D&R Headline News (February 2020)

Headlines for Thursday Feb. 27, 2020

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Zhuhai Chuangfeixin eNOR embedded Flash Memory IP Solution and 128M bits SPI NOR Flash Qualified in 55nm Floating-Gate Flash Process

Zhuhai Chuangfeixin’s Floating-gate eNOR Flash memory macro and SPI NOR flash are silicon characterized and qualified on Huali Microelectronics Corporation 55nm Floating Gate technology.

• GLOBALFOUNDRIES Delivers Industry's First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
• Synopsys Announces Next-Generation VC SpyGlass RTL Static Signoff Platform
• Graphcore secures additional $150 million in new capital Reports Fiscal 2019 business highlights
• Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020
• PRO DESIGN Launches New proFPGA XCVU37P FPGA Module for Prototyping and Verification of High Bandwidth Memory Designs
• Synopsys Initiates $100 Million Accelerated Share Repurchase Agreement

Headlines for Wednesday Feb. 26, 2020

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Menta and Secure-IC partner to optimize embedded cybersecurity

Menta eFPGAs and Secure-IC cybersecurity IP simplify integration and enhance programmability of cryptographic security features in next-generation SoCs

• Cadence Announces Industry's First Verification IP for PHY Covering Multiple Protocols
• VeriSilicon and MicroEJ Join Forces to Accelerate Hardware IP Innovation, Thanks to Software Virtualization Leveraging 10 Million Software Engineers Worldwide
• Winbond Electronics and Secure-IC in Partnership for Embedded Cybersecurity
• UltraSoC wins Security Award for Bus Sentinel hardware cybersecurity IP

Headlines for Tuesday Feb. 25, 2020

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Synopsys Delivers Silicon-Proven HBM2E PHY IP Operating at 3.2 Gbps

Verified on TSMC's Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology, Synopsys' DesignWare® HBM2E PHY IP offers a micro-bump array that adheres to the JEDEC HBM2E SDRAM standard for the shortest possible 2.5D package routes and highest signal integrity.

• Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones
• SambNova Systems Announces $250 Million Series C as it Continues to Set a New Course for the Future of Enterprise Computing
• ESD Alliance Welcomes Avery Design Systems to Member Community
• OpenHW Group Celebrates Rapid Growth to 40+ Members and New Open-Source Processor Implementations Less Than a Year After Launch
• Titan IC and Decooda Announce Strategic Partnership to Accelerate Cloud-based Data Analytics for Intelligent Customer Experience Solution

Headlines for Monday Feb. 24, 2020

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Arasan Announces immediate availability of its SUREBOOT xSPI Host IP

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, today announced the immediate availability of its xSPI Host IP Core supporting the JEDEC JESD251 specification.

• NXP Announces Lead Partnership for Arm Ethos-U55 Neural Processing Unit for Machine Learning
• UltraSoC launches CAN Sentinel to boost automotive cybersecurity
• Mobiveil Announces Availability of Compute Express Link (CXL) IP (COMPEX) for High-Performance Applications
• Goodix License and Deploy CEVA Bluetooth Low Energy IP in SoCs Targeting Wearables, Mobile Devices, the Internet of Things
• Imperas Collaborates with Mentor on RISC-V Core RTL Coverage Driven Design Verification Analysis
• North American Semiconductor Equipment Industry Posts January 2020 Billings
• Hex Five Announces MultiZone Security for Arm Cortex-M Series Processors
• Xilinx Recommends Rejection of TRC Capital's "Mini-Tender" Offer
• GLOBALFOUNDRIES and GlobalWafers Sign MOU to Increase Capacity, Supply of 300mm SOI Wafers
• Intel Announces Unmatched Portfolio for 5G Network Infrastructure
• Imperas announce first reference model with UVM encapsulation for RISC-V verification
• Titan IC Unveils Enhancements to RXP Hardware Search Acceleration Engine at RSA Conference

Headlines for Thursday Feb. 20, 2020

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Dialog Semiconductor to Acquire Adesto Technologies, Broadening Presence in the Industrial Internet of Things Market (IIoT)

Dialog Semiconductor and Adesto Technologies today announced they have signed a definitive agreement for Dialog to acquire all outstanding shares of Adesto.

• Titan IC Secure Licensing Deal for 100Gbps Search Acceleration with FPGA SmartNIC Developer, Silicom
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2020
• Revenue per Wafer Rising As Demand Grows for sub-7nm IC Processes
• STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products
• Movellus Names Semiconductor Industry Veteran Ken Wagner to Lead Engineering Team
• Gowin Semiconductor Adds Ubuntu Support to their Gowin EDA FPGA Software for Improved Artificial Intelligence and IoT Development Toolchain Integration
• Weebit Nano and Silvaco Develop New Simulation Capabilities to Increase ReRAM Adoption
• Bluespec's RISC-V Factory Proves Its Dependable Productization, Helping Calligo Technologies Harness RISC-V for Posit-enabled Computing

Headlines for Wednesday Feb. 19, 2020

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Imagination announces new iEB110 Bluetooth Low Energy (BLE) v5.2 IP

Imagination Technologies announces its latest Bluetooth Low Energy (BLE) IP, supporting the latest Bluetooth SIG version 5.2 specification. iEB110 is a complete BLE solution, including RF, controller software and Bluetooth Low Energy host stack.

• Synopsys' Fusion Compiler Adopted by AMD
• Mixel MIPI C-PHY/D-PHY Combo IP Integrated into Compound Photonics CP1080p26 Microdisplay
• CEVA NB-IoT IP Completes Release 14 GCF Certification with Rohde & Schwarz
• Imagination's RF IP included in Autotalks' PLUTON2 Chipset

Headlines for Tuesday Feb. 18, 2020

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Vintage Investment Partners, Verizon Ventures, Maersk Growth, PepsiCo and NTT DOCOMO Ventures Join Top Tier Investors Backing Wiliot's Postage Stamp Sized Computer

This latest investment round brings Wiliot’s B Round of funding total up to $70m as Wiliot preps for mass production of its battery-free Bluetooth sensor tags, powered by recycling radio waves.

• Adesto and MikroElektronika Introduce mikroBUS- compatible FT Click to Speed Industrial IoT Development
• Accellera Forms Functional Safety Working Group to Standardize Data for Interoperability & Traceability in the Functional Safety Lifecycle
• CEA-Leti Presents High-Performance Processor Breakthrough With Active Interposer and 3D Stacked Chiplets at ISSCC 2020
• Covid-19 Is Crimping the Electronics Industry
• CEVA, Inc. Announces Fourth Quarter and Year End 2019 Financial Results
• SmartDV Offers New Design IP for DDR5 and LPDDR5
• SiPearl launches its development with 6.2m euros of European funds
• SMIC Reports 2019 Fourth Quarter Result
• OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor

Headlines for Monday Feb. 17, 2020

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Gen-Z Core Specification 1.1 now available for public download

The Gen-Z Consortium is pleased to announce the public release of the Gen-Z Core Specification 1.1, which is now available for public download on the Consortium’s website..

• Launch of SiPearl, designing the microprocessor for the European exascale supercomputer

Headlines for Friday Feb. 14, 2020

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Synopsys Completes Acquisition of Certain IP Assets from INVECAS

Synopsys today announced that it has completed its acquisition of certain IP assets from INVECAS. This acquisition broadens Synopsys' DesignWare® Logic Library, Embedded Memory, General Purpose I/O, Analog, and Interface IP portfolio.

• Cadence Furthers Expansion in 5G RF Communications with Acquisition of Integrand

Headlines for Thursday Feb. 13, 2020

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Socionext Introduces Time-Sensitive Network (TSN) IP to Realize Smart Factories

Socionext Inc. has developed a Time-Sensitive Network (TSN) IP for FPGA and ASIC implementation. The IP, which provides true deterministic Ethernet for industrial applications, is compliant with the next-generation Ethernet TSN (communication standard IEEE 802.1 Subset) and its evaluation environment.

• UltraSoC collaborates with PDF Solutions to prevent in-life product failures using end-to-end analytics and advanced machine learning techniques
• Synopsys Launches New ARC Communications IP Subsystem for Wireless Narrowband IoT Designs
• Five Semiconductor Companies Hold 53% of Global Wafer Capacity
• Faraday's AIoT Platform ASIC Solution Escalates System Accomplishment
• Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor
• Cadence Reports Fourth Quarter 2019 Financial Results
• XMOS announces world's lowest cost, most flexible AI processor

Headlines for Wednesday Feb. 12, 2020

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New Mathematically Lossless Video Compression IP Cores Announced by Hardent

Hardent today announced the forthcoming availability of its new mathematically lossless video compression IP cores. Hardent’s lossless video compression (HLVC) technology offers mathematically lossless compression specifically designed to facilitate the challenges associated with capturing, processing, storing, and playing back large amounts of raw data from automotive image sensors.

• BrainChip's Akida Development Environment Now Freely Available for Use
• Mythic adopts Mentor's Analog FastSPICE and Symphony platforms for AI processor design
• SmartDV Adds Support for MIPI I3C 1.1 Across Entire IP Portfolio
• UMC Reports Sales for January 2020
• TSMC Board of Directors Meeting Resolutions
• Synopsys Announces First Application Security Testing Solution to Analyze Both Open Source and Proprietary Code on the Developer's Desktop

Headlines for Tuesday Feb. 11, 2020

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Low-Latency Ethernet MAC IP Core from CAST now ASIL-D Certified

Semiconductor intellectual property (IP) provider CAST, Inc. today announced that the Low-Latency Ethernet Media Access Controller IP core it offers is now certified to conform to the ISO-26262 safety standard and is available ASIL-D ready.

Headlines for Monday Feb. 10, 2020

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New AI technology from Arm delivers unprecedented on-device intelligence for IoT

Today, Arm announced significant additions to its artificial intelligence (AI) platform, including new machine learning (ML) IP, the Arm® Cortex®-M55 processor and Arm Ethos™-U55 NPU, the industry’s first microNPU (Neural Processing Unit) for Cortex-M, designed to deliver a combined 480x leap in ML performance to microcontrollers.

• EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency
• Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms
• TSMC January 2020 Revenue Report
• Powering the future: Smallest all-digital circuit opens doors to 5 nm next-gen semiconductor
• SEGGER releases Floating-Point Library for RISC-V
• BrainChip Showcases Vision and Learning Capabilities of its Akida Neural Processing IP and Device at tinyML Summit 2020

Headlines for Friday Feb. 07, 2020

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Silex Insight launches True 4K Multiview using AV over IP

Silex Insight, a leading provider of video codec & AV over IP solutions, announces their AV over IP board (called VIPER) now offers True 4K Multiview supporting up to 12 simultaneous streams of 4K60 4:4:4 resolution, with ultra-low latency.

Headlines for Thursday Feb. 06, 2020

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Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology

Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today that it has acquired the DELTA Microelectronics business unit of FORCE Technology, the European leader in ASIC supply chain services.

• Acquisition Rebound Lifts 2019 to Third-Largest M&A Year

Headlines for Wednesday Feb. 05, 2020

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Gartner Says Worldwide Semiconductor Spending Declined in 2019 Due to Slowing Macroeconomy and Falling Memory Prices

Apple reclaimed the No. 1 position among global semiconductor chip buyers in 2019, representing 8.6% of the total worldwide market, according to Gartner, Inc. Samsung dropped to the second spot with 8% market share.

• UMC Announces 14nm certification on Mentor's Calibre Eco Fill Flow
• 2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion, SEMI Reports
• GUC Monthly Sales Report - Jan 2020
• GigaDevice Launches the New GD32E232 Series of MCU's Featuring the Arm Cortex-M23 core for Embedded Systems

Headlines for Tuesday Feb. 04, 2020

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Arteris IP FlexNoC Interconnect and Resilience Package Licensed by SiEngine for ISO 26262-Compliant Automotive Systems

Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that SiEngine has licensed the Arteris IP FlexNoC interconnect and the accompanying FlexNoC Resilience Package for use as the on-chip dataflow backbone of its next-generation automotive systems-on-chip (SoC).

• Synapse Design's Continued Fast Growth Drives Opening of Two Offshore Semiconductor Design Centers
• SmartDV Achieves Record Revenue in 2019
• China Maintains Chip Output in Wake of Virus Outbreak
• Worldwide Semiconductor Sales Decrease 12 Percent to $412 Billion in 2019

Headlines for Monday Feb. 03, 2020

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Chips&Media Pioneering With The World's First Real-time Multi-Standard Decoder, including AV1, HW IP, WAVE517

Chips&Media, today announced the pre-release of multi-standard HW IP named WAVE517, targeting 4K Ultra-High-Definition (UHD), which is the first in the industry to support almost every codec standards for the UHD in the market, including the next-generation AV1 standard.

• Supply Chain Poised for Coronavirus Disruption
• Qorvo Acquires UWB Chip Provider Decawave for $400m
• UltraSoC extends its commitment to Japanese market with appointment of Ryoden
• Semiconductor R&D To Nudge Higher Through 2024
• JEDEC Publishes Update to Universal Flash Storage (UFS) Standard