D&R Headline News (February 2019)

Headlines for Thursday Feb. 28, 2019

Top Story

97 IC Wafer Fabs Closed or Repurposed During Past 10 Years

Since 2009, 42 150mm wafer fabs and 24 200mm wafer fabs have been shuttered. 300mm wafer fabs have accounted for only 10% of total fab closures since 2009. Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009.

• SiFive Welcomes Former Intel Capital VP to Executive Team
• WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix
• Inside Secure Selected by ATsolutions to Provide Market-Leading Code Protection for its Banking and Credit Card Apps
• Cadence Tensilica Product Development Process and Software Products Certified for ISO 26262 ASIL D Compliance for Automotive Applications
• KEPCO Partners with Inside Secure to Further Bolster Protection for Latest Chips Used in IoT Devices
• Inside Secure Selected by HiSilicon to Protect Device Secrets throughout Manufacturing Process

Headlines for Wednesday Feb. 27, 2019

Top Story

Minima Processor and Arm Collaborate on Ultra-Low Power Solutions for Mobile and IoT

Minima Processor Licenses Arm Artisan Physical IP to Optimize Arm-based SoC Designs with Minima Dynamic Margining IP Ultra-Low Power Technology

• Synopsys' New Enhanced Security Package for ARC HS Processors Protects Embedded Systems Against Evolving Threats
• Chips&Media announced licensing of Image Signal Processing (ISP) to one of leading SoC developer targeting advanced automotive applications such as ADAS and Autonomous Driving
• OFC 2019: eSilicon to demonstrate two 7nm IP products, 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem
• Arm and China Unicom Sign Partnership Agreement to Drive IoT Adoption in China
• Silvaco Opens Shenzhen Office to Support Company's Asian Expansion and Growing Demand for Semiconductor Design Solutions

Headlines for Tuesday Feb. 26, 2019

Top Story

Cobham Joins RISC-V Foundation

Cobham Gaisler announced today that is has recently been accepted as a Gold-Level Member of the RISC-V Foundation.

• New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications
• The Qt Company and Inside Secure to Offer Joint Integrated Solutions for Creating Secure IoT and Embedded Devices
• intoPIX previews JPEG XS technology for remote production and studio-over-IP applications at VidTrans 2019
• Faraday Reports 2018 Annual Revenues of NT$4.91 Billion, NRE NT$1.3 Billion, up 107% YoY; 2018 Gross Margin was 53.1%, a 11 Year High
• CEVA Completes its First Test Trial of CEVA-Dragonfly NB2 NB-IoT Silicon at Vodafone Narrowband-IoT Open Lab
• Imagination and Andes collaborate to enable ultra-low power connected microprocessors for IoT
• Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor
• Inside Secure launches Flexible Secure Provisioning to Easily Protect Connected Devices Secrets' During Manufacturing Process
• Silvaco, Inc. and Avery Design Systems Partner to Deliver Complete CAN-FD Automotive and MIPI I3C IP and VIP Solutions
• UltraSoC demonstrates advanced multicore debug at Embedded World 2019
• Synopsys to Showcase its Leading Prototyping, IP, and Software Integrity Solutions at Embedded World 2019
• AIStorm Introduces Real-Time AI-in-Sensor Solutions for Driver Assistance, Mobile Handsets, Cameras, and IoT
• DinoplusAI Partners with SiFive to Develop Mission-Critical AI Processor Platform for High Performance Processing with Ultra-Low Latency

Headlines for Monday Feb. 25, 2019

Top Story

Synopsys and Palma Ceia SemiDesign Collaborate to Develop a Complete Hardware/Software NB-IoT IP Solution

Synopsys, Inc. and Palma Ceia SemiDesign (Palma Ceia) today announced that the two companies have integrated Palma Ceia's LTE Cat NB1/NB2 RF transceiver IP with Synopsys' DesignWare® ARC® EM9D Processor IP to deliver a complete low-power NB-IoT IP solution for both standalone or embedded modems.

• TRUECHIP Introduces TruEYE -The Debug GUI - A Unique tool for design & verification
• Cadence Drives Release of Alternative EVS Codec Implementation in 3GPP
• Tiempo Secure lowers entry barriers to securing the Internet of Things with its CC EAL5+ grade Secure Element IP macro dedicated to secure Systems-on-Chip
• New SoC Security Platform Announced by CAST and Beyond Semiconductor
• Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
• Arm and Leading Test Laboratories Unveil Independent Security Certification for IoT Devices
• Racyics extends its Silicon Proven ABB IP Portfolio
• GreenWaves Technologies Announces 7M Euros Series A Funding
• North American Semiconductor Equipment Industry Posts January 2019 Billings
• Hex Five and wolfSSL Announce the First Secure IoT Stack for RISC-V
• PSA Certified: Building Trust in IoT
• Syntiant Brings Speech Interfaces to the Edge With New Ultra-Low-Power Neural Decision Processors
• GOWIN Semiconductor Announces Release of the New GOWIN EDA Tools for Improved Performance on New FPGA Product Families
• Arm and Vodafone Commit to Work Together to Simplify Internet of Things (IoT) Deployment

Headlines for Friday Feb. 22, 2019

Top Story

Arasan announces the immediate availability of its MIPI D-PHY / C-PHY Combo IP for TSMC 22nm SoC Designs

Arasan Chip Systems announces the immediate availability its MIPI D-PHY / C-PHY Combo IP supporting speeds of upto 2.5 gpbs for TSMC 22nm SoC designs. The MIPI D-PHY / C-PHY Combo IP is seamlessly integrated with Arasan own CSI Tx, CSI Rx, DSI Tx and DSI Rx as part of its Total MIPI Imaging and Display IP Solution.

• Infineon, Xilinx and Xylon team up for new microcontroller solutions in safety-critical applications

Headlines for Thursday Feb. 21, 2019

Top Story

Synopsys and GLOBALFOUNDRIES Collaborate to Develop Industry's First Automotive Grade 1 IP for 22FDX Process

Synopsys, Inc. (Nasdaq: SNPS) and GLOBALFOUNDRIES (GF) today announced a collaboration to develop a portfolio of automotive Grade 1 temperature (-40ºC to +150ºC junction) DesignWare® Foundation, Analog, and Interface IP for the GF 22-nanometer (nm) Fully-Depleted Silicon-On-Insulator (22FDX®) process.

• UltraSoC announces support for Western Digital RISC-V SweRV Core and OmniXtend cache-coherent interconnect
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2019
• Rambus and GLOBALFOUNDRIES to Deliver High-Speed SerDes on 22FDX for Communications and 5G Applications
• Xilinx Extends its Breakthrough Zynq UltraScale+ RFSoC Portfolio to Full sub-6GHz Spectrum Support

Headlines for Wednesday Feb. 20, 2019

Top Story

Arm announces Neoverse N1 platform & Neoverse E1 platform built for cloud to edge infrastructure

Two new complete infrastructure-class platforms for faster time-to-market and optimal design points for cloud to edge applications in the era of 5G

• GLOBALFOUNDRIES Crosses Billion-Dollar Design Win Threshold with 8SW RF SOI Technology
• Cadence Tools and IP Optimized for New Arm Neoverse N1 Platform to Advance the Cloud-to-Edge Infrastructure Market
• Synopsys Fusion Design Platform Enables Successful Tapeout of Samsung Foundry's Industry-first Gate-All-Around Transistor SoC
• CEA-Leti & Stanford Target Edge-AI Apps with Breakthrough NVM Memory Cell
• Indoor Positioning Accuracy Revolutionized with a State-of-the-Art Bluetooth-Enabled Solution
• Nurlink Launches NB-IoT and GNSS SoC Powered by CEVA-Dragonfly NB2 IP
• Samsung, Toshiba Detail AI Chips
• Intel Says FinFET-based Embedded MRAM is Production Ready
• Globalfoundries sees success for its diversification strategy
• Huawei Enters into MPEG LA's AVC Patent Portfolio License
• Xpeedic's IRIS Qualified on GLOBALFOUNDRIES 12LP Process for High-Performance Applications
• Cadence Reports Fourth Quarter and Fiscal Year 2018 Financial Results
• JEDEC Updates Standard for Low Power Memory Devices: LPDDR5
• 25 Gigabit Ethernet Consortium Offers Low Latency Specification for 50GbE, 100GbE and 200GbE HPC, Financial and Other Performance-Critical Networks
• Wave Computing Creates MIPS Open Advisory Board
• Cadence and Green Hills Software Announce Strategic Partnership to Accelerate Embedded System Safety and Security

Headlines for Tuesday Feb. 19, 2019

Top Story

Autotalks and CEVA Collaborate on World's First Global V2X Solution

In advance of MWC19™, CEVA and Autotalks announced today that the companies collaborated to add C-V2X Rel. 14/15 support to the CEVA-XC DSP based Autotalks chipset, making it the world's first and only available solution capable of supporting both DSRC and C-V2X direct communications.

• GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications
• Qualcomm Unveils World's Most Advanced Commercial Multimode 5G Modem to Accelerate Global 5G Rollout
• Moving AI Processing to the Edge Will Shake Up the Semiconductor Industry
• UltraSoC selects Redtree for expanding European market opportunity
• Intel Buys Indian SoC Designer Ineda Systems
• Renesas Electronics Develops 28nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures
• eMemory Receives ISSCC Award for Breakthrough Security Technology
• AccelerComm introduces software only 5G NR channel coding IP at MWC Barcelona 2019

Headlines for Monday Feb. 18, 2019

Top Story

Chips&Media paving new road towards 8K with launch of Dual-CORE HEVC+H.264 combined codec IP

Chips&Media, a leading video technology provider, announced WAVE541C, Dual-CORE HEVC+H.264 combined codec IP optimally architected for 8K resolution video based on WAVE521C.

• TSMC January 2019 Revenue Report
• Palma Ceia SemiDesign Announces Silicon-Proven Dual Band LTE NB-IoT Transceiver for IoT Applications
• Open Source Hardware Benefits Procurement Practices

Headlines for Friday Feb. 15, 2019

Top Story

UltraSoC extends on-chip analytics architecture for the age of machine learning, artificial intelligence and parallel computing

Developers in the automotive, storage and high performance computing industries can now integrate even more sophisticated hardware-based security, safety and performance tuning capabilities within their products, as well as reaping substantial time-to-market and cost benefits of using UltraSoC in the system on chip (SoC) development cycle.

• Cadence Selected as Primary EDA Tool Vendor by GLOBALFOUNDRIES
• Can MIPS Leapfrog RISC-V?

Headlines for Thursday Feb. 14, 2019

Top Story

Next-generation Armv8.1-M architecture: Delivering enhanced machine learning and signal processing for the smallest embedded devices

We’re introducing Arm Helium technology, the M-Profile Vector Extension (MVE) for the Arm Cortex-M series processors that will enhance the compute performance of the Armv8.1-M architecture on the secure foundation of Arm TrustZone.

• SiFive Sees Big Year for RISC-V
• Soitec Becomes Strategic Partner of Silicon Catalyst Start-up Incubator
• Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception
• SMIC Reports 2018 Fourth Quarter Results
• SmartDV Unveils SimXL Portfolio of Synthesizable Transactors for Hardware Emulation, FPGA Prototyping Platforms
• UMC Reports Sales for January 2019
• eSilicon builds momentum as a strong tier one FinFET ASIC supplier
• Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity

Headlines for Wednesday Feb. 13, 2019

Top Story

Can Arm Survive RISC-V Challenge?

Arm offers limited flexibility compared to RISC-V or MIPS. No one wants to spend months negotiating license terms under today's cost and time-to-market pressures.

• CEVA, Inc. Announces Fourth Quarter and Year End 2018 Financial Results
• Silicon Creations' PLL Technology Contributes to the First 7nm Mass Production Mining Chip

Headlines for Tuesday Feb. 12, 2019

Top Story

Andes Technology Corp. Targets Deeply Embedded Protocol Processing and Entry-level MCUs With the New N22, the Smallest RISC-V Core in its V5 Family

Andes Technology announces the new N22 32-bit RISC-V CPU core to target deeply embedded protocol processing such as high-speed communication and storage, and entry-level MCU applications such as small IoT and wearable devices.

• 200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports
• AccelerComm Lands Funding for 5G New Radio and 4G LTE Networks IP
• Achronix Announces Partner Program for Speedster, Speedchip, and Speedcore Ecosystem
• ISSCC 2019: eSilicon to present a paper and demonstrate 7nm 56G DSP SerDes operation over a five-meter cable assembly
• Sankalp Semiconductor to Exhibit & Participate at IESA Vision Summit 2019
• Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML

Headlines for Monday Feb. 11, 2019

Top Story

TDK-Micronas renews its trust in Dolphin Integration's RAM and ROM Silicon IPs

TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products.

• AIStorm Raises $13.2M to Bring Real-Time AI-in-Sensor Technology to the Edge at a Fraction of the Cost
• GUC Monthly Sales Report - Jan 2019

Headlines for Friday Feb. 08, 2019

Top Story

China IC Production Forecast to Show a Strong 15% 2018-2023 CAGR

IC production in China represented 15.3% of its $155 billion IC market in 2018, up from 12.6% five years earlier in 2013.

• SoC-e networking IP porfolio extends with SpaceWire: The standard for Spacecraft communication networks

Headlines for Thursday Feb. 07, 2019

Top Story

Apple, Q'comm Fight Over Engineers

The latest battle of the all-out war between Apple and Qualcomm is taking a human toll. The iPhone designer is hiring cellular baseband engineers in San Diego, Qualcomm’s backyard.

• NVMe Over TCP Will Take Time to Eclipse RDMA
• New intoPIX FlinQ Image Technology Empowers Next Generation DM NVX Network AV
• Graphcore leverages Mentor DFT solutions to speed time to market for innovative AI acceleration chip
• Eclipse Ventures Adds Mike McNamara and Sanjay Jha As General Partners

Headlines for Wednesday Feb. 06, 2019

Top Story

Logic Design Solutions Introduces the first member of NVMe HOST RECORDER IPs

The NVME-HOST-RECORDER-ITX-Z7 IP completes an existing family of SATA RECORDER IP of Logic Design Solutions (LDS) in order to provide a complete panoply in embedded recording domain.

• Sital Technology Announces the World's First Secured 1553 Component
• SmartDV Supports RISC-V Movement with TileLink Verification IP for RISC-V Based Systems
• Audinate adds intoPIX best-in-class JPEG2000 Technology to new Dante AV Product Design Suite
• Arm takes centre stage at Mobile World Congress 2019
• AdaCore Enhances Security-Critical Firmware With NVIDIA
• EDN Names Achronix's Speedcore Gen4 eFPGA to its Hot 100 Products of 2018

Headlines for Tuesday Feb. 05, 2019

Top Story

MuxLab Leverages intoPIX's Ultra Low Latency JPEG 2000 to Manage 4K60 on 1GbE Networks

intoPIX announced today that MuxLab, a forerunner and manufacturer of AV over IP connectivity and distribution solutions, is adopting their JPEG 2000 Ultra Low Latency technology for future AV over IP products.

• Arteris IP FlexNoC Interconnect Used by NationalChip for Set Top Box (STB) Chips
• Xilinx Introduces HDMI 2.1 IP Subsystem

Headlines for Monday Feb. 04, 2019

Top Story

Mobile Semiconductor Introduces A New 55nm High Density Memory Compiler Especially Designed For IoT Devices

Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market. The new memory compiler boasts one of the highest density footprints in the industry dramatically reducing the die area and reducing customer product costs for sensors, smart locks, trackers and smart light bulbs.

• Renesas to Cut 1,000 Jobs in Japan
• Gartner Says Four Chinese OEMs Were Among the Top 10 Global Semiconductor Customers in 2018
• Global Semiconductor Sales Increase 13.7 Percent to $468.8 Billion in 2018
• FABU Technology Selects Synopsys' DesignWare IP Portfolio to Deliver Intelligence in ADAS and Autonomous Driving SoCs
• intoPIX and Macnica Preview a 4K AV over 1GbE Module Powered by TICO-XS and ST 2110 IP Transport for Pro AV Market at ISE 2019

Headlines for Friday Feb. 01, 2019

• Semiconductor R&D Spending Will Step Up After Slowing