leading consumer electronics products, will highlight at CES three new IP families which target key consumer technology product categories: automotive, drones, DTV, mobile devices, and other IoT edge devices.

• UMC Reports Sales for December 2018
• NXP and Kalray Enter Partnership to Develop Platform for Safe, Reliable Autonomous Driving
• Everspin Ships the World's First Pre-Production 28 nm 1 Gb STT-MRAM Customer Samples
• China Market Drives Essentially All Pure-Play Foundry Growth in 2018
• OPENEDGES and TAKUMI partner to promote ORBIT Memory Subsystem IP in Japan

Headlines for Tuesday Jan. 08, 2019

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VeriSilicon's Artificial Intelligence Processor IP Used in Next-Generation Large Screen Smart Home System-on-Chip (SoC)

VeriSilicon’s Vivante VIP8000/VIPNano Family Silicon-Proven AI Processor IP Brings “Smart” to the Home with its Patent-Pending Bandwidth Optimization Technology

• Vayyar Selects Cadence Tensilica Vision DSP for Advanced Millimeter Wave 3D Imaging Radar Solution
• Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC
• VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices
• China Wafer Production Capacity Growth Fastest in World
• Inside Secure Debuts Industry's First Software-Only Solution for High-Bandwidth Digital Content Protection (HDCP) 2.3

Headlines for Monday Jan. 07, 2019

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CEVA Introduces WhisPro, Neural Network-Based Speech Recognition Technology For Voice Assistants and IoT devices

CEVA today introduced WhisPro™, a Neural Network based speech recognition technology targeting the rapidly growing use of voice as a primary human interface for intelligent cloud-based services and edge devices.

• ESD Alliance Reports EDA Industry Revenue Increase For Q3 2018
• Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level
• Toshiba Develops DNN Hardware IP for Image Recognition AI Processor Visconti 5 for Automotive Driver Assistance Systems
• Gartner Says Worldwide Semiconductor Revenue Grew 13.4 Percent in 2018; Increase Driven by Memory Market
• GUC Monthly Sales Report - Dec 2018
• Innosilicon Announces silicon proven and mass production of the World First Silicon Proven Commercial GDDR6 IP on Samsung's 14LPP Process
• SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum
• QuickLogic Acquires SensiML SaaS AI Company
• Gowin Semiconductor Corp.'s Cumulative Shipments Reach 10 Million Pieces
• Xilinx and ZF to Jointly Enable AI Innovation and Autonomous Driving Development
• INVECAS Announces World's First HDMI 2.1 with HDCP2.3 Chip & IP Solutions for TV, AVR, Soundbar and STB

Headlines for Friday Jan. 04, 2019

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CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices

CEVA announced today CEVA-BX, its new all-purpose, hybrid DSP / Controller architecture to address new algorithms of digital signal processing in voice, video, communication, sensing and digital signal control applications.

• intoPIX introduces the new JPEG XS standard at CES

Headlines for Thursday Jan. 03, 2019

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SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform

Microchip Technology Inc. (Nasdaq: MCHP) subsidiary Silicon Storage Technology (SST) today announced that its high-speed embedded SuperFlash® technology is qualified to Automotive Electronics Council’s AEC-Q100 Grade 1 on United Microelectronics Corporation’s (NYSE: UMC; TWSE: 2303) 55 nm platform.

• VESA Introduces DisplayHDR True Black High Dynamic Range Standard for Organic Light Emitting Diode (OLED) and other Emissive Displays
• Arm unveils new image signal processors to meet higher image quality requirements
• Nordic Semiconductor Licenses and Deploys CEVA DSP in Low Power Cellular IoT SoC
• Bestechnic Licenses CEVA Bluetooth 5 Dual Mode IP for its Audio Platforms
• Wi-Fi Startups Polish HaLow for IoT
• Researchers Explore Emerging Memories for AI
• USB-IF Launches USB Type-C Authentication Program

Headlines for Wednesday Jan. 02, 2019

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Optek Licenses and Deploys CEVA Bluetooth IP in its latest Multimedia Platform

CEVA today announced that Optek Digital Technology Ltd. (Optek), a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA's RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC).

• Global Semiconductor Sales Up 9.8 Percent Year-to-Year in November