D&R Headline News (April 2019)

Headlines for Tuesday Apr. 30, 2019

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Multiple Arteris IP FlexNoC Interconnect Licenses Purchased by VeriSilicon for Multiple Chip Designs

Arteris IP today announced that VeriSilicon has licensed Arteris FlexNoC interconnect IP as the on-chip communications backbone for use in multiple chips developed by the VeriSilicon team.

• Synopsys Launches New VESA DSC IP for Visually Lossless Compression in Mobile, AR-VR, and Automotive SoCs
• Global Semiconductor Sales Down 15.5 Percent in First Quarter of 2019
• Survey: China's Fabless IC Firms Optimistic on Sales Growth
• eSilicon Expands Technical Advisory Board
• GOWIN Adopts HyperBus for built-in PSRAM and HyperRAM Interfacing
• Moortec To Showcase Its PVT Monitoring IP At TSMC 2019 Boston Technology Workshop

Headlines for Monday Apr. 29, 2019

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ARM, MIPS, Imagination lose IP market share

In 2018, leading intellectual property licensor ARM Ltd. lost market share along with its peers Imagination Technologies and Wave Computing, the owner of MIPS.

• Arm announces appointment of Inder Singh as Chief Financial Officer
• Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017
• Intel Cuts 2019 Sales Forecast
• eSilicon Signs Multi-Year Agreement with Google Cloud
• SiFive Announces Strategic Partnership with QuickLogic and Launches SoC Templates for Rapid Chip Design

Headlines for Friday Apr. 26, 2019

• TSMC Strengthens OIP Cloud Alliance with New Partner and New Solution Enablement

Headlines for Thursday Apr. 25, 2019

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Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from "Edge to Cloud"

Gyrfalcon Technology Inc. (GTI), the chip innovator with the industry's densest AI inference accelerators, is offering the technology powering the company's Lightspeeur® 2801 and 2803 AI accelerators for use in custom SoC designs through a new IP licensing model for companies seeking the ultimate level of chip customization.

• Intilop Delivers Their Enhanced One Thousand TCP/UDP Session Hardware Accelerator and Kernel Bypass Linux Driver for Hyper-Performance Networking Systems
• Xilinx to Acquire Solarflare
• Tamba Networks' IP Selected for Innovium's TERALYNX 12.8 Tbps Data-Center Optimized Switch
• TSMC Steps Through 7, 6, 5, Moore
• Docker and Arm Partner to Deliver Frictionless Cloud-native Software Development and Delivery Model for Cloud, Edge, and IoT
• Xilinx Reports Record Revenues Exceeding $3 Billion For Fiscal 2019

Headlines for Wednesday Apr. 24, 2019

• Synopsys Design Platform Certified for TSMC's Innovative SoIC Chip Stacking Technology
• Cadence Design Solutions Certified for TSMC-SoIC Advanced 3D Chip Stacking Technology
• North American Semiconductor Equipment Industry Posts March 2019 Billings

Headlines for Tuesday Apr. 23, 2019

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Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process

Close to 30 leading semiconductor companies have selected Synopsys' 7nm DesignWare IP portfolio to deliver their high-performance, low-power system-on-chips (SoCs) for a range of applications including mobile, cloud computing, and automotive.

• Mobiveil, Inc. today announced availability of its PCI Express 5 controller IP
• Arasan Announces its Total eMMC IP Solution on TSMC 7nm Process Technology
• Analog Bits Showcases PCIe Gen2 / Gen3 / Gen4 Reference Clock PHY Design Kits Available on TSMC 7nm / 12nm / 16nm / 22nm process technology
• Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips
• Rambus Reports First Quarter 2019 Financial Results
• Alphawave Joins TSMC IP Alliance Program
• Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements
• TSMC Celebrates 25th Anniversary of the North American Technology Symposium
• Cadence Reports First Quarter 2019 Financial Results
• Radiant 1.1 Lattice FPGA Design Tools Release Accelerates Design Reuse
• Silvaco Opens Chengdu Office to Support Company's China Expansion and Growing Demand for Power Semiconductor Design Solutions
• Tortuga Logic and Synopsys Collaborate to Deliver System-Level Security to SoCs Built with Synopsys DesignWare ARC Processor IP

Headlines for Monday Apr. 22, 2019

• Machine Learning on DSPs: Enabling Audio AI at the Edge
• Graphcore CEO Touts 'Most Complex Processor' Ever
• TSMC Certifies Synopsys' Digital and Custom Design Platforms on TSMC 5nm FinFET Process Technology
• Desay SV Standardizes on Synopsys Virtualizer Virtual Prototyping Solutions
• Cadence Collaborates with TSMC to Accelerate 5nm FinFET Innovation, Enabling Next-Generation SoC Production Design
• ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility
• RISC-V, DARPA Advance Security

Headlines for Friday Apr. 19, 2019

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Mercury Systems Announces Acquisitions of The Athena Group and Syntonic Microwave

Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) today announced the acquisitions of The Athena Group, Inc. (Athena) and Syntonic Microwave LLC (Syntonic). The all cash purchase price for both transactions was $46 million in total.

• Arm China selects Mentor's Questa Verification Solution to enhance power efficiency and speed development of MCU designs

Headlines for Thursday Apr. 18, 2019

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Allegro DVT Introduces the Industry First Real-Time AV1 Video Encoder Hardware IP for 4K/UHD Video Encoding Applications

Allegro DVT, a leading provider of video semiconductor IP solutions, today announced the availability of its AL-E210 multi-format video encoder hardware IP which adds support for the new AV1 video format developed by the Alliance for Open Media (AOMedia).

• Synopsys Establishes Center of Excellence with STMicroelectronics to Speed Development of Automotive Electronic Systems
• Intel to Exit 5G Smartphone Modem Business, Focus 5G Efforts on Network Infrastructure and Other Data-Centric Opportunities
• Globalfoundries' Morgenstern: Diversity is key in Dresden
• TSMC Reports First Quarter EPS of NT$2.37
• Safety, cybersecurity and cost delaying mass deployment of autonomous cars
• Rambus Announces Tapeout and Availability of 112G Long Reach SerDes PHY on Leading-edge 7nm Node for High-Performance Communications and Data Centers

Headlines for Wednesday Apr. 17, 2019

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Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the Cadence® LPDDR4/4X memory IP subsystem, utilizing TSMC’s 16nm FinFET Compact (16FFC) technology, has achieved ISO 26262 ASIL C certification from SGS-TÜV Saar.

• Moortec to Showcase its PVT Monitoring IP at TSMC 2019 Technology Symposium
• M31 Technology Develops SRAM Compiler IP on TSMC's 28nm Embedded Flash Process Technology Providing High Performance and Low Power Solutions
• Qualcomm and Apple agree to drop all litigation
• Exablaze and Algo-Logic partner to deliver ultra-low latency trading solutions

Headlines for Tuesday Apr. 16, 2019

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Intel Acquires Omnitek, Strengthens FPGA Video and Vision Offering

Intel Corporation today announced the acquisition of Omnitek, a leading provider of optimized video and vision FPGA IP solutions. Omnitek’s technology enables customized high-performance vision and artificial intelligence (AI) inferencing capabilities on FPGAs for customers across a range of end markets.

• Omnitek achieves world-leading CNN performance per watt in a midrange programmable device.
• Arteris IP FlexNoC Interconnect Licensed by DisplayLink for Systems-on-Chip
• Fujitsu Begins Production of Post-K
• TSMC Unveils 6-nanometer Process
• Samsung Successfully Completes 5nm EUV Development to Allow Greater Area Scaling and Ultra-low Power Benefits

Headlines for Monday Apr. 15, 2019

• EDA Industry Revenue Grows for Full Year 2018 but Slows for Fourth Quarter

Headlines for Friday Apr. 12, 2019

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Cobham Processor Technology Powers Commercial NanoSatellite

SSTL, a UK based company specialising in agile space platforms, has recently confirmed the successful commissioning and operation of VESTA-1, a 3U nanosatellite technology demonstration mission that will test a new two-way VHF Data Exchange System (VDES) payload developed by Honeywell for the ExactEARTH advanced maritime satellite constellation.

• DynapCNN - the World's First 1M Neuron, Event-Driven Neuromorphic AI Processor for Vision Processing
• Countdown: How Close is China to 40% Chip Self-Sufficiency?
• Ampere Computing raises new round of capital, including new investor Arm

Headlines for Thursday Apr. 11, 2019

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Wave Computing Unveils New Licensable 64-Bit AI IP Platform to Enable High-Speed Inferencing and Training in Edge Applications

Wave’s TritonAI 64 platform delivers 8-to-32-bit integer-based support for high-performance AI inferencing at the edge now, with bfloat16 and 32-bit floating point-based support for edge training in the future.

• SiFive Tapes Out First in a Series of 7nm IP Enablement Platforms
• Gartner Says Worldwide Semiconductor Revenue Grew 12.5 Percent in 2018
• CEVA Wins 2018 CEM Editor's Choice Award for its NB-IoT IP Solution
• Qorvo to Acquire Active-Semi International

Headlines for Wednesday Apr. 10, 2019

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Flex Logix Launches InferX X1 Edge Inference Co-Processor That Delivers Near-Data Center Throughput at a Fraction of the Power and Cost

Flex Logix® Technologies, Inc. today announced that it has leveraged its core patent-protected interconnect technology from its embedded FPGA (eFPGA) line of business combined with inference-optimized nnMAX™ clusters to develop the InferX X1 edge inference co-processor.

• 2018 Global Semiconductor Equipment Sales Jump to Record $64.5 Billion
• TSMC March 2019 Revenue Report
• Creonic Shows 100 Gbps Polar Decoder in International SENDATE-TANDEM Research Project
• Michael Boukaya Promoted to Chief Operating Officer of CEVA, Inc.
• SiFive Launches the World's Smallest Commercial 64-bit Embedded Core
• SmartDV's DVCon China Exhibit to Showcase Extensive Verification IP Portfolio

Headlines for Tuesday Apr. 09, 2019

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Faraday Unveils RISC-V ASIC Solution to Support Edge AI and IoT SoCs

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today revealed that its RISC-V based ASIC platform solution has been successful in the design and mass production of next-generation edge AI and IoT system-on-chips (SoCs).

• Synaptics Selects and Designs SiFive Custom E2 Series Core IP in Record Time
• First software-driven JPEG XS solutions demonstrated by intoPIX at NAB Show 2019.
• UMC Reports Sales for March 2019
• Vidatronic Announces Series of 40 nm Integrated Power Management Unit (PMU) IP Cores Optimized for Wireless and NB-IoT Applications
• Numem Inc. Exhibits at IP-SoC Santa Clara 2019

Headlines for Monday Apr. 08, 2019

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intoPIX announces availability of TICO-XS IP-cores supporting HD and 4K with a low FPGA footprint at NAB 2019

intoPIX, leading provider of innovative compression technol-ogies, announced today the release of their first TICO-XS IP-cores for Intel and Xilinx FPGAs. TICO-XS is the next generation of popular TICO lightweight compression, being standardized as JPEG XS at the ISO JPEG committee.

• GUC Monthly Sales Report - March 2019
• Sofics Releases Analog IO's and ESD protection clamps for Advanced Applications using TSMC 7nm FinFET process
• intoPIX TICO-RAW technology to simplify and improve image signal processing of next-gen 4K & 8K cameras at NAB Show 2019
• Andes Records a Rapid Growth of Design Wins in 2018 For Its New Family of RISC-V Processor Cores
• Intrinsic ID's BroadKey Delivers Hardware Root-of-Trust Security at Core of Authentico's New Password Security System
• Sankalp Semiconductor to Exhibit & Present at Design & Reuse IPSoC Santa Clara 2019

Headlines for Thursday Apr. 04, 2019

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PLDA Announces Two Innovative vDMA Engine IP Solutions, Delivering Robust Performance and Scalability across a PCIe link or AMBA AXI fabric

PLDA today announced two innovative DMA engine solutions designed to manage large and heterogeneous data traffic across a PCIe link or across an AMBA AXI fabric solution. PLDA’s new IP products are an elegant and streamlined solution that delivers high-end performance and is easy to integrate into design planning.

• V-Nova and NGCodec ship industry's lowest cost real-time UHD encoding
• Silvaco CTO, Babak Taheri, to Present at IP-SoC Santa Clara, April 9

Headlines for Wednesday Apr. 03, 2019

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TSMC and OIP Ecosystem Partners Deliver Industry's First Complete Design Infrastructure for 5nm Process Technology

TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets.

• Intel driving Data-Centric World with new 10nm Intel Agilex FPGA Family
• Cadence Unveils Clarity 3D Solver, Delivering Unprecedented Performance and Capacity for System Analysis and Design
• Menta and Mentor Partner for High-Level Synthesis of Embedded FPGA IP

Headlines for Tuesday Apr. 02, 2019

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Silex Insight expands into North America with opening of Silicon Valley office

Silex Insight, provider of Intellectual Property (IP), hardware/software for secure computing and custom OEM solutions for AV over IP/video IP codec, has announced the opening of their first US office in San Jose, California.

• Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips
• proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
• Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
• Global Semiconductor Sales Decrease 7.3 Percent Month-to-Month in February
• Sambanova Systems Announces $150M Series B From Intel Capital And GV To Advance Its Breakthrough AI Platform
• Movellus Raises $6M in Venture Funding, Led by Stata Venture Partners
• Global Semiconductor Materials Sales Hit New High of $51.9 Billion

Headlines for Monday Apr. 01, 2019

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Cadence Extends Cloud Leadership with New CloudBurst Platform for Hybrid Cloud Environments

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the new Cadence® CloudBurst Platform for hybrid cloud environments, providing customers with fast and easy access to pre-installed Cadence design tools in a ready-to-use cloud environment built on either Amazon Web Services (AWS) or Microsoft Azure.

• SMIC Rift: Rare Peek into China IC Industry
• Processors, Sensors Drive Embedded Vision
• Attopsemi's I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
• The MOST Ultimate OTP Technology - AGIC Particle Momentum
• Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology
• Omnitek Releases Highly Optimised 3D LUT IP for FPGAs
• SMIC Announces 2018 Annual Results
• Renesas Completes Acquisition of Integrated Device Technology
• Vidatronic Sponsors Design & Reuse's IP SoC Days Conference 2019 in Santa Clara