D&R Headline News (March 2020)

Headlines for Tuesday Mar. 31, 2020

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Synopsys Expands DesignWare MIPI IP Portfolio with Silicon-Proven, Integrated C-PHY/D-PHY IP Solution in FinFET Processes

Synopsys, Inc. today announced it is expanding its MIPI camera and display IP portfolio with the DesignWare® MIPI C-PHY℠/D-PHY℠ IP for a range of FinFET processes.

• Global Semiconductor Materials Market Revenues Slip 1.1 Percent in 2019, SEMI Reports
• Imagination announces new mobile graphics teaching course for 2020
• Andes Technology Announces over 5 Billion Cumulative Shipments of SoCs Embedded with Its CPU IP since Company Inception

Headlines for Monday Mar. 30, 2020

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Silvaco Delivers New Generation of MIPI I3C Sensor Connectivity IP

ilvaco, Inc. today announced it is building on its existing collaboration and development efforts with NXP® Semiconductors to bring a new generation of MIPI I3C semiconductor intellectual property (IP) to market.

• TrendForce Presents Latest Analysis (Updated March 2020) of COVID-19 Pandemic's Impact on Global High-Tech Industries
• Dolphin Design attacks the Taiwanese and Japanese markets with an exclusive sales representative
• 5G Rollout Will Slow as Standards Work is Suspended

Headlines for Friday Mar. 27, 2020

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Vervesemi Data converters for 5G applications Now Available on 8nm Process

Vervesemi Microelectronics, a leading fabless company for providing ASIC and Analog IPs, today announced availability of 5G ADC and DAC in 8nm process node. Vervesemi has developed 12b 4Gsps ADC and 14b 4Gsps DAC catering to upcoming market for 5G application.

• 100 IC Wafer Fabs Closed or Repurposed Since 2009

Headlines for Thursday Mar. 26, 2020

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Software-Based Encryption at Hardware Level for IoT Security delivered by IKV, based on Intrinsic ID's BroadKey

Intrinsic ID, the world’s leading PUF company for security in IoT, Banking and Government, and IKV, a leading company in embedded security in Taiwan, today announced IKV has launched its software-based security solution equalling hardware level for IoT security.

• Vidatronic and Everest Sales and Solutions Join Forces to Expand Sales Coverage Through Mexico and Central America
• Achronix Selects Synopsys' Leading DesignWare IP Solutions to Accelerate Development of High-Performance Data Acceleration FPGA
• Rambus Licenses DPA Countermeasures to Utimaco

Headlines for Wednesday Mar. 25, 2020

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Synopsys above ARM in IP licensing revenue in 2019

In terms of revenues for up-front technology licensing for semiconductor intellectual property (IP) Synopsys outperformed ARM in 2019, according to figures from market analysis firm IPnest.

• ESD Alliance Reports EDA Industry Revenue Increase for Q4 2019
• SiFive Selects Synopsys Fusion Design Platform and Verification Continuum Platform to Enable Rapid SoC Design
• Stop, Cut or Maintain European Chip Production Amid Covid-19

Headlines for Tuesday Mar. 24, 2020

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Arteris IP FlexNoC Interconnect Again Licensed by NETINT Technologies for Codensity Enterprise SSD Controllers

Arteris IP today announced that NETINT Technologies has once again licensed Arteris IP FlexNoC Interconnect for use in its next-generation of enterprise solid state disk (SSD) storage system controllers with on-chip video encoding processors.

• CEVA Announces DSP and Voice Neural Networks Integration with TensorFlow Lite for Microcontrollers
• InterMotion Technology boosts IP verification productivity for Lattice Semiconductor's CrossLink FPGA family using Aldec's Active-HDL
• Enea and Ampere Partner on Arm-based uCPE Solution for Telco Edge

Headlines for Monday Mar. 23, 2020

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Synopsys Delivers Industry's First Ethernet 800G Verification IP for Next-Generation Networking and Communications Systems

Synopsys today announced the availability of the industry's first verification IP (VIP) and Universal Verification Methodology (UVM) source code test suite for Ethernet 800G.

• BrainChip and Socionext Provide a New Low-Power Artificial Intelligence Platform for AI Edge Applications
• India Doesn't Need Its Own Fab
• Foundry Revenue Estimated to Grow by 30% YoY in 1Q20, while COVID-19 Pandemic May Hinder Future Market Demand, Says TrendForce
• Global Top 10 IC Designers' 2019 Revenues Drop by 4.1% YoY, as Industry Growth to Face Challenges from COVID-19 Pandemic in 2020, Says TrendForce
• Faraday's 28Gbps SerDes IP Now Available on UMC's 28HPC Process
• Intel Scales Neuromorphic Computer to 100 Million Neurons

Headlines for Thursday Mar. 19, 2020

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Inomize Selects Synopsys' Silicon-Proven 56G Ethernet PHY IP for High-Performance Computing and Communications SoC Design

Synopsys, Inc. (Nasdaq: SNPS) today announced that Inomize selected its silicon-proven DesignWare® 56G Ethernet PHY IP to accelerate development of Inomize's high-performance computing, software-defined radio (SDR), and power-efficient communications System-on-Chip (SoC).

• COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC
• Data Demands Drive Co-Packaged Silicon and Optics for Switch Fabrics

Headlines for Wednesday Mar. 18, 2020

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New Highly Optimised LDPC Decoder in Software for Intel's FlexRAN Reference Software Will Increase Throughput by up to 3X

AccelerComm today announced they have developed a highly optimised LDPC software decoder in collaboration with Intel. The solution is integrated into the Intel’s FlexRAN Reference Software resulting in increased throughput by up to 3 times over alternate implementations.

• Blu Wireless announces the availability of its 60GHz mmWave evaluation kit
• Codasip Awarded European Union Horizon 2020 Funding for Developing New RISC-V Processors
• TOSHIBA announced a Microcontroller employing Floadia's SONOS type Flash Memory IP "G1"

Headlines for Tuesday Mar. 17, 2020

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SMIC Graduating from 14nm to Something Sort of Akin to 7nm

Published reports that SMIC is preparing a 7-nanometer production process are incorrect. The error is understandable, however, as it is based on favorable comparisons SMIC has been making between its newest process technology (called N+1) and rivals’ 7nm processes.

• Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
• SiFive Launches Advanced Trace and Debug Portfolio, SiFive Insight
• Socionext Prototypes Low-Power AI Chip with Quantized Deep Neural Network Engine
• Bragi and CEVA Collaborate to Redefine Hearable Devices
• Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market
• Cadence Elects Ita Brennan and Lewis Chew to Board of Directors

Headlines for Monday Mar. 16, 2020

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DAeRT: eInfochips' DFT Framework that Increases Productivity and Reduces Silicon Development Cycle

eInfochips launches DAeRT (DFT Automated Execution and Reporting Tool) - an automated framework for the semiconductor industry, which provides a complete solution for DFT, starting from architecture to implementation for any ASIC (Application Specific Integrated Circuit).

• Synopsys Unveils RTL Architect To Accelerate Design Closure
• Covid-19 and The Success Story of Taiwan
• eMemory Launches Reprogrammable NVM Solution on TSMC Platform

Headlines for Friday Mar. 13, 2020

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Silicon Labs to Expand Leading IoT Wireless Platform with Acquisition of Redpine Signals' Connectivity Business

Silicon Labs (NASDAQ: SLAB) announced that it has entered into a definitive asset purchase agreement with Redpine Signals to acquire the company's Wi-Fi and Bluetooth business, development center in Hyderabad, India, and extensive patent portfolio for $308 million in cash.

Headlines for Thursday Mar. 12, 2020

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Cadence Tensilica HiFi IP Accelerates AI Deployment with Support for TensorFlow Lite for Microcontrollers

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that software for Cadence® Tensilica® HiFi digital signal processors (DSPs) has been optimized to efficiently execute TensorFlow Lite for Microcontrollers, part of the TensorFlow end-to-end open-source platform for machine learning (ML) from Google.

• Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
• QuickLogic's eFPGA Qualified on GLOBALFOUNDRIES 22FDX Platform for IoT and Edge AI Applications

Headlines for Wednesday Mar. 11, 2020

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OPENEDGES announces a strategic partnership with The Six Semiconductor Inc to provide a complete GDDR6 memory interface solution

OPENEDGES Technology, Inc., the leading provider of memory subsystem IP announced today the strategic partnership with The Six Semiconductor Inc (TSS) for a complete GDDR6 memory interface solution.

• Synopsys Advances State-of-the-Art in Electronic Design with Revolutionary Artificial Intelligence Technology
• "Black Swan" Event Triggers Revision to 2020 IC Market Forecast

Headlines for Tuesday Mar. 10, 2020

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Ambiq Micro's Next-Generation Subthreshold Power-Optimized Technology (SPOT) Platform Features CEVA's Bluetooth Low Energy IP

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Ambiq Micro, the leader in ultra-low power solutions has licensed CEVA’s RivieraWaves Bluetooth® low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms integrating Bluetooth connectivity.

• TSMC February 2020 Revenue Report
• Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration
• Synopsys Custom Design Platform Secures Full-flow Displacement of Legacy Design Tools at Alphawave

Headlines for Monday Mar. 09, 2020

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U.S. Considers Blocking Infineon's Purchase of Cypress

Reports that the Committee on Foreign Investment in the United States (CFIUS) may yet recommend the Infineon Technologies acquisition of Cypress Semiconductor be blocked on the grounds of national security risks have triggered falls in the shares of both companies. But is this just market rumor?

• RISC-V Foundation Announces Ratification of the Processor Trace Specification
• Cadence Collaborates with STMicroelectronics on Networking, Cloud and Data Center Electronics
• AI Chipmaker Hailo Raises $60 Million in Series B Funding
• Global Fab Equipment Spending Poised for 2021 Record High
• UMC Reports Sales for February 2020
• Transistor Count Trends Continue to Track with Moore's Law
• Dover Microsystems and Cadence Partner to Deliver Secure Processing with Silicon-Layer Security for Mission-Critical Applications

Headlines for Thursday Mar. 05, 2020

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Faraday Announces Low-DPPM Solution for a Wide Range of ASIC Applications

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its low-DPPM solution for diversified applications. Instead of utilizing costly automotive standard compliance methods, this solution supports non-automotive ASIC projects by adopting much more cost-effective and efficient ways to achieve low defect rates and meet high reliability requirements.

• MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV
• HBM Flourishes, But HMC Lives
• GUC Monthly Sales Report - Feb 2020
• Tessolve strengthens its VLSI Design services with the acquisition of T&VS
• UMC certifies Mentor product lines for its new 22nm ultra-low-power process technology
• Samsung Adopts Synopsys' Machine Learning-Driven IC Compiler II for its Next-Generation 5nm Mobile SoC Design

Headlines for Wednesday Mar. 04, 2020

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CEVA Unveils World's Most Powerful DSP Architecture

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced the unveiling of the world's most powerful DSP architecture, the Gen4 CEVA-XC.

• Veriest contributes to the verification of Nuvoton's Computing MCU devices
• Mellanox to Acquire World Leading Network Intelligence Technology Developer Titan IC to Strengthen Leadership in Security and Data Analytics
• Defacto Announces STAR 8.0 and Provides a Unified "All-in-One" SoC Design Solution to Help Conciliating Between RTL, IP-XACT, UPF, SDC, and Physical Design Information

Headlines for Tuesday Mar. 03, 2020

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Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers

The Alveo™ U25 SmartNIC is designed to bring the greater efficiency and lower TCO benefits of SmartNICs to cloud service providers, telcos, and private cloud data center operators struggling with increasing networking demands and rising costs.

• Ampere Altra - Industry's First 80-Core Server Processor Unveiled
• TSMC and Broadcom Enhance the CoWoS Platform with World's First 2X Reticle Size Interposer

Headlines for Monday Mar. 02, 2020

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VeriSilicon Hantro Video and ZSP IP are Adopted by ASPEED Cupola360 Image Processor SoC

VeriSilicon Hantro VC8000E H.265 & H.264 dual-format video encoder and ZSPNano DSP IP were selected by Cupola360 SoC with first silicon success to production

• Marvell Announces OCTEON TX2 Family of Multi-Core Infrastructure Processors
• Fraunhofer IIS brings comprehensive MPEG audio codec suite to NXP Semiconductors
• Blu Wireless appoints Alan Jones as new Chief Executive Officer