D&R Headline News (August 2019)

Headlines for Friday Aug. 30, 2019

Top Story

Intel Ships First 10nm Agilex FPGAs

Intel today announced that it has begun shipments of the first Intel® Agilex® field programmable gate arrays (FPGAs) to early access program customers. Participants in the early access program include Colorado Engineering Inc., Mantaro Networks, Microsoft and Silicom.

Headlines for Thursday Aug. 29, 2019

• SMIC Announces Unaudited 2019 Interim Results
• Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement
• Global Top Ten IC Design Companies for 2Q19 Ranked by Revenue Released, with Top Five Registering Revenue Fall, Says TrendForce
• Sean Fan Joins Rambus as Chief Operating Officer

Headlines for Wednesday Aug. 28, 2019

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Global Foundries/TSMC Wrangle Seen Dragging Industry Down

The legal tiff that GlobalFoundries (GF) initiated with TSMC yesterday is yet another factor likely to impede growth and profitability in the semiconductor industry during the foreseeable future, according to analysts.

• Mellanox Technologies Selects Verimatrix Silicon IP to Secure Family of Chipsets

Headlines for Tuesday Aug. 27, 2019

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Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP

Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced the completion of the previously-disclosed acquisition of Northwest Logic, a leading supplier of memory, PCIe and MIPI digital controllers.

• sureCore Unveils Low Power Design Service
• GigaDevice unveils the GD32V series with RISC-V core, in a brand new 32bit general purpose microcontroller
• Creonic Participates in National Research Project KI-Radar
• TSMC Will Vigorously Defend its Proprietary Technology in Response to GlobalFoundries Complaints

Headlines for Monday Aug. 26, 2019

• GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
• Arasan and Xilinx announce their design win in providing a Total UFS 3.0 Solution to Wuhan Jingce
• Does Your AI Chip Have Its Own DNN?
• North American Semiconductor Equipment Industry Posts July 2019 Billings

Headlines for Friday Aug. 23, 2019

• Sankalp Semiconductor to present technical paper at CDNLive Bangalore

Headlines for Thursday Aug. 22, 2019

Top Story

HDL Design House Introduces Expandable SoC IoT Platform

HDL Design House today announced the launch of its easily expandable, reusable and flexible SoC IoT Platform using the Arm® Corstone™ foundation IP package.

• Is It Time to Forget about Huawei?
• Creonic Demonstrates its Beyond 5G FEC IP at the EuCNC Conference
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2019
• Next Generation Video Codec Standard Proposed: MPEG Video Coding for Machines (VCM)
• Porsche Invests in Israeli Startup TriEye to Increase Road Visibility and Safety

Headlines for Wednesday Aug. 21, 2019

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Xilinx Announces the World's Largest FPGA Featuring 9 Million System Logic Cells

Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced the expansion of its 16 nanometer (nm) Virtex® UltraScale+™ family to now include the world's largest FPGA — the Virtex UltraScale+ VU19P.

• Qualcomm And LGE Enter Into a New Global Patent License Agreement
• Top-15 Semiconductor Suppliers' Sales Fall by 18% in 1H19

Headlines for Tuesday Aug. 20, 2019

• Will More-than-Moore Take Off in China?

Headlines for Monday Aug. 19, 2019

Top Story

Arm, WDC and Qualcomm Announce OpenChain Conformance Activities

Arm and Western Digital Corporation, Platinum Members of the OpenChain Project and key participants in the global supply chain, today announce conformance with the OpenChain Specification.

• UPMEM Puts CPUs Inside Memory to Allow Applications to Run 20 Times Faster
• Arasan Chip Systems expands its storage IP Portfolio with ONFI 4.1 PHY and I/O PAD IP seamlessly integrated with its NAND Flash Controller IP for UMC 28nm SoC Designs
• Alphacore To Develop Rad-Hard CMOS Standard Cell Library, Meeting DOD Standards, For U.S. Navy
• Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement

Headlines for Thursday Aug. 15, 2019

• Gyrfalcon's Cutting-edge Technology for Creating AI Accelerator Chips Commended by Frost & Sullivan
• eSilicon to debut AI Accelerator software and a new chiplet model at Hot Chips 2019

Headlines for Wednesday Aug. 14, 2019

Top Story

Tortuga Logic Verifies Rambus CryptoManager Root of Trust with Industry-Leading Security Verification Framework, Radix

Tortuga Logic, a cybersecurity company specializing in system-level security, today announced that it has independently verified the security of the Rambus CryptoManager Root of Trust with its Radix™ security verification framework. I

• Microcontrollers Will Regain Growth After 2019 Slump
• Perceptia Joins GLOBALFOUNDRIES Events in Santa Clara, Munich
• Meera Rao Joins Rambus Board of Directors
• SmartDV to Exhibit at OpenPower Summit August 19-20

Headlines for Monday Aug. 12, 2019

Top Story

Everspin and Seagate Sign IP Patent Assignment and Licensing Agreements

Both companies hold an extensive portfolio of IP that is further strengthened by this agreement including the assignment and licensing of MRAM patents from Seagate to Everspin as well as licensing of specific Tunneling Magnetoresistance (TMR) patents from Everspin to Seagate.

• EDA, AVs Find Common Language
• TSMC July 2019 Revenue Report
• Adesto's FT 6050 Smart Transceiver Now Natively Supports both LonWorks and BACnet Protocols
• StarHub and Temasek to Bolster Ensign's Cyber Security Capabilities with D'Crypt
• Sundance launches VCS-1 embedded processor module for precision robotics applications

Headlines for Thursday Aug. 08, 2019

Top Story

Faraday Leads Industry with 28G Programmable SerDes at 28nm for Networking ASIC

Faraday today announced the availability of its 28Gbps programmable SerDes PHY IP on UMC 28HPC process technology.

• CEVA, Inc. Announces Second Quarter 2019 Financial Results
• SMIC Reports 2019 Second Quarter Results
• UMC Reports Sales for July 2019
• Arm Revenues Up, Royalties Down
• UltraSoC strengthens global team with appointments in Asia and USA
• 76% of IC Products Expected to See Flat/Negative Growth in 2019

Headlines for Wednesday Aug. 07, 2019

Top Story

VeriSilicon Launches VIP9000, New Generation of Neural Processor Unit IP

VeriSilicon, a Silicon-Platform-as-a-Service (SiPaaS®) company, today announces VIP9000, a highly scalable and programmable processor for computer vision and artificial intelligence.

• GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications
• Synopsys to Acquire QTronic GmbH

Headlines for Tuesday Aug. 06, 2019

Top Story

Enhancing System Architecture Implementation for AI Applications, Microchip Delivers its Analog Embedded SuperFlash Technology

Microchip Technology’s SuperFlash memBrain™ neuromorphic memory solution provides substantial reduction in compute power to improve AI Inference at the edge

• Andes Records Rapid Growth of RISC-V Processors Licensing Agreements in the First Half of 2019
• CEVA and Immervision Enter into Strategic Partnership for Advanced Image Enhancement Technologies
• Cadence and UMC Collaborate on Certification of Analog/Mixed-Signal Flow for 28HPC+ Process
• Mid-Year Global Semiconductor Sales Down 14.5 Compared to 2018
• Eta Compute Appoints Dr. Ted Tewksbury Chief Executive Officer
• Xilinx Expands Alveo Portfolio with Industry's First Adaptable Compute, Network and Storage Accelerator Card Built for Any Server, Any Cloud

Headlines for Monday Aug. 05, 2019

Top Story

Arasan to demonstrate its SD Card UHS-II PHY IP and eMMC 5.1 PHY IP for 12nm SoC Designs at the 2019 Flash Memory Summit

Arasan today announced that they will demonstrate their latest products on TSMC’s industry-leading 12nm process, the SD Card UHS-II PHY and eMMC 5.1 PHY on a test chip.

• Everspin Expands Spin-transfer Torque MRAM Ecosystem Support for its 1 Gigabit STTMRAM with Cadence Design IP and Verification IP
• Intel Expands Workload Acceleration with Hewlett Packard Enterprise in New Programmable Acceleration Card
• Intel 10nm Chip Gets Mixed Reviews
• GUC Monthly Sales Report - July 2019
• Avery Design Systems Announces SimAccel FPGA Accelerator
• InAccel's Accelerated ML suite boosts Spark ML as much as 7x using Intel's Arria FPGAs

Headlines for Thursday Aug. 01, 2019

Top Story

PLDA Announces Major PCIe 5.0 Design Win on Cutting Edge 5nm Process Node

PLDA today announced a major PCIe 5.0 design win on cutting edge 5nm process node. PLDA’s PCIe 5.0 Controller IP was selected not only for its solid design and unmatched compatibility with popular PCIe PHYs, but also for PLDA’s best-in-class tech support, its ease of customization and PLDA’s integration expertise.

• Arm brings automation to IoT connectivity management
• China, Huawei Hit Q'Comm Where it Hurts
• Silvaco Appoints Babak Taheri as new Chief Executive Office
• Kalray announces the Tape-Out of Coolidge on TSMC 16NM process technology
• Startup Puts AI Core in SSDs
• Mobiveil to Demonstrate its Latest SSD IP Solutions at Flash Memory Summit 2019