D&R Headline News (June 2020)

Headlines for Tuesday Jun. 30, 2020

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Optimized for AI Accelerator Applications, GLOBALFOUNDRIES 12LP+ FinFET Solution Ready for Production

GF’s differentiated 12LP+ solution is optimized for artificial intelligence (AI) training and inference applications. Built on a proven platform with a robust production ecosystem, 12LP+ offers chip designers an efficient development experience and a fast time-to-market.

Headlines for Monday Jun. 29, 2020

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Dialog Semiconductor Announces Completion of its Acquisition of Adesto Technologies

Dialog Semiconductor today announced that it has completed the acquisition of Adesto Technologies Corporation (Adesto).

• Dolphin unveils two break-through DSP and AI digital platforms dedicated to edge computing applications
• Palma Ceia SemiDesign Announces Sampling for PCS11ax28, New 802.11ax Transceiver
• Synopsys and Arm Extend Strategic Partnership to Deliver Superior Full-Flow Quality-of-Results and Time-to-Results

Headlines for Friday Jun. 26, 2020

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Intilop Delivers a Ready to Deploy, Four Thousand TCP/UDP Session 2U-Hardware Accelerator Box with Linux Kernel Bypass Drivers for Extreme-Performance Networking

The 9th generation TCP Accelerator delivers an unprecedented number of 4K TCP/UDP Sessions in ~100 nanoseconds with sustained ~10G bps throughput, providing up to 10x advantage over the legacy Software-TCP-Stacks, the only computing platform capable of instantly distributing and running applications across thousands of multiple clients/servers.

• Rockchip selects Ensigma iEW200 low-power Wi-Fi
• Synopsys Broadens Collaboration with EPFL

Headlines for Thursday Jun. 25, 2020

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Apple Moving Macs from Intel to Arm

After two years of rumors, at this year’s (virtual) World Wide Developer Conference (WWDC), Apple finally announced that it was going to migrate all its Mac products from Intel processors to the company’s own Arm-based silicon.

• Macnica adopts intoPIX TICO-XS for its 4K ProAV OEM solutions
• Synopsys Awarded DARPA Contract for Automatic Implementation of Secure Silicon Program
• Bamboo Systems Launches Next Generation Server
• Percepio Closes Series A Funding Round with Fairpoint Capital
• Taiwan Edges South Korea as Largest Base for IC Wafer Capacity
• Lattice Reinvents the Low Power, General-Purpose FPGA with New Certus-NX

Headlines for Wednesday Jun. 24, 2020

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T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm.

The IP is Bluetooth 5.2 compliant supporting Audio over BLE as well as backwards compatible with EDR & BR making this the first Bluetooth Dual Mode RF IP available in TSMC22ULL to support the latest features while providing full Bluetooth legacy support.

• Xilinx Selects Mipsology Zebra Software to Accelerate Alveo U50 FPGA
• IAR Systems delivers advanced trace for RISC-V based applications

Headlines for Tuesday Jun. 23, 2020

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Siemens acquires UltraSoC to drive design for silicon lifecycle management

Siemens has signed an agreement to acquire Cambridge, UK-based UltraSoC Technologies Ltd., a provider of instrumentation and analytics solutions that put intelligent monitoring, cybersecurity and functional safety capabilities into the core hardware of system-on-chip (SoC).

• Adesto Announces Completion of CFIUS Review for Proposed Acquisition of Adesto by Dialog Semiconductor
• Rianta Releases 200G/400G Single Channel MAC IP Core
• Arm Technology Powers the World's Fastest Supercomputer

Headlines for Monday Jun. 22, 2020

• intoPIX releases the FastTICO-XS SDK v1.2.4 for Nvidia GPU
• Silicon Catalyst Announces Four Newly Admitted Companies to Semiconductor Incubator
• GLOBALFOUNDRIES to Acquire Land in Malta, NY, Positioning its Advanced Manufacturing Facility for Future Growth

Headlines for Friday Jun. 19, 2020

• Synopsys Replenishes Repurchase Authorization to $500 Million
• North American Semiconductor Equipment Industry Posts May 2020 Billings
• GLOBALFOUNDRIES and SkyWater Technology Sign MOU for Technology Development to Strengthen Domestic Supply Assurance for U.S. Government

Headlines for Thursday Jun. 18, 2020

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Silex Insight Extends Their Crypto Coprocessor Offering by Introducing 2 New Variants (Compact & Premium)

Silex Insight, a leading provider for flexible security IP cores, announces today a complete family (3 variants) of NIST-validated crypto coprocessors by adding 2 new versions (Compact & Premium) to their portfolio to serve the different market needs.

• QuickLogic Announces Pricing of $8.75 Million Public Offering of Common Stock
• Powering next-generation in-vehicle experiences with Arm Mali GPU virtualization
• Samsung Provides One-Stop Foundry Design Environment with the Launch of "SAFE Cloud Design Platform"
• Awaiting a Deal, TSMC Chairman Reiterates Support for Arizona Fab
• Rambus Delivers 112G XSR/USR PHY on TSMC 7nm Process for Chiplets and Co-Packaged Optics in Networking and Data Center
• Synopsys Collaboration with Samsung Foundry Enables Rollout of Samsung SAFE Cloud Design Platform
• Distributed In-Chip Thermal Sensors Improve Multicore CPU Monitoring
• Automotive IC Market Forecast With Strongest CAGR Through 2024
• Intel's 10nm Node: Past, Present, and Future - Part 2
• Intel's 10nm Node: Past, Present, and Future

Headlines for Wednesday Jun. 17, 2020

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Picocom selects UltraSoC in-system analytics and monitoring IP for 5G New Radio small cell SoC

UltraSoC today announced that Picocom, the 5G open RAN baseband semiconductor and software specialist, has selected UltraSoC’s hardware-based analytics and monitoring IP for use in Picocom’s upcoming baseband system-on-chip (SoC) for 5G small cells.

• U.S. Chip Revival Gains Traction
• CREDO Announces Close of $100 Million Series D Preferred Financing as it Continues to Lead in High Performance Networking Connectivity Solutions

Headlines for Tuesday Jun. 16, 2020

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Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips

Agile Analog, a leading provider of semiconductor analog IP, today announced that they have worked with EnSilica, a leading fabless design house focused on custom ASIC design and supply services, to both fabricate and test their latest analog IP products, and to validate that their advanced product delivery processes provide maximum benefit to Agile Analog’s end customers.

• Xilinx Announces Real-Time Server Appliances for High-Quality, Low-Cost Live Video Streaming
• Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
• QuickLogic Announces Open Reconfigurable Computing Initiative

Headlines for Monday Jun. 15, 2020

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Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud

Synopsys, Inc. (Nasdaq: SNPS) today announced its collaboration with TSMC and Microsoft has delivered a ground-breaking, highly scalable timing signoff flow for use in the cloud. This extensive, multi-month collaboration among the three industry partners speeds up the path to signoff next-generation systems-on-chips (SoCs).

• Embedded Hardware Security Heads to the Edge
• IAR Systems enables secure code with updated MISRA C compliance in leading development tools
• BrainChip Successfully Launches the Akida Early Access Program
• Dolphin Design unveils CHAMELEON, a revolutionary event-based MCU subsystem

Headlines for Friday Jun. 12, 2020

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NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform

NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform.

Headlines for Thursday Jun. 11, 2020

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Arm falls out with Arm China

Yesterday Arm said that Arm China CEO Allen Wu was being dismissed for “serious irregularities including failing to disclose conflicts of interest and violations of the employee handbook,” and that Wu would be replaced by Phil Tang and Ken Phua.

• TSMC to Face Inventory Glut Caused by US-China Trade War
• Total Foundry Revenue Increases by 20% YoY in 2Q20, While Market Uncertainties Remain in 2H20, Says TrendForce
• Silex Insight Announces Record-breaking 1.5Tb MACsec Solution To Boost Data Center and 5G Infrastructure
• DSP Group Strengthens its Position in Rapidly Growing Headset Market with Acquisition of SoundChip SA
• Truechip Announces Shipping of Performance Analyzer Tool Kit to Aaroh Labs
• Real Intent Announces Verix Multimode DFT Static Sign-Off Tool
• Efinix Completes Trion FPGA Family for Edge Computing, AI/ML and Vision Processing Applications Using Cadence Digital Full Flow Solution
• SkyWater Licenses Key FDSOI Technology from MIT Lincoln Laboratory, Moves Up Availability of its 90 nm Strategic Rad-Hard by Process Offering
• Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports
• Qualcomm Retakes Market Leadership in 1Q20 Revenue Ranking of Global Top 10 IC Design Companies, Says TrendForce

Headlines for Wednesday Jun. 10, 2020

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Arm China CEO: Good or Gone?

On the morning of 10th June, Chinese local media reported that Arm China executive chairman and CEO Allen Wu was removed from his post. Reportedly, Arm China’s board of directors has appointed two other people as Arm China’s interim co-CEOs to succeed Allen Wu.

• Synopsys Acquires Semiconductor Analytics Innovator Qualtera
• TSMC May 2020 Revenue Report
• Synopsys Delivers the Industry's Only Complete Workflow for Automotive Lighting Design and Visualization in CATIA
• Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process

Headlines for Tuesday Jun. 09, 2020

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TSMC Discloses "Secret" 4nm Node

Taiwan Semiconductor Manufacturing Co. (TSMC) today lifted the veil on a previously unannounced manufacturing process between the 5nm and 3nm nodes that are already on the company’s roadmap. It’s 4nm.

• SmartDV's Design and Verification Solutions Portfolio Surpasses 600 Offerings
• Arteris IP Advances onto List of Top 15 Semiconductor IP Vendors
• IAR Systems and GigaDevice collaborate to bring powerful RISC-V solutions to the market

Headlines for Monday Jun. 08, 2020

• Mentor joins the O-RAN ALLIANCE to help drive interoperability requirements for 5G network silicon
• Sampling of 2Q Semiconductor Sales Guidance Now At -5%
• UMC Reports Sales for May 2020
• Andes Technology Steps Up to Premier Membership in RISC-V International; Greatly Expanding its U.S. R&D and Field Application Engineering Staffing
• GUC Monthly Sales Report - May 2020

Headlines for Thursday Jun. 04, 2020

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Synopsys Accelerates FIPS 140-3 Certification with NIST-Validated True Random Number Generator IP

Synopsys, Inc. (Nasdaq: SNPS) today announced its DesignWare® True Random Number Generator (TRNG) IP has received validation by the National Institute of Standards and Technology (NIST) Cryptographic Algorithm Validation Program (CAVP), paving the way for the lower-risk Federal Information Processing Standards (FIPS) 140-3 certification of customer end products.

• SmartDV Delivers New Design IP for Video, Imaging, Entertainment System Protocols
• Lattice Accelerates FPGA-based Processor Design with New IP Ecosystem and Design Environment
• Nolam Embedded Systems discloses the MIL-STD1553 solution integrated on REFLEX CES Arria 10 SoC Module
• IAR Systems launches support for the RISC-V P extension for Packed-SIMD instructions

Headlines for Wednesday Jun. 03, 2020

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Synopsys Introduces Industry's First Complete USB4 IP Solution

Successful Tapeout of the DesignWare USB4 PHY Test Chip on 5nm Process Reduces Risk and Accelerates Time-to-Market for SoCs Supporting the 40 Gbps USB Specification

• Green Hills Software Adds Industry-Leading Advanced Software Development Tools Support for RISC-V
• Efinix Announces Availability of Three RISC-V SoCs
• MIPI Alliance Completes Development of A-PHY v1.0, an Industry-Standard Long-Reach SerDes Physical Layer Interface for Automotive Applications
• Enyx launches an ultra-low latency development framework for building standardized, FPGA-based trading systems
• Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies

Headlines for Tuesday Jun. 02, 2020

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Imagination announces next-generation IEEE 802.11ax/Wi-Fi 6 IP for low-power applications

Imagination Technologies announces the launch of IMG iEW400, its latest IP based on Imagination’s Ensigma Wi-Fi technology. iEW400 delivers integrated RF and baseband, designed for low-power and battery-powered applications such as the internet of things (IoT), wearables and hearables.

• Codasip Extends SweRV Support Package to Include Western Digital SweRV EH2 & EL2 RISC-V Cores
• First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year
• UltraSoC enables ultra-high-speed closed-chassis analytics and debug over Synopsys USB3
• NEUCHIPS Announces World's First Deep Learning Recommendation Model (DLRM) Accelerator: RecAccel
• PUFsecurity IP Open Source Program: Bridging the Gap in Chip Security
• GigaDevice GD32 MCU and Amazon AWS Launch New Embedded Cloud Platform

Headlines for Monday Jun. 01, 2020

• Dolphin Design unveils SPIDER, a turnkey platform to accelerate the design of energy efficient power management systems
• Ambarella Adopts Cadence Clarity 3D Solver for AI Vision Processor Development
• Synopsys Fusion Design Platform and DesignWare IP Selected by Baikal Electronics to Deliver Latest High-Performance Computing SoC
• Global Semiconductor Sales Decrease 1.2 Percent Month-to-Month in April
• Samsung Foundry Certifies Synopsys Design Compiler NXT for 5/4nm FinFET Process Technologies
• Seamless Microsystems announces a major design-win
• Cloud Computing Is Changing Everything About Electronic Design