D&R Headline News (May 2019)

Headlines for Friday May. 31, 2019

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Avery Design Systems Announces SymXprop for X Accurate RTL Simulation

Avery Design Systems Inc., an innovator in functional verification productivity solutions, today announced availability of SymXprop that performs high accuracy semi-formal based RTL X handling to eliminate the inherent inaccuracies in logic simulators.

• Wave Computing and Imperas Introduce New MIPS Open Simulator - MIPSOpenOVPsim
• Avery Design Systems Announces SimCluster GLS to Accelerate Gate-Level Sign-Off Simulations
• True Circuits Demonstrates Silicon Proven DDR 4/3 PHY at the Design Automation Conference

Headlines for Thursday May. 30, 2019

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PCI-SIG Achieves 32GT/s with New PCI Express 5.0 Specification

PCI-SIG® today announced the release of PCI Express® (PCIe®) 5.0 specification, reaching 32GT/s transfer rates, while maintaining low power and backwards compatibility with previous technology generations.

• Synopsys Extends Leadership with Enhanced Verification Continuum Platform
• Synopsys Design and Verification Solutions Enable Astera Labs to Develop Industry's First PCIe 5.0 Retimer SoC
• Pixilica Licenses SiFive's RISC-V Embedded Processor IP
• Efinix and M31 Technology Corporation Partner to Address Demand for Emerging AI Edge Computing Requirements
• Moortec to Showcase its High Accuracy Embedded Sensing Fabric at DAC 2019 in Las Vegas

Headlines for Wednesday May. 29, 2019

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Mixel MIPI D-PHY IP Integrated into Teledyne e2v Snappy CMOS Image Sensors

Mixel® Inc., a leader in mixed-signal intellectual property (IP), and Teledyne Imaging, a leader in sensor, signal generation, and image processing, today announced that Mixel MIPI® IP has been successfully integrated into Teledyne e2v Snappy 2-Megapixel and 5-Megapixel CMOS Image Sensor IC products.

• NXP to acquire Marvell's WiFi and Bluetooth Connectivity Assets
• MediaTek Unveils Groundbreaking New 5G SoC for First Wave of 5G Flagship Devices
• BrainChip Announces the Availability of Advanced AI Intellectual Property
• Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It's Possible!

Headlines for Tuesday May. 28, 2019

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Sofics' clipping/scaling circuit enhances reliability of Near Field Communication (NFC) and other wireless interfaces

Sofics announced that its technology to protect wireless antenna pads is now published as a patent by the European Patent Office. The clipping/scaling circuit is used to protect the Near Field Communication (NFC) antenna pads in an ultra-low power Bluetooth chip with 'Touch-to-pair' functionality.

• NVIDIA Deploys the New Cadence Protium X1 Platform to Accelerate Software Development of Large-Capacity GPUs
• Cadence Launches Protium X1, the First Scalable, Data Center-Optimized Enterprise Prototyping System for Early Software Development
• Synopsys Introduces PrimeYield for 100X Faster SoC Yield Analysis and Optimization
• Hex Five Adds MultiZone Security to the AdaCore Software Ecosystem
• IC Compiler II with Advanced Fusion Technologies Delivers Optimal QoR and Reduces ECO Turnaround Time More Than 40% at Juniper Networks
• Silvaco Announces Viola I0-X - 10X Faster I/O Pad Characterization for Nanometer Silicon

Headlines for Monday May. 27, 2019

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Delivering next-generation AI experiences for the 5G world

Over the past 12+ months here at Arm we have delivered several new solutions which scale from the edge of the network to the cloud. These include Arm’s Project Trillium, Arm® Neoverse™, two new Automotive Enhanced processors with new safety features, and our Pelion IoT platform for securely managing IoT devices.

• TSMC to Keep Supplying Chips to Huawei
• Faraday Showcases FinFET ASIC Solutions and SoCreative!V SoC Platform at DAC 2019
• Synopsys and Arm Collaborate to Enable Tapeouts by Early Adopters of Arm's Latest Premium Mobile Processors
• Cadence Full-Flow Digital and Signoff Tools Optimized for New 7nm Arm Cortex-A77 CPU
• Credo First to Demonstrate 7nm, 112G XSR SerDes
• eSilicon Technical Advisory Board Members Win Facebook Research Award

Headlines for Thursday May. 23, 2019

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AnalogX Launches Ultra Low Power Interconnect SerDes IP Portfolio to Fuel Next-Generation I/O Connectivity

AnalogX Inc., a Canadian corporation, is delighted to unveil its new, silicon-proven, multi-protocol, 1 to 33Gbps AXLinkIO connectivity IP portfolio. The AXLinkIO portfolio of Serializer/Deserializer interconnect IP solutions is ideally suited for high-bandwidth chiplets and chips in AI processors, 5G networking, optical interfaces, and datacenter computing.

• TSMC-Certified OIP Virtual Design Environment with Synopsys Tools Now Available on Google Cloud
• Synopsys Delivers 100X Faster Formal Verification Closure for AI, Graphics, and Processor Designs
• CAST Expands Popular UDP/IP Networking Cores Line
• SmartDV Unveils First Verification IP to Support Ethernet TSN
• OneSpin's Newest App Assures Quality of RISC-V Processor Cores for Safety-, Security-Critical Applications
• Thinci Deploys Full Cadence Verification Suite for AI Designs, Accelerating Project Schedule by Months
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2019
• IAR Systems takes RISC-V to the next level with launch of professional development tools with leading performance and ensured code quality
• AGIC Technology to Achieve In-Memory Computing for AI Edge Computation
• Synopsys Announces Software-driven SoC Power Analysis Solution, Enabling 1000X Faster Time-to-Results
• SmartDV Speeds Delivery of its New CXL Verification IP

Headlines for Wednesday May. 22, 2019

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Arasan announces the immediate availability of its MIPI CSI-2 v2.1 IP supporting C-PHY v1.2 and D-PHY v2.1

Arasan Chip Systems announces the immediate availability its MIPI CSI-2 v2.1 Tx and Rx IP Cores seamlessly integrated with its MIPI C-PHY v.1.2 IP supporting speeds of upto 3.5gsps and D-PHY v2.1 supporting speeds of upto 4.5gbps.

• Arm Deals Massive Blow to Huawei
• MVSILICON License and Deploy CEVA Bluetooth IP in its latest Wireless Audio Platform
• Fraunhofer IIS Licenses MPEG-H Audio Patents to LG Electronics
• US Grants 90-Day Reprieve for Huawei Suppliers
• North American Semiconductor Equipment Industry Posts April 2019 Billings
• After 2Q19 Bottom, Expectations Increase for a 3Q19 IC Market Rebound
• Sankalp Semiconductor to Exhibit at Design Automation Conference - 2019

Headlines for Tuesday May. 21, 2019

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Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance with Adaptability for High-Bandwidth Data Acceleration Applications

The Achronix Speedster®7t family – based on a new, highly optimized architecture – goes beyond traditional FPGA solutions featuring ASIC-like performance, FPGA adaptability and enhanced functionality to streamline design.

• sureCore Appoints Cedric Plomion Global Sales Director
• Avatar Integrated Systems Physical Implementation Tool Certified on TSMC 7nm FinFET Process
• Arteris IP and Wave Computing Collaborate on Reference Architecture for Enterprise Dataflow Platform
• Faraday Geared Up for Data Communication Applications in ASIC Development
• Innovative Logic USB IP Portfolio Strengthens RISC-V Ecosystem
• Minima Processor names Semiconductor Veteran Tuomas Hollman as CEO
• Marvell to Acquire Avera Semi, Creating an Infrastructure ASIC Powerhouse
• ClioSoft and Silvaco Collaborate to Integrate ClioSoft's SOS Design Data Management Platform with Silvaco's Analog Custom Design Tools

Headlines for Monday May. 20, 2019

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INGChips selects Dolphin Integration's Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash

Dolphin Integration, a leading provider of semiconductor IP, announced today that INGChips, a fabless semiconductor company that focuses on ultra low power IoT wireless SoC, has selected Dolphin Integration’s comprehensive set of Power Management IPs for INGChips’ Bluetooth Low-Energy (BLE) SoC in 40 nm with embedded Flash memory.

• Synopsys and Kudan Collaborate to Accelerate Development of Intelligent Computer Vision Processing SoCs
• Lattice's New MachX03D FPGA Enhances Security with Hardware Root-of-Trust Capabilities
• CEVA Announces Availability of SLAM Software Development Kit for CEVA-XM Intelligent vision DSPs and NeuPro AI Processors
• Cadence Palladium and Protium Platforms Enable Innovium to Accelerate First-Pass Silicon Success for the Data Center Market

Headlines for Friday May. 17, 2019

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Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung

Intel replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17. While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held from 1993 through 2016.

• Intrinsic ID Secures EUR 11 Million Loan from European Investment Bank
• lowRISC Expands and Appoints New Members to the Board of Directors from Google and ETH Zurich

Headlines for Thursday May. 16, 2019

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SmartDV Reduces Protocol Debug Time with Smart ViPDebug

SmartDV™ Technologies today unveiled Smart ViPDebug™, a protocol debugger that reduces debug time by rapidly identifying violations and reducing the time needed to find the cause of violations through its linked waveform and transaction database views.

Headlines for Wednesday May. 15, 2019

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New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets

Cadence today expanded the high end of its popular Tensilica® Vision DSP product family with the introduction of the Cadence® Tensilica Vision Q7 DSP delivering up to 1.82 tera operations per second (TOPS).

• Making virtual more of a reality with the new Arm Mali-D77 display processor
• Arm demonstrates new IoT test chip and board for highly efficient, secure IoT designs
• Samsung Electronics' Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform
• AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor
• eSilicon Announces Production Qualification of 5G Infrastructure ASIC
• Cadence Announces Broad Next-Generation Memory Standard Support in Samsung Foundry's Advanced Process Technologies
• Cadence Tapes Out 112G Long-Reach SerDes IP on Samsung Foundry's 7LPP Process Technology
• Silicon Labs Partners with Pulsic, Selecting Animate as Its Automated Layout Solution for Analog IC Designs

Headlines for Tuesday May. 14, 2019

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Wave Computing Adds MIPS32 microAptiv Cores to MIPS Open Program

Wave Computing today announced it will include the MIPS32® microAptiv™ cores in the newest release of MIPS Open program components.

• Arteris IP FlexNoC Interconnect and Resilience Package Licensed by Black Sesame for ISO 26262-Compliant AI Chips for ADAS
• Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
• EDA Vendors Spread Wings as Market Softens
• Tiempo Secure Joins Deutsche Telekom's nuSIM Partnering Network
• Eta Compute Awarded Additional Patent For Asynchronous Microprocessor Technology

Headlines for Monday May. 13, 2019

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Amphion Semiconductor introduces 4K/UHD capable AV1 video decoder hardware IP extension to its Malone video decoder family

Amphion has announced the scheduled availability of a hardware based AV1 decoding extension to its Malone family of high performance video decoders for SoC implementation.

• Cadence Custom/AMS Flow Certified for Samsung 28nm FD-SOI Process Technology
• Samsung Foundry Begins Partnership with Silvaco to Launch their Semiconductor IP Assets
• Elektrobit and Synopsys Collaborate to Accelerate Automotive Electronic System Virtual Development
• Does a SCM Controller Need a Translation Table?
• Agile Analog secures $5M in funding to change the semiconductor industry
• Moortec Support Canaan Creatives Mass Production ASIC on TSMC 7nm Process
• PowerVR GPU and NNA available on SiFive platform

Headlines for Friday May. 10, 2019

• TSMC April 2019 Revenue Report
• Intel Targets 2021 for 7 nm
• Texas Instruments Widens Its Lead As World's Top Analog IC Supplier
• ON Semiconductor Executive Named to Alphacore Inc. Advisory Board
• ClioSoft Achieves TUV SUD Certification in Support of Automotive ISO 26262 Standard

Headlines for Thursday May. 09, 2019

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Imagination announces ray tracing technology for licensing

Imagination Technologies announces its PowerVR Ray Tracing technology for licensing, enabling state-of-the-art realistic image rendering using light-modelling techniques to be integrated into graphics processing units (GPUs) across mobile, automotive, server and other markets.

• CoreHW and RoodMicrotec to establish long-term supply chain partnership
• UMC Reports Sales for April 2019
• eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
• Algo-Logic Systems Delivers Ultra-Low-Latency Pre-Trade Risk Check (PTRC) Solution Powered by Xilinx
• Wave Computing Appoints Industry Veteran Art Swift CEO
• Efinix Partners with Samsung to Develop Quantum eFPGAs on 10nm Silicon Process
• SMIC Reports 2019 First Quarter Result
• SmartDV Appoints HyperSilicon Exclusive Sales Representative in China

Headlines for Wednesday May. 08, 2019

• GOWIN Semiconductor Joins Arm DesignStart Offering Free Arm Cortex-M Processors for its FPGA Product Families

Headlines for Tuesday May. 07, 2019

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eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip

eSilicon announced today the tapeout of a 7nm test chip to validate the latest neuASIC™ IP platform release. eSilicon’s neuASIC IP platform provides a library of IP that supports a wide range of functions found in artificial intelligence applications.

• Fudan Microelectronics Group Selects Synopsys' DesignWare Bluetooth IP for Smart IoT System-on-Chips
• Cycle-accurate trace boosts performance optimization capabilities of UltraSoC embedded analytics infrastructure
• Arteris IP FlexNoC & Resilience Package Licensed by Semidrive for ISO 26262-Compliant Autonomous Driving Chips
• Cadence Delivers Smart JasperGold Formal Verification Platform
• Codasip Presence at upcoming events: China Roadshow, DAC 2019, and RISC-V Workshop Zurich

Headlines for Monday May. 06, 2019

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Blu Wireless raises $16.6 million in growth funding round for 5G applications

mmWave System IP specialist Blu Wireless has raised £12.7m ($16.6m) in a growth funding round led by existing investors Arm, Calculus Capital, Kendall and MGL, and including major new investor Guinness Asset Management.

• ON Semi Acquiring GF Fab Deemed a Win-Win
• CEVA, Inc. Announces First Quarter 2019 Financial Results
• GUC Monthly Sales Report - Apr 2019
• Sankalp Semiconductor to Exhibit at ChipEx - 2019
• OPENEDGES NoC (Network on Chip) Interconnect IP & DDR Controller licensed by ASICLAND
• PRO DESIGN Launches Intel Arria 10-Based Product Family of FPGA-Based Prototyping Systems

Headlines for Thursday May. 02, 2019

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Qualcomm Booking $4.5B in Apple Deal

Qualcomm will book a whopping $4.5-$4.7 billion in third quarter revenues as part of the litigation settlement it struck with Apple in mid-April. The funds include both past due patent royalties Apple will pay and Qualcomm’s release from obligations to the iPhone designer and its contract manufacturers.

• Vela enters into strategic partnership with Enyx
• 1Q19 Registers the 4th Largest Sequential IC Market Decline on Record

Headlines for Wednesday May. 01, 2019

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Synopsys Announces Industry's First DDR5 NVDIMM-P Verification IP for Next-generation Storage-class Memory Designs

Synopsys today announced the availability of the industry's first verification IP (VIP) for Non-Volatile Dual In-line Memory Module (NVDIMM-P) for DDR5/4.

• ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment
• eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
• Comcores and DENSO AUTOMOTIVE Deutschland GmbH test TSN Ethernet for Automotive Applications in the Research Project EMPHASE
• Synopsys and Arm Extend Collaboration to Fusion Compiler to Accelerate Implementation of Arm's Next-Generation Client and Infrastructure Cores
• Moortec Provide Embedded Monitoring Solutions for Arm's Neoverse N1 System Development Platform on TSMC 7nm Process Technology