D&R Headline News (January 2020)

Headlines for Thursday Jan. 30, 2020

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Creonic Joins German Center for Satellite Communications (DESK)

Creonic GmbH, a leading provider of IP cores in the satellite communications market, recently joined DeSK – Deutsches Zentrum für Satelliten-Kommunikation e.V. (German Center for Satellite Communications r.S.)

• Xilinx Reports Fiscal Third Quarter 2020 Results
• Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with targeted applications in DMA Streaming of Video and Data over PCIe or UDP/IP Network Interface.

Headlines for Wednesday Jan. 29, 2020

• Storage system based on WD 100Gb NVMe-oF Bridge ASIC with ePHY IP

Headlines for Tuesday Jan. 28, 2020

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Arteris IP Adds 17 New Licensees, Revenue Exceeds $31M in 2019

Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that the company added 17 new licensees in 2019 for its Arteris® IP Ncore®, FlexNoC®, CodaCache®, AI Package, Resilience Package, and PIANO® Interconnect IP products.

• QuickLogic Announces Restructuring Plan to Reduce Operating Expenses in Order to Achieve Profitability Goals for Fiscal Year 2020
• Cobham Gaisler successfully verifies its first RISC-V processor, NOEL-V, using Aldec's Riviera-PRO for HDL Simulation
• Rambus Reports Fourth Quarter and Fiscal Year 2019 Financial Results

Headlines for Monday Jan. 27, 2020

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Flex Logix EFLX 1K eFPGA Core Design Kits Available Now For TSMC 40nm ULP And 40nm LP Process Technologies

Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today a new EFLX eFPGA core optimized for the needs of customers on TSMC 40nm Ultra Low Power (ULP) and 40nm Low Power (LP) process technologies.

• Former Google and Tesla Engineer Chris Lattner to Lead SiFive Platform
• proteanTecs Announces Live Webinar on In-Field Failure Prediction Based on IC Deep Data Monitoring
• Kneron raises $40m for next-gen Edge AI chip
• WiLAN Awarded $85.23M in Apple Re-Trial

Headlines for Friday Jan. 24, 2020

• Lattice Diamond FPGA Development Tool Receives Key Industrial and Automotive Functional Safety Certifications
• North American Semiconductor Equipment Industry Posts December 2019 Billings

Headlines for Thursday Jan. 23, 2020

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Synopsys Announces New ARC HS4x/4xD Development Kit to Speed Software Development

Synopsys, Inc., today announced availability of the DesignWare® ARC® HS4x/4xD Development Kit to accelerate software development for the ARC HS4x/4xD family of high-performance processor IP.

• Groq Hardware Now Available on Nimbix Cloud
• 26 of 33 IC Products Forecast to Demonstrate Positive Growth in 2020
• Intel joins CHIPS Alliance to promote Advanced Interface Bus (AIB) as an open standard
• Ciaran Kennedy and Himesh Soneji join Enyx
• Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different

Headlines for Wednesday Jan. 22, 2020

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Silex Insight and Argo collaborate on ensuring the complete security for smart meters in South-Korea

Silex Insight and Argo announce their collaboration for delivering a solution for security-conscious smart meters designers incorporating security IP from Silex Insight into the ASIC chip from Argo.

• Synopsys and Finastra Partner to Secure Financial Services App Ecosystem

Headlines for Tuesday Jan. 21, 2020

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Xilinx Files Patent Infringement Lawsuit Against Analog Devices

Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that it has filed claims against Analog Devices, Inc., asserting infringement of eight United States patents in the United States District Court for the District of Delaware.

• Allegro DVT Unveils the Industry's First VVC Compliance Test Bitstreams
• Arteris IP FlexNoC Interconnect and AI Package Licensed by Vastai Technologies for Artificial Intelligence Chips
• sureCore Opens Low Power Memory Compiler Access

Headlines for Monday Jan. 20, 2020

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eMemory and UMC Qualify NeoFuse IP on the Foundry's 28nm High Voltage Process

eMemory, the leading provider of non-volatile memory intellectual property, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that eMemory’s NeoFuse IP has been qualified on UMC’s 28nm High Voltage (HV) platform to target the fast-growing OLED market.

• Arm Mali-G77 GPU named Best Processor IP in The Linley Group's Analysts' Choice Awards
• Global GDP Growth An Increasingly Important Driver of IC Market Growth
• Palma Ceia SemiDesign Signs Agreement with BLRLABS for Expansion to India
• TSMC Announces Winners of First IC Layout Contest

Headlines for Friday Jan. 17, 2020

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CAST Adds Switched TSN Endpoint Controller to Time-Sensitive Networking Ethernet IP Cores Family

CAST, Inc. today announced the availability of a new IP core implementing a switched endpoint controller supporting the Time-Sensitive Networking (TSN) Ethernet standards.

• Apple Reportedly Acquires Xnor
• Erwan Menard, Director of Infrastructure and Applications Modernization Solutions at Google Cloud, Joins Kalray Board of Directors
• JEDEC Publishes Update to LPDDR5 Standard for Low Power Memory Devices
• Synopsys Joins New Autonomous Vehicle Computing Consortium

Headlines for Thursday Jan. 16, 2020

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AI Chips: What Will 2020 Bring?

2020 is set to be the most important year yet when it comes to the evolution of the nascent AI accelerator chip industry. Here are a few ideas about what we might see happening this year, in no particular order…

• Mercury Systems Selects Tortuga Logic's Radix for DARPA Program
• Is ReRAM Ready to Leave the R&D Phase?
• Imagination Technologies expands with new design centre in Romania
• TSMC Reports Fourth Quarter EPS of NT$4.47
• Cadence Completes Acquisition of AWR Corporation from National Instruments

Headlines for Wednesday Jan. 15, 2020

• MIPI I3C v1.1 Utility and Control Bus Strengthens Upgrade Path for I2C Implementers

Headlines for Tuesday Jan. 14, 2020

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Gartner Says Worldwide Semiconductor Revenue Declined 11.9% in 2019

Intel regained the No. 1 position in the market as the downturn in the memory market negatively impacted many of the top vendors, including Samsung Electronics, the No. 1 vendor by revenue in 2018 and 2017.

• Cadence Expands Collaboration with Broadcom for 5nm and 7nm Designs
• M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum
• Inphi Completes Acquisition of eSilicon

Headlines for Monday Jan. 13, 2020

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PLDA Announces Successful PCIe 4.0 Technology Compliance for its XpressRICH-AXI Controller IP

PLDA, the industry leader in PCI Express® (PCIe®) IP and data interconnect solutions, today announced that their XpressRICH-AXI™ PCIe Controller IP passed all Gold and Interoperability tests at the PCI-SIG® Compliance Workshop, held in December 2019 in Burlingame, CA.

• Synopsys Completes Acquisition of Certain IP Assets from eSilicon
• TSMC December 2019 Revenue Report
• The BSC coordinates the manufacture of the first open source chip developed in Spain

Headlines for Friday Jan. 10, 2020

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CSEM Bluetooth 5.1 IP icyTRX is ready for LE Audio on multiple processes

January 2020 marks the beginning of a new era for wireless audio, with the arrival of audio streaming over Bluetooth Low Energy (LE Audio), as announced this week by the Bluetooth SIG (Special Interest Group). CSEM anticipated this new feature in the latest iterations of its silicon-proven icyTRX Bluetooth LE IP, which is already fully compatible

• Synopsys Acquires Tinfoil Security to Expand DAST and Add API Security Testing

Headlines for Thursday Jan. 09, 2020

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Synopsys Expands Portfolio of Automotive VDKs with Support for NXP S32G Vehicle Network Processor

With the S32G Vehicle Network Processor, NXP unlocks the full potential of vehicle data. It enables modern service-oriented gateways for rapid Over-the-Air (OTA) deployment of new capabilities and advanced edge-to-cloud analytics. It accelerates the shift to simplified domain and zonal-based vehicle architectures.

• Xiaomi and MPEG LA Announce Xiaomi's Signing of MPEG LA's HEVC License
• Andes Technology Takes the Lead in Launching RISC-V Total Solutions and Driving Industry-Academia Collaboration with over 120 Projects
• UMC Reports Sales for December 2019
• China Only Region to Register Pure-Play Foundry Market Growth in 2019
• UK Judge Finds Conversant Wireless' European Standard-Essential Patents Infringed by Huawei and ZTE

Headlines for Wednesday Jan. 08, 2020

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Synopsys to Acquire Certain IP Assets of INVECAS

Synopsys, Inc. (Nasdaq: SNPS) today announced that it has signed a definitive agreement to acquire certain IP assets of INVECAS, headquartered in Santa Clara, California. This acquisition will broaden Synopsys' DesignWare® Logic Library, General Purpose I/O, Embedded Memory, Interface and Analog IP portfolio.

• Qualcomm Accelerates Autonomous Driving with New Platform - Qualcomm Snapdragon Ride

Headlines for Tuesday Jan. 07, 2020

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Synopsys Releases Industry's First Bluetooth LE Audio Codec for Power-Sensitive Audio and Voice Applications

New Low-Power Codec Optimized for Synopsys' ARC Processor IP Enables High-Quality Audio and Voice Streaming from Smart Home, Mobile, and Wearable Devices

• Omni Design Joins TSMC IP Alliance Program
• ESD Alliance Reports EDA Industry Revenue Increase for Q3 2019
• SHA IP Core with native SHA2-256 HMAC support
• CEVA Speeds the Development of True Wireless Stereo Earbuds with its Support of Bluetooth LE Audio
• SiFive and CEVA Partner to Bring Machine Learning Processors to Mainstream Markets
• LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
• Bluespec, Inc. to Open Source Its Proven BSV High-level HDL Tools
• Siemens partners with Arm to accelerate the future of mobility by redefining design capabilities for complex electronic systems

Headlines for Monday Jan. 06, 2020

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CEVA Debuts SenslinQ Platform to Streamline Development of Contextually Aware IoT Devices

CEVA today unveiled SenslinQ™, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connectivity technologies to enable contextually aware IoT devices.

• GUC Monthly Sales Report - Dec 2019
• Novatek Adopts CEVA Audio/Voice DSP and Software for Smart TV SoCs
• Gowin Semiconductor Takes Leadership Position in Always-on Low Power FPGAs with GW1NZ-ZV Device Production
• zGlue Launches ChipBuilder Pro to Quickly and Easily Enable the Next Generation of Consumer Experiences on IoT and AI-Powered Devices

Headlines for Friday Jan. 03, 2020

• Wi-Fi Alliance brings Wi-Fi 6 into 6 GHz

Headlines for Thursday Jan. 02, 2020

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Imagination and Apple Sign New Agreement

Imagination Technologies (“Imagination”) announces that it has replaced the multi-year, multi-use license agreement with Apple, first announced on February 6, 2014, with a new multi-year license agreement under which Apple has access to a wider range of Imagination’s intellectual property in exchange for license fees.

• OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications
• HiSilicon No Longer Huawei's Captive Chipmaker