D&R Headline News (September 2019)

Headlines for Monday Sep. 30, 2019

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Huawei & Arm Meet Behind Closed Doors

Executives from Arm, Arm China and HiSilicon (Huawei’s chip division) met behind closed doors on Wednesday morning (Sept. 25th) at the Intercontinental Hotel in Shenzhen, and when they emerged they stood for a group photo that said more about the US-China trade war than anything the three companies had actually said in four months.

• New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for World-class MIPI-based Embedded Vision Systems
• Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022, SEMI Reports
• Synopsys Introduces PrimeECO Solution for Zero-Iteration Signoff-Driven Design Closure
• XMOS secures $19M funding to accelerate growth
• UltraSoC selected by Japan's NSITEXE for automotive development
• Titan IC to Accelerate Pattern and String Matching on Mellanox's New BlueField-2 I/O Processing Unit (IPU) Device
• SiFive Enables Embedded Vision With New DesignShare Partners
• Live webinar from Dolphin Design: Pushing the limit of SoC energy efficiency with a NEW secret technique

Headlines for Friday Sep. 27, 2019

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Sofics releases pre-silicon analog I/O's for high-speed SerDes for TSMC N5 process technology

Sofics bvba, a leading semiconductor integrated circuit IP provider announced that it has expanded its TakeCharge® Electrostatic Discharge (ESD) and Analog I/O portfolio with solutions for TSMC’s N5 process technology. The cells enable high speed and high frequency interfaces.

• Data Compression Accelerators from CAST Now Available on Xilinx Alveo Boards
• GLOBALFOUNDRIES Achieves More Than $1 Billion in Design Wins for 45RFSOI Solution for Mobile and Wireless Infrastructure Applications
• Multiple Mentor product lines now certified on TSMC's most advanced processes
• GLOBALFOUNDRIES Appoints Michael Hogan as SVP and General Manager to Support New Market Engagement Strategy

Headlines for Thursday Sep. 26, 2019

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Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process

Synopsys today announced a collaboration with TSMC to develop a broad portfolio of DesignWare® interface IP, logic libraries, embedded memories, and one-time programmable (OTP) non-volatile memory (NVM) IP on TSMC's 5-nanometer (nm) FinFET Plus (N5P) Process.

• New Version of Most Widely Used Camera and Imaging Interface - MIPI CSI-2 - Designed to Build Capabilities for Greater Machine Awareness
• SiFive Announces Key Enablement Of Trace And Debug
• Arm and TSMC Demonstrate Industry's First 7nm Arm-based CoWoS Chiplets for High-Performance Computing
• Truechip Announces First Customer Shipment of CXL Verification IP
• TSMC's Leading-Edge Fab Investments Set Stage for Sale Surge in 2H19
• Andes and Dover Microsystems Partner to Deliver Professional Network Security Solution for RISC-V
• Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process
• Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices
• Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
• Lattice Semiconductor and Synopsys Renew Partnership on FPGA Synthesis Tools
• Analog Bits Showcases Silicon of Analog and Mixed Signal IP Products on TSMC N7 Process Targeting Automotive Grade with Split Corner Lots and PVT Characterization Results Available

Headlines for Wednesday Sep. 25, 2019

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CEO Leaves Wave, Putting MIPS' Future in Doubt

Wave Computing, an AI startup based in Campbell, Calif., quietly swapped out its company chief in early September without a public announcement. Wave’s website now shows that Art Swift, who became Wave’s CEO last May, is already gone. It lists Sanjai Kohli as the new CEO.

• Cadence Digital and Signoff Full Flow and Custom/Analog Tools Certified for TSMC N6 and N5/N5P Process Technologies
• Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs
• Achronix Joins TSMC IP Alliance Program
• Kandou Secures $56 Million in Series C Funding
• UMC Receives Final Approval for 100% Acquisition of Mie Fujitsu Semiconductor
• Evaluation Boards Now Available for Flex Logix EFLX4K eFPGA on GLOBALFOUNDRIES' Most Advanced FinFET Platform
• Breker Verification Systems Unveils Intelligent Regression Optimization Solution to Accelerate Simulation, Emulation Execution
• M31 Technology Develops Optimized IP Solutions on Multiple TSMC Specialty Processes
• European Space Agency Selects AdaCore's Qualified Multitasking Solution for Spacecraft Software Development
• Moortec to Showcase its Advances in Embedded PVT Monitoring IP for 40nm-5nm at 2019 TSMC Open Innovation Platform Ecosystem Forum in Santa Clara
• Veriest announces opening of Budapest office

Headlines for Tuesday Sep. 24, 2019

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GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications

Innovative solution based on GF’s most advanced FinFET platform offers best-in-class performance, key new features to address evolving AI requirements, compelling economics and industry-leading physical IP from Arm

• Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions
• CSEM joins GLOBALFOUNDRIES' FDXcelerator Program bringing ultra-lowPower IP to 22FDX process
• eMemory Wins 2019 TSMC IP Partner of the Year Award
• Andes Technology Features 32-bit A25MP and 64-bit AX25MP RISC-V Multicore Processors With Andes Custom Extension at TSMC 2019 Open Innovation Platform Ecosystem Forum

Headlines for Monday Sep. 23, 2019

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Moortec Drives Optimised Performance & Increased Device Reliability on TSMC's N5 and N5P Process Technologies with its Complete In-Chip Monitoring Subsystem

Moortec, a leading provider of in-chip monitoring and optimisation IP, today announced the availability of its latest In-Chip Monitoring IP Subsystem on TSMC’s N5 and N5P process technologies.

• Silicon Creations to Showcase PLL Developments on 22nm to 5nm Processes at TSMC 2019 Open Innovation Platform Ecosystem Forum
• Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process
• Spectral Design and Test Inc., Announces a New Family of MemoryIP Targeted at the 5G Market
• Dolphin Integration becomes Dolphin Design
• eSilicon Announces Availability of 7nm High-Bandwidth Interconnect (HBI+) PHY for Die-to-Die Interconnects
• Cambridge Consultants Becomes Arm Approved Design Partner
• Avery Design Introduces CXL VIP
• Avery Design Partners with Marquee Semiconductor to Provide Sales, Support in India, and Deepens its Relationship to Prime Marquee's SoC Solution Platform
• North American Semiconductor Equipment Industry Posts August 2019 Billings
• IAR Systems launches functional safety tools for STMicroelectronics' 8-bit MCUs

Headlines for Friday Sep. 20, 2019

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CAST CAN 2.0/FD Bus IP is Safety-Ready with ISO 26262 Certification

CAST, Inc. today announced that its CAN 2.0 and CAN FD Bus Controller IP Core is certified as ISO 26262 ASIL-B ready. The company believes this is the first such CAN IP core to receive ISO 26262 certification.

• Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners
• Xilinx Announces Chief Financial Officer Transition
• Attopsemi Technology Presented "I-fuse: Dream OTP Finally Comes True" and won the best Innovative IP award on IP SoC 2019 China

Headlines for Thursday Sep. 19, 2019

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Semiconductor Acquisitions Regain Momentum in 2019

This year’s merger and acquisition announcements are driven by deals in networking and wireless connectivity ICs and by suppliers adding products for automotive systems and other strong-growth markets into the next decade.

• Intensivate Engages SiFive's RISC-V Expertise to Develop Leading Accelerator
• ECOC 2019: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Seven-Meter and Three-Meter Samtec Cable Assemblies
• SEGGER Makes Its Entire Ecosystem of Tools Available for AndesCores

Headlines for Wednesday Sep. 18, 2019

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Faraday's SoC Projects Doubled for Three Consecutive Years

Faraday Technology today announced the number of its SoC design service projects has doubled for three consecutive years. These projects are mainly on 28nm and 40nm nodes featuring lower business entry barrier and competitive production cost compared with the advance processes.

• Veriest kick-starts Formal Verification methodology at Valens
• Compute Express Link Consortium (CXL) Officially Incorporates; Announces Expanded Board of Directors

Headlines for Tuesday Sep. 17, 2019

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Mixel's MIPI D-PHY IP Integrated into Microsoft's Azure Kinect DK Depth Camera

Mixel®, a leading provider of mixed-signal intellectual property (IP) announced today that Mixel's MIPI® IP has been successfully integrated into the Microsoft Azure Kinect developer kit, which is now in volume production.

• ESD Alliance Reports EDA Industry Revenue Increase for Q2 2019
• SmartDV Announces Availability of Ethernet TSN Design IP
• CEVA Introduces New AI Inference Processor Architecture for Edge Devices with Co-processing Support for Custom Neural Network Engines
• Infineon and Synopsys Collaborate to Accelerate Artificial Intelligence in Automotive Applications
• Alphawave IP Announces Industry Veteran and Marvell Founder Dr. Sehat Sutardja Has Joined Its Board of Directors

Headlines for Monday Sep. 16, 2019

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Synopsys' New Embedded Vision Processor IP Delivers Industry-Leading 35 TOPS Performance for Artificial Intelligence SoCs

DesignWare ARC EV7x Vision Processors with Deep Neural Network Accelerator Provide More Than 4X Performance Increase for AI-intensive Edge Applications

• Arm Flexible Access for Research to accelerate innovation for academia and research
• Synopsys Simplifies Automotive SoC Development with New ARC Functional Safety Processor IP
• UltraSoC opens engineering center in Poland and accelerates its global expansion
• Silvaco Partners with HDL Design House for Analog and Digital IC Design Services
• Moortec Announces Lee Vick as their New VP of North America Sales
• India Branching Out into Chip Design
• Fabs Valued at Nearly $50 Billion to Start Construction in 2020
• GOWIN Semiconductor Announces their GoAI Solution for AI Acceleration at the Edge
• Sri Lanka Telecom Selects Proven Partner Ecosystem to Deploy Large Scale TV Everywhere Experience in Island Nation
• Wi-Fi CERTIFIED 6 delivers new Wi-Fi era
• Socionext Adds 8K Encoding Feature to M820L Media Accelerator Card
• Advantech accelerates the move to IP with Adeas/Nextera ST2110/NMOS Core
• SiTune Passes Milestone of Shipping Two Million 8K TV Silicon Tuners (STN6528)

Headlines for Friday Sep. 13, 2019

• AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper Cable

Headlines for Thursday Sep. 12, 2019

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Silex Insight releases ARIA crypto engine for the Korean market

Silex Insight, the leading provider of embedded Security IP, extends its broad range of Cryptographic IP cores with the release of the ARIA crypto engine, the block cipher standard in Korea.

• Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter
• AI Chip Market to More than Double in 5 Years
• MIT engineers build advanced microprocessor out of carbon nanotubes
• Verimatrix signs a binding agreement to sell its Silicon IP business unit to Rambus
• Rambus Signs Agreement to Acquire Silicon IP and Secure Protocols Business from Verimatrix
• AGIC C-Fuse OTP High-Temperature-Immunity Tailored for AEC-Q100 Grade 0 Applications

Headlines for Wednesday Sep. 11, 2019

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Synopsys Delivers Industry's First Compute Express Link (CXL) IP Solution for Breakthrough Performance in Data-Intensive SoCs

Synopsys, Inc. (Nasdaq: SNPS) today announced availability of its complete DesignWare® Compute Express Link (CXL) IP solution consisting of controller, PHY, and verification IP for AI, memory expansion, and high-end cloud computing system-on-chips (SoCs).

• MIPI Alliance Opens Access to its Debug and Trace Specifications
• Western Digital Accelerates Leadership in Next-Generation Data Center Architectures With Acquisition of Kazan Networks
• JEDEC Announces Publication of Serial Presence Detect Support and Module Labels Specifications to Support New Hybrid Memory (NVDIMM)
• SmartDV to Demonstrate TileLink Verification IP for RISC-V Based Systems, Smart ViPDebug Protocol Debugger at DVCon India

Headlines for Tuesday Sep. 10, 2019

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HCL Technologies to acquire Sankalp Semiconductor to enhance leadership in the semiconductors and industrial IoT spaces

HCL Technologies Limited (HCL), a leading global technology company, today announced the acquisition of Sankalp Semiconductor (Sankalp), an advanced technology design services provider offering comprehensive digital & mixed signal SoC services and solutions from concept to prototype, in the semiconductor space.

• TSMC August 2019 Revenue Report
• Agile Analog welcomes Sir Hossein Yassaie, former Imagination Technologies Founder and CEO, to its Board
• WiSig Networks License CEVA's Cellular IoT Technology to Serve the India Market
• Memory Forecast to Account for 43% of Total 2019 Semi Spending
• Swift Media Reinvests in Verimatrix with VCAS Ultra Upgrade and Expansion
• Swift Navigation Partners with Arm to Bring Precise Positioning Technology to Autonomous Vehicle Compute Platforms

Headlines for Monday Sep. 09, 2019

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PLDA Achieves PCI Express 4.0 Compliance for its XpressRICH PCIe Controller IP During the First Official PCI-SIG PCIe 4.0 Compliance Workshop

PLDA, the industry leader in PCI Express® IP and data interconnect solutions, today announced that their XpressRICH™ PCIe® Controller IP passed all Gold and Interoperability tests at the PCI-SIG® Compliance Workshop, held in August 2019 in Burlingame, CA.

• Kandou Announces Development of USB4 Retimer
• UMC Reports Sales for August 2019
• eMemory IP Garners Most Stringent Level of Certification for Automotive Applications
• Apple Will Be Hard-Pressed to Build a Rock Star 5G Modem
• Huawei, Qualcomm, Samsung Reveal Integrated 5G Chips
• Rambus Reports Inducement Grants under NASDAQ Listing Rule 5635(c)(4)

Headlines for Friday Sep. 06, 2019

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PUFsecurity Leverages NeoPUF to Lead Hardware Security Technology

Charles Hsu, the chairman of eMemory, the world’s seventh largest supplier of semiconductor-based intellectual property (IP), believes that his company has found the solution to an expensive and urgent cybersecurity problem. His company is spinning off PUFsecurity to popularize PUF technology in the marketplace.

• Imagination launches game-changing IMG Edge services platform for design verification and validation

Headlines for Thursday Sep. 05, 2019

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Silex Insight and Wave Computing Collaborate to Deliver Security-Conscious Artificial Intelligence (AI) Platforms Across Enterprise and Automotive Markets

• Edgewater Expands into Licensing of Breakthrough IP
• Veriest collaborates with MINRES on RISC-V development
• CacheQ Debuts Heterogeneous Compute Development Environment
• GUC Monthly Sales Report - Aug 2019
• Vidatronic and IP-Semantics Join Forces in California's Silicon Valley
• Palma Ceia SemiDesign Receives "Excellent Solution Award" at Internet of Things and Smart City Exhibition in Shenzhen

Headlines for Wednesday Sep. 04, 2019

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Rambus to Acquire Silicon IP and Secure Protocols Business From Verimatrix, Creating Global Authority in Semiconductor Security IP

Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has entered into an exclusivity agreement to acquire the Silicon IP, Secure Protocols and Provisioning business from Verimatrix, formerly Inside Secure

• VESA Updates DisplayHDR Standard with Tighter Specifications and New DisplayHDR 1400 Performance Level
• Credo Announces Production Availability of HiWire Active Electrical Cables
• Nations Technologies Selects QuickLogic's ArcticPro eFPGA to Power its Next Generation Low Power IoT SoC
• Global Semiconductor Sales Decrease 15.5 Percent Year-to-Year in July
• NASA awards five 2019 SBIR/STTR Phase I research programs to Alphacore
• Verimatrix Enters into Exclusivity Agreement to Sell its Silicon IP Business Unit to Rambus
• InnoGrit adopts M31's optimization solutions of PCIe 4.0/3.0 and ONFi 4.1 I/O IP cores for Artificial Intelligence Storage chips

Headlines for Tuesday Sep. 03, 2019

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USB-IF Announces Publication of USB4 Specification

USB Implementers Forum (USB-IF), the support organization for the advancement and adoption of USB technology, today announced the publication of the USB4™ specification, a major update to deliver the next-generation USB architecture that complements and builds upon the existing USB 3.2 and USB 2.0 architectures.

• 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports
• Credo Announces the HiWire Consortium for Standardization and Certification of Active Electrical Cables (AEC)
• Synopsys Enables First-Pass Silicon Success of High Performance NSITEXE Data Flow Processor-based SoC Test Chip for Autonomous Driving
• Brite Semiconductor and Synopsys Extend IP OEM Partnership
• Details of Hailo AI Edge Accelerator Emerge

Headlines for Monday Sep. 02, 2019

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Moortec's 28nm Embedded Thermal Sensing Solution selected by InnoGrit to Optimise Performance and Reliability in their latest SSD Controller Chip

Moortec announced today that InnoGrit has chosen Moortec’s 28nm thermal sensing solution to optimise performance and increase reliability for InnoGrit’s recently announced Shasta and Shasta+ SSD controllers

• Verimatrix Integrates Multi-DRM with Amazon Web Services Elemental Secure Packager Encoder Key Exchange (SPEKE) API
• Keysight Technologies, Kandou Bus Collaborate to Advance Chord Signaling Technology for High-Speed Digital Applications
• GlobalFoundries' Goal: Harass TSMC Customers