D&R Headline News (August 2020)

Headlines for Monday Aug. 31, 2020

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Mobiveil's 25xN RapidIO 4.1 compliant controller IP achives production status

Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (IP), platforms and IP-enabled design services, today announced that its 25xN RapidIO® Specification 4.1 compliant digital controller is now in volume production in customer silicon.

• Kneron's Next-Gen AI SoC Processes Video and Audio at the Edge
• Broadcom Overtakes Qualcomm for First Place While Nvidia Scores Highest YoY Growth in 2Q20 Revenue Ranking of Global Top Ten IC Design Companies, Says TrendForce
• Flex Logix Announces nnMAX AI Inference IP In Development On GLOBALFOUNDRIES 12LP Platform

Headlines for Thursday Aug. 27, 2020

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MIPS lands up in China

MIPS has ended up in China, reports Reuters. It got there via a tortured series of deals starting with Imagination buying MIPS in 2013 followed by China-backed Canyon Bridge buying Imagination in 2017.

• Chips&Media Publicizes the Collaboration on SiFive's OpenFive, a Custom Silicon Business Unit
• Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance Computing SoC
• proteanTecs Closes $45M Growth Equity Round Led by Koch Disruptive Technologies (KDT)
• Mentor's Questa and Veloce platforms help SimpleMachines dramatically speed development of its first AI processor
• China chip imports still at $300bn
• Bluespec, Inc. Releases RISC-V Explorer: A Fast, Free, Accurate Way to Evaluate RISC-V
• SiliconArts Joins the Khronos Group to Support Standardization of Vulkan Ray Tracing

Headlines for Wednesday Aug. 26, 2020

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Nvidia Data Center Growth: Could Buying Arm Be an Ideal Match?

With the data center being prime target, Nvidia buying Arm might actually be a natural match

• Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions

Headlines for Tuesday Aug. 25, 2020

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TSMC Plots the Process Course to Its Next "Generational Node"

Even as it ramps up production on its N5 process, Taiwan Semiconductor Manufacturing Co. (TSMC), at its annual Technology Symposium, introduced its N4 process, which it said is scheduled to come online in late 2021, with volume production in 2022.

• Marvell and TSMC Collaborate to Deliver Industry's Most Advanced Data Infrastructure Portfolio on 5nm Technology
• Synopsys and TSMC Accelerate 2.5D/3DIC Designs with Chip-on-Wafer-on-Substrate and Integrated Fan-Out Certified Design Flows
• Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design
• Huawei is hurrying to build a wafer fab
• TSMC Showcases Leading Technologies at Online Technology Symposium and OIP Ecosystem Forum
• GigaDevice launches the New GD32E5 Series of MCU's, marking a new milestone for high-performance computing based on the Arm Cortex-M33 core.
• Cadence Announces Availability of UltraLink D2D PHY IP on TSMC N7, N6 and N5 Processes
• Analog Bits to Present Papers on Wafer-Scale Sensors and PCIe Clock Systems at TSMC 2020 Open Innovation Platform Ecosystem Forums

Headlines for Monday Aug. 24, 2020

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Sofics releases Analog I/O's and ESD clamps for TSMC N5 process

Sofics bvba, a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) portfolio is silicon proven on TSMC’s advanced 5nm process technology.

• TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries
• Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications
• Foundry Revenue Projected to Grow by 14% YoY in 3Q20 as Downstream Clients Exhibit Strong Demand, Says TrendForce
• Socionext and Osaka University Develop New Deep Learning Method for Object Detection in Low-Light Conditions
• Silicon Creations' Achieves ISO 9001 Certification for World-Class Silicon IP Development Process
• Visit Moortec at the Virtual TSMC Technology Symposium & Open Innovation Platform Ecosystem Forum
• North American Semiconductor Equipment Industry Posts July 2020 Billings

Headlines for Thursday Aug. 20, 2020

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OpenFive Enhances Differentiated IP Portfolio with Die-to-Die Interface Controllers for HPC and Chiplet Markets

OpenFive, the leading provider of customizable, silicon-focused solutions with differentiated IP, today announced the launch of a new Die-to-Die (D2D) interface IP portfolio to serve next-generation chiplet based designs for Networking, HPC, and AI Markets.

• Arm and DARPA Sign Partnership Agreement to Accelerate Technological Innovation
• Synopsys IC Validator, Running on AMD EPYC Processor Powered Azure Virtual Machines, Verifies AMD Radeon Pro VII GPU Design in Under Nine Hours
• Electronics Supply Chains Splitting Between China and U.S.
• DRAM Capex Spending Expected to Decline 20% in 2020
• prpl Foundation Releases prplWRT Open-Source CPE Software
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2020
• Synopsys Appoints Sassine Ghazi as Chief Operating Officer
• NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP
• Subaru Selects Xilinx to Power New-Generation EyeSight System
• Clue Technologies adopts OneSpin's verification solution for avionic computing systems

Headlines for Wednesday Aug. 19, 2020

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Moortec Provides In-Chip Sensing Fabrics on TSMC N6 Process Technology

Moortec, the go-to leaders of innovative in-chip monitoring solutions today announced the availability of its well-established sensing fabric on TSMC’s industry-leading N6 process technology.

• Intel Looks to Regain Innovation Lead
• US Tightens Chip Export Screws on Huawei
• RIOS Laboratory and Imagination announce partnership to grow the RISC-V ecosystem
• CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6 Status from the Wi-Fi Alliance

Headlines for Tuesday Aug. 18, 2020

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The Landmark IPO of VeriSilicon (688521.SH) on Shanghai STAR Market

VeriSilicon priced its IPO at RMB38.53 per share, the offering raised approximately RMB1.86 billion, giving the company a total market value of RMB$18.6 billion. When the stock market opened, VeriSilicon’s stock price instantly soared to 150 RMB/share, an increase of 289.31%.

• SiFive and Innovium Announce Collaboration to Accelerate Innovation in Data Center Networking
• Mixel's Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers
• Rianta Releases 800G MACsec ASIC/SoC IP Core for Next-Gen Data Center and 5G Backhaul Applications
• Semiconductor Industry Luminary Fred Weber Joins Movellus as Corporate Advisor
• S2C and Mirabilis Design Teamup to Deliver a Heterogeneous Solution for SoC Architecture Exploration and Verification
• Nuvoton Accelerates the Development of its MCU Designs with the Cadence Palladium Z1 Enterprise Emulation Platform

Headlines for Monday Aug. 17, 2020

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SiFive Announces OpenFive, an Industry-Leading Custom Silicon Business Unit

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced OpenFive, a self-contained and autonomous business unit to capture the opportunity offered by enabling customizable, silicon-focused solutions with differentiated-IP.

• IBM Reveals Next-Generation IBM POWER10 Processor
• BrainChip Inc and Magik Eye Inc. Partner to Combine Best of AI with 3D Sensing for Total 3D Vision Solution
• eInfochips provides SOC engineering services to Astera Labs in developing industry's first PCIe 4.0 & 5.0 Smart Retimer SoC.
• Silicon Creations' SerDes Technology Designed into Novatek 8K TV SoC on TSMC 12nm Process
• Movellus Named to EETimes' Silicon 100 Emerging Startups to Watch List

Headlines for Friday Aug. 14, 2020

• Blaize Delivers Breakthrough for AI Edge Computing

Headlines for Thursday Aug. 13, 2020

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Alchip Technologies Opens 5nm ASIC Design Capabilities

Alchip Technologies to became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December.

• CHIPS Act Targets Post-Globalized Industry
• Cobham Advanced Electronic Solutions' RadHard Microelectronics Assist in Study of Sun and Earth Connection
• Cadence Delivers Machine Learning-Optimized Xcelium Logic Simulation with up to 5X Faster Regressions
• BrainChip Inc Appoints Vice President of Worldwide Sales
• Spin Memory Unveils New Method of Designing Memory to Shake Up $100B Chip Market

Headlines for Wednesday Aug. 12, 2020

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CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom

CEVA-Dragonfly NB2 turnkey solution is industry’s first and only licensable NB-IoT IP to receive full certification from one of the world’s largest mobile network operators

• Synopsys Introduces Integrated Electric Vehicle Virtual Prototyping Solution
• Qualcomm's licensing model declared legal
• Tachyum Demo Shows Prodigy will be Faster than NVIDIA and Intel Chips
• China-Based HiSilicon's Time in the Top-10 Ranking May be Short Lived
• Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules

Headlines for Tuesday Aug. 11, 2020

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SiFive Secures $61 Million in Series E Funding

SiFive today announced it raised $61 million in a Series E round led by SK hynix, joined by new investor Prosperity7 Ventures, with additional funding from existing investors, Sutter Hill Ventures, Western Digital Capital, Qualcomm Ventures, Intel Capital, Osage University Partners, and Spark Capital.

• QuickLogic Joins CHIPS Alliance to Expand Open Source FPGA Efforts

Headlines for Monday Aug. 10, 2020

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Huawei to end production of leading edge mobile chipsets

Huawei is to end production of its top-of-the- range Kirin mobile processors in September, according to Caixin Global, the Chinese state news site.

• Startup Claims Low-power IoT Geolocation Without a Positioning Chipset
• Mentor extends industry-leading EDA software support for Samsung Foundry's 5/4nm process technologies
• CEVA, Inc. Announces Second Quarter 2020 Financial Results
• One on One with RISC-V CTO Mark Himelstein
• Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices
• Covid-19 Expected to Limit Growth Rates For Many IC Products in 2020
• UMC Reports Sales for July 2020
• TSMC July 2020 Revenue Report

Headlines for Friday Aug. 07, 2020

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Truechip Announces Customer Shipment Of USB4 And eUSB Verification IPs

Truechip, the Verification IP Specialist, today announced that it has shipped early adoption version of USB4 Verification IP along with eUSB.

Headlines for Thursday Aug. 06, 2020

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CAST HDLC/SDLC IP Core Now Ready for DO-254 Compliance in Airborne Systems

Silicon intellectual property provider CAST, Inc. today announced a new version of its HDLC/SDLC IP core that helps avionics system developers achieve compliance with the DO-254 standard at the most stringent Design Assurance Level, DAL-A.

• SMIC Reports 2020 Second Quarter Results.
• Lattice FPGA Brings High-Performance MIPI Bridging to Ambarella's CVflow Architecture for Automotive and Machine Vision Applications
• Aldec's TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass
• MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs

Headlines for Wednesday Aug. 05, 2020

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Codasip and Metrics Design Automation Announce the Integration of the Metrics Cloud Simulation Platform in Codasip's RISC-V SweRV CORE Support Package Pro

Codasip, the leading supplier of customizable RISC-V embedded processor IP, and Metrics Design Automation, providers of the only True Cloud EDA solution, today jointly announced the integration of the Metrics SystemVerilog RTL Simulation Platform within Codasip’s Pro SweRV Core™ Support Package.

• Syntiant Surpasses 1 Million Units Shipped; Raises $35M in Series C Led by M12 and Applied Ventures
• Global Semiconductor Sales Increase 5.1 Percent Year-to-Year in June; Q2 Sales Down Slightly Compared to Q1
• HiWire Consortium Publishes first Active Electrical Cable (AEC) Specification
• Rambus Reports Second Quarter 2020 Financial Results
• GUC Monthly Sales Report - July 2020
• Pliops Storage Processor Proven to Boost Flash Performance

Headlines for Tuesday Aug. 04, 2020

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PUFsecurity Launches Unique Quantum-Tunneling PUF-based Root-of-Trust

The new IP – PUFrt – is a PUF-based hardware root-of-trust that includes proprietary NeoPUF as the core technology. A physical unclonable function (PUF) provides a "digital fingerprint" that can serve as a unique identifier for a chip, as well as other security purposes, including encryption, identification, authentication, security key generation.

• Picocom Embeds 32 Andes N25F RISC-V Cores into Its 5G NR Small Cell Baseband SoC

Headlines for Monday Aug. 03, 2020

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Nvidia-Arm Deal Would Be a Technology "Disaster"

That Nvidia intends to buy Arm from Softbank now appears to be more than just idle speculation. Nvidia initially approached SoftBank with a proposal to purchase Arm for more than $32 billion in a cash-and-stock deal, according to two news sources.

• Goodix Closes Acquisition of Dream Chip Technologies
• Greg Lang Joins Rambus Board of Directors
• Nvidia in pole position to buy Arm
• Nvidia Buying Arm Would be Reckless
• NAND Flash, DRAM Forecast to Remain Largest IC Markets in 2020