D&R Headline News (July 2019)

Headlines for Wednesday Jul. 31, 2019

• InAccel Accelerates XGboost and releases the IP core for FPGAs
• Despite 38% Sales Decline, DRAM Expected to Remain Largest IC Market
• Accellera Announces Public Source Code Repository

Headlines for Tuesday Jul. 30, 2019

Top Story

Wave Computing Signs New License Agreement with MediaTek

Wave Computing announced MediaTek has signed a new license agreement for Wave Computing’s MIPS® cores, designed for high-performance wireless communications, networking, automotive and AI applications, to fuel its next generation of connected products.

• Agile Analog Awarded Innovate UK Grant to Accelerate Semiconductor IP Development
• Tortuga Logic's Radix Hardware Security Verification Solutions Licensed by Xilinx

Headlines for Monday Jul. 29, 2019

Top Story

Rambus to Acquire Northwest Logic, Extending Leadership in Interface IP

Rambus today announced it has signed a definitive agreement to acquire Northwest Logic, a market leader in memory, PCIe and MIPI digital controllers.

• Rambus Reports Second Quarter 2019 Financial Results
• Khronos Releases OpenXR 1.0 Specification Establishing a Foundation for the AR and VR Ecosystem
• Alibaba Reveals 16-core RISC-V Chip
• SCALINX new ASIC design center in SOPHIA-ANTIPOLIS, France
• TSMC to Boost Recruitment by More Than 3,000 New Hires

Headlines for Friday Jul. 26, 2019

Top Story

Apple to Buy Intel's Modem Business for $1 Billion

Apple will pay about $1 billion to acquire Intel’s smartphone modem business, signaling that, despite a settlement reached with longtime supplier Qualcomm in April, Apple still has designs on its own silicon for 5G.

• Global GDP Impact on Worldwide IC Market Growth Expected to Rise
• North American Semiconductor Equipment Industry Posts July 2019 Billings

Headlines for Thursday Jul. 25, 2019

• New NVM Express, Inc. Specifications Bolster Cloud and Enterprise Advancements
• Taiwan Startups Build on Hardware Heritage with AI Focus
• Xilinx Reports Record Revenues In Fiscal First Quarter 2020
• Allegro DVT Announces the Availability of the First AVS3 Compliance Test Suite

Headlines for Wednesday Jul. 24, 2019

Top Story

Adesto's AFE IP Licensed by GCT Semiconductor for Advanced 4G LTE Modem

Adesto Technologies announces that GCT Semiconductor, a leading designer and supplier of advanced 4G and 5G mobile semiconductor solutions, selected multiple Adesto® IP cores for development of its next-generation 4G LTE Modem.

• Is Apple planning to acquire Intel's mobile business?
• UMC Reports Second Quarter 2019 Results
• Who's Who in the Exodus from China to Southeast Asia
• Silvaco Partners with Incubator Silicon Power Technology to Accelerate Success of Semiconductor Startups
• Mixel Granted US Patent for its Innovative MIPI D-PHY RX+ Configuration

Headlines for Tuesday Jul. 23, 2019

Top Story

TSMC Sees 5G Driving Strong Demand for 7nm

Taiwan Semiconductor Manufacturing Co. (TSMC) sees 5-nm and 7-nm demand improving from its earlier expectations, as the worldwide 5G development accelerates.

• Second Quarter 2019 Silicon Wafer Area Shipments Fall 2.2 Percent from First Quarter Levels
• Faraday Reports Second Quarter 2019 Financial Results 2Q19 Revenues NT$1.2 Billion, Up 11% QoQ
• Cadence Reports Second Quarter 2019 Financial Results
• Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones

Headlines for Monday Jul. 22, 2019

Top Story

CEVA Acquires Hillcrest Labs Intelligent Sensor Technologies Business from InterDigital

CEVA today announced the acquisition of the Hillcrest Laboratories, Inc. (Hillcrest Labs) business from InterDigital, Inc. Hillcrest Labs is a leading global supplier of software and components for sensor processing in consumer and IoT devices.

• CEOs Diverge on Moore's Law
• Gartner Says Worldwide Semiconductor Revenue to Decline 9.6% in 2019
• Cadence Introduces Conformal Litmus to Deliver Fastest Path to Full-Chip Constraints and CDC Signoff
• Startup Runs AI in Novel SRAM
• Nvidia Poaches Intel Safety Guru
• Innovium Adopts the Cadence Innovus Implementation System for Its Highly Scalable Switch Silicon Family for Data Centers

Headlines for Thursday Jul. 18, 2019

Top Story

Arasan announces the immediate availability of its Ultra Low Power MIPI D-PHY IP Compliant to D-PHY Specification v1.20 for TSMC 22nm SoC Designs

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of it’s 2’nd Generation MIPI D-PHY IP with Ultra Low Power Consumption for TSMC 22nm SoC’s.

• Synopsys and Ixia, a Keysight Business, Announce Collaboration to Enable Scalable Networking SoC Validation Solution
• UltraSoC-led consortium secures £2m Innovate UK funding to develop cybersecurity solutions for connected and autonomous vehicles
• InAccel releases world's first universal bitstream repository for FPGAs based on JFrog
• DSP Concepts and CEVA Partner to Streamline Audio/Voice DSP Software Development for High-End Sound Applications
• Semi Content in Electronic Systems Forecast to Drop to 26.4% in 2019
• TSMC Reports Second Quarter EPS of NT$2.57

Headlines for Wednesday Jul. 17, 2019

Top Story

Xiaomi picks up 6% stake in chip designer VeriSilicon

Smartphone major Xiaomi has picked up roughly 6 percent stake in chip designer VeriSilicon Holdings.

• Cadence Delivers Portable Test and Stimulus Methodology and Library
• PCIe a Battlefield for Intel, Rivals
• Lattice Semiconductor Delivers Flexible Connectivity for Industrial Vision Applications with New CrossLink Reference Design
• Pioneer Micro Technology Launches Silvaco PDK for its 0.35 um Silicon Foundry CMOS Process
• StreamDSP Announces Major Update to 17.3 IP Core

Headlines for Tuesday Jul. 16, 2019

Top Story

Arm Flexible Access gives chip designers the freedom to experiment and test before they invest

Arm announced today it is expanding the ways existing and new partners can access and license its technology for semiconductor design. Arm Flexible Access is a new engagement model enabling SoC design teams to initiate projects before they license IP and pay only for what they use at production.

• Alphawave IP Announces Immediate Availability of Advanced PCIe Gen1-5 PHY on TSMC's 7nm process
• SmartDV Adds DisplayPort 2.0 to its Portfolio of Verification IP
• New IP catalog from Terminus Circuits
• Attopsemi Technology Attended ChipEx2019 and Presented a Speech "I-fuse A Disruptive OTP (One-Time Programmable)"

Headlines for Monday Jul. 15, 2019

Top Story

WiSig Networks Adopts Palma Ceia SemiDesign for IoT Application Targeting Agricultural Environments

Palma Ceia SemiDesign (PCS) today announced WiSig Networks, an incubated company of Indian Institute of Technology Hyderabad, a developer of products for 5G wireless technology, has selected Palma Ceia’s NB-IoT transceiver for its latest product, an ecological monitoring and management system for use in agricultural applications.

• eSOL and Kalray extend their cooperation to address demanding needs of automotive, industrial and medical applications
• Accelerate Smart Embedded Vision Designs with Microchip's Expanding Low-Power FPGA Video and Image Processing Solutions
• Synopsys Awarded DARPA ERI Contract Extension for Analog/Mixed-Signal Emulation Technology Innovation
• Dolphin Integration and Maple Solutions announce their reseller partnership to support South Korean semiconductor companies

Headlines for Friday Jul. 12, 2019

Top Story

CFX announces commercial availability of anti-fuse OTP technology on SMIC 55HV process

CFX, the One-Stop Shop for nonvolatile memory technology and products announced today commercial availability of anti-fuse OTP technology on SMIC 55HV process.

• NSITEXE Accelerates Delivery of Data Flow Processor IP for Automotive and Industrial Applications Using the Cadence Digital Design Full Flow

Headlines for Thursday Jul. 11, 2019

Top Story

TSMC achieved massive sales turnaround in June

Leading foundry TSMC (Hsinchu, Taiwan) returned to year-on-year growth in June with sales that were up 21.9 percent on what they were in June 2018. For the same month UMC has provided a sharp contrast.

• The MOSIS Service Selects Synopsys' IC Validator for Large-scale FinFET SoCs
• IC Compiler II 2019 Extends Runtime and QoR Leadership with 2X Faster Throughput and 10% Lower Total Power
• DRAM Capex to Plunge 28% in 2019 After Huge Outlays in 2017-18
• Memory Startup Targets High-Performance Computing

Headlines for Wednesday Jul. 10, 2019

Top Story

RISC-V Foundation Announces Ratification of the RISC-V Base ISA and Privileged Architecture Specifications

The RISC-V base architecture is the interface between application software and hardware. Software that’s coded to this specification will continue to work on RISC-V processors in perpetuity, even as the architecture evolves through the development of new extensions.

• AI Seeks New Moore's Law
• TSMC June 2019 Revenue Report
• NTT, NTT DOCOMO, and SK TELECOM Join the HEVC Advance Patent Pool
• Cisco Intends to Acquire Acacia Communications

Headlines for Tuesday Jul. 09, 2019

Top Story

Think Silicon secures Seed investment round led by Metavallon VC

Metavallon VC is excited to be leading the first investment round into Patras, Greece based Think Silicon®, an IP-licensing, semiconductor technology company. Think Silicon specializes in developing ultra-low power graphics units, display controller and machine learning accelerator technology for display / vision devices in applications with high performance and ultra-low power consumption needs.

• UltraSoC joins AESIN to further automotive safety and security
• Arteris IP Ncore Cache Coherent Interconnect Licensed by Bitmain for Sophon TPU Artificial Intelligence (AI) Chips
• UMC Reports Sales for June 2019
• Verimatrix Brings Effortless Application Security to the Masses, Launches New ProtectMyApp Service for Developers

Headlines for Monday Jul. 08, 2019

Top Story

InAccel releases open-source Logistic Regression IP core for FPGAs

InAccel has released today as open-source the FPGA IP core for the training of logistic regression algorithms. The accelerated FPGA IP core offers up to 70x speedup compared to a single threaded execution and up to 12x compared to an 8-core general purpose CPU execution respectively.

• ESD Alliance Reports EDA Industry Revenue Increase for Q1 2019
• Omni Design Technologies opens design center in Bangalore, India
• GUC Monthly Sales Report - June 2019

Headlines for Thursday Jul. 04, 2019

• China's Tsinghua Launches DRAM Unit
• AGIC Tape Out First Silicon at 14nm FinFET Technology

Headlines for Wednesday Jul. 03, 2019

• Cadence Digital Full Flow Achieves Certification for Samsung Foundry 5LPE Process Technology

Headlines for Tuesday Jul. 02, 2019

Top Story

Vidatronic Announces New Silicon-Proven Power Management Unit Intellectual Property Core for Samsung Foundry

Vidatronic today announced the release of the latest addition to their Power Quencher® series, the VLDS0300LS130, a low dropout (LDO) voltage regulator IP core optimized for battery-powered devices where low power is critical.

• Samsung Accelerates New Product Ramp for 7nm Technology Node Using Synopsys' Yield Explorer
• Ambiq Micro Achieves World-Leading Power Consumption Performance with TSMC 40ULP Technology
• Global Semiconductor Sales Decrease 14.6 Percent Year-to-Year in May

Headlines for Monday Jul. 01, 2019

Top Story

PLDA Reaches Key Milestone in Gen-Z IP Development

In support of immediate Gen-Z development, PLDA has released a detailed datasheet enabling designers to begin architecting and designing Gen-Z enabled SoCs. This PLDA Gen-Z IP datasheet includes the key information required for initial design including supporting features, interface description and micro architecture, gate count, performance metrics, and more.

• SiFive Expands DesignShare IP Ecosystem to 20 Partner Companies
• Semiconductor Industry Capex Forecast to Slump in 2019 and 2020
• GOWIN Semiconductor Introduces Their latest FPGA Product Line with Built-In Security
• Inside Secure Announces Group Company Name, New Identity and New Trading Symbol
• Avery Design Systems Announces SimRegress and SimCompare
• Andes Technology and Silex Insight Announce Strategic Partnership for RISC-V Based Root-of-Trust IP Solutions