D&R Headline News (October 2020)

Headlines for Thursday Oct. 29, 2020

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intoPIX releases a new range of 8K TICO-XS IP-cores supporting the JPEG XS standard

intoPIX, leading provider of innovative compression solutions for audio-visual applications, today announces the release, with direct availability, of 8K TICO-XS encoder and decoder IP-Cores.

• Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor
• Marvell to Acquire Inphi - Accelerating Growth and Leadership in Cloud and 5G Infrastructure
• Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams
• SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP
• Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts
• Mentor's High Density Advanced Packaging solution certified for Samsung Foundry's most advanced packaging process
• QuickLogic Joins Samsung SAFE IP Partner Program

Headlines for Wednesday Oct. 28, 2020

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Analog Bits Announces Analog IP Availability on Samsung Technologies

Analog Bits announced a comprehensive and differentiating foundation analog IP portfolio today on multiple Samsung Foundry technologies, including 32LP, 28LPP, 28FDSOI, 14LPP, 8LPP, 7LPP, 5LPE.

• Synopsys and Samsung Release Certified 3nm Gate-All-Around AMS Design Reference Flow for Early Design Starts
• DRAM Price Erosion Expected Through the End of 2020
• Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments
• Rambus IPsec Packet Engine Secures 5G Networking at 10 Gbps
• Synopsys and Samsung Foundry Collaboration Delivers Optimized Reference Methodology for High-Performance Compute Designs
• Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools
• Truechip Adds New Customer Shipments of Verification IPs For RISC-V Family Including TileLink
• QuickLogic Announces the ArcticPro 3 eFPGA IP for Samsung 28FDS Process

Headlines for Tuesday Oct. 27, 2020

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AMD to Acquire Xilinx, Creating the Industry's High Performance Computing Leader

AMD (NASDAQ: AMD) and Xilinx (NASDAQ: XLNX) today announced they have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at $35 billion.

• Synopsys Expands Portfolio of Automotive VDKs with Support for Infineon's AURIX TC4xx 32-bit Microcontroller Family
• Floadia Raises 1.2 Billion Yen to Develop New Memory Technology That Can Be Disruptor in AI Edge Computing
• Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor
• Cortus Announces the Opening of another New Design Centre in Meyreuil (France)

Headlines for Monday Oct. 26, 2020

• EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
• Orthogone Technologies Reveals New Brand Identity, Sets 25% Growth Target for 2021
• Aldec's TySOM Family of Embedded System Development Solutions Now Supports Xilinx PYNQ (Python Productivity for Zynq)
• Synopsys and Samsung Foundry Collaboration Delivers Portfolio of Optimized iPDKs and Methodologies for Advanced Custom Design
• North American Semiconductor Equipment Industry Posts September 2020 Billings
• Micro Magic, Inc. Unleashes World's Fastest RISC-V Core

Headlines for Friday Oct. 23, 2020

• Mentor receives 2020 TSMC OIP Partner of the Year awards for EDA solutions
• Visit Vidatronic at the Virtual Samsung SAFE Forum on October 28th

Headlines for Thursday Oct. 22, 2020

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PLDA demonstrates successful PCIe 5.0 Link Training at 32 GT/s with its PCIe 5.0 controller and Broadcom PHY

PLDA, the industry leader in PCI Express® controller IP solutions has today unveiled their PCIe 5.0 demonstration. The demo showcases stable PCIe 5.0 Link Training (32 GT/s) and exceptional signal integrity with a Broadcom® PCIe 5.0 PHY platform.

• TSMC Sees HPC As Next Inflection Point
• Arm partners with Mentor to offer complete verification service
• Synopsys 3DIC Compiler Enables Samsung Tapeout of Advanced Multi-die Packaging of High-Bandwidth Memories for HPC Applications
• M31 Technology Receives 2020 TSMC OIP Partner of the Year Award for Specialty Process IP
• eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP
• SmartDV Appoints Karthik Gopal as Asia General Manager
• Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade
• GlobalFoundries Offers Ambitious Tech Plans, While Eying an IPO

Headlines for Wednesday Oct. 21, 2020

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Faraday Brings Advanced Audio ASIC Solutions to the Music Entertainment Industry

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced gains in advanced to high-end audio applications with adoption and recognition from some of the top brands in musical instruments.

• Arm Awarded TSMC OIP Partner of the Year Award for Processor IP for Six Years in a Row
• Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
• Silicon Creations Named 2020 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
• Microchip Acquires High-Level Synthesis Tool Provider LegUp to Simplify Development of PolarFire FPGA-based Edge Compute Solutions
• TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions
• IAR Systems brings functional safety tools to RISC-V with certification for IEC 61508 and ISO 26262

Headlines for Tuesday Oct. 20, 2020

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Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip

Flex Logix Technologies, Inc. today announced availability of its InferX™ X1, the industry’s fastest AI inference chip for edge systems.

• Codasip Announces a New Design Center in France
• Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence
• TSMC Announces 2020 OIP Partner of the Year Awards for Excellence in Accelerating Silicon Innovation
• Cadence Reports Third Quarter 2020 Financial Results
• SmartDV to Exhibit at Virtual Samsung SAFE Forum 2020 with Portfolio of Design and Verification IP
• TSMC 12FFC silicon proven SERDES Phy IPs' for HDMI 2.1, PCIe Gen5, DDR4, USB 4 & MIPI Interfaces available immediately for your next SoC
• SK hynix to Acquire Intel NAND Memory Business

Headlines for Monday Oct. 19, 2020

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Latest NPU adds to Arm's AI Platform performance, applicability, and efficiency

With an ever-increasing range of devices adding artificial intelligence (AI) functionality, Arm today announced the latest member of its Ethos product line, the Arm Ethos-U65 microNPU (Neural Processing Unit).

• Synopsys Accelerates Power Electronics System Design with Virtual Prototyping Solution
• Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
• Dolphin Design's SPEED platforms receive the "Solar Impulse Efficient Solution" Label, rewarding profitable solutions that protect the environment.
• Perforce Software Accelerates SoC Development With Methodics IPLM 3.0 Launch
• Wipro to acquire Eximius Design, strengthens leadership in VLSI and systems design services

Headlines for Thursday Oct. 15, 2020

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CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio

CSEM, a leader in ultra-low-power RF design, announced today at the GLOBALFOUNDRIES® (GF®) Global Technology Conference (GTC) EMEA that CSEM has released its Bluetooth Dual-Mode silicon IP on GF’s 22nm FD-SOI (22FDX®) platform for next generation of portable audio devices.

• TSMC Reports Third Quarter EPS of NT$5.30
• GLOBALFOUNDRIES Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Feature on 22FDX Platform
• Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS
• Global Silicon Wafer Shipments on Track for 2020 Recovery and 2022 Record High, SEMI Reports
• JEDEC Announces Publication of JEDEC Module Sideband Bus
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution

Headlines for Wednesday Oct. 14, 2020

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China Forecast to Represent 22% of the Foundry Market in 2020

China was responsible for essentially all of the total pure-play foundry market increase in 2018. In 2019, the U.S./China trade war slowed China’s economic growth but its foundry marketshare still increased by two percentage points to 21%.

• Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
• Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
• TriEye Shortens Time to Market for Next-Generation CMOS-Based SWIR Image Sensors with the Cadence Spectre X Simulator

Headlines for Tuesday Oct. 13, 2020

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Synopsys Demonstrates Industry's First PCI Express 5.0 IP Interoperability with Intel's Future Xeon Scalable Processor

Synopsys today announced its collaboration with Intel to achieve successful system-level interoperability between the Synopsys DesignWare Controller and PHY IP for PCI Express 5.0 and future Intel Xeon Scalable processors (codename Sapphire Rapids).

• Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions
• Innosilicon Achieves World-First Tapeout Success on SMIC N+1 Process
• MIPI Alliance and IEEE Sign Agreement to Bring Automotive SerDes Standard to Broader Ecosystem
• Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing
• Imagination launches IMG B-Series: Doing more with multi-core
• Synopsys to Enable New Levels of Insight into SoC Designs and Systems with Industry's First Silicon Lifecycle Management Platform
• Synopsys Names Shankar Krishnamoorthy General Manager of the Digital Design Group
• OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset
• New Cadence Clarity 3D Transient Solver Delivers Up to 10X Faster System-Level EMI Simulation
• Cadence Brings Verification IP to the Chip Level with New System VIP Solution

Headlines for Monday Oct. 12, 2020

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AMD Reported to Be Negotiating Purchase of Xilinx

AMD is said to be negotiating to buy Xilinx, and a deal could come as soon as next week. If the two companies agree, the deal would likely be worth approximately $30 billion, according to The Wall Street Journal.

• AMD and Xilinx: A Match Made in Silicon Valley?
• Synopsys IC Compiler II Delivers First-Pass Silicon Success for Graphcore's Multi-Billion Gate AI Processor
• AMD-Xilinx Deal: Bringing The Fight To The Data Center
• Cadence Pegasus Verification System Certified for TSMC N16, N12 and N7 Process Technologies
• Menta Appoints ETSI as United States East Coast Representative
• intoPIX Ships v2.0 of FastTICO-XS SDK for x86-64 CPU platforms to speed up JPEG-XS workflows
• Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor'
• Visit Vidatronic at the Virtual GLOBALFOUNDRIES Technology Conference (GTC) - EMEA on October 16th
• Attend Andes Technology's Presentation "A RISC-V Out-of-Order Processor" at the Linley Processor Conference

Headlines for Thursday Oct. 08, 2020

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Huang "Confident" Nvidia-Arm Deal Will Get Past Regulators

Nvidia CEO Jensen Huang is confident that the Nvidia-Arm deal, the biggest in semiconductor history at $40 billion, will get past global regulators.

• Synopsys DesignWare CXL IP Supports AMBA CXS Protocol Targeting High-Performance Computing SoCs
• proteanTecs Announces Market and Regional Expansions
• Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs
• UMC Reports Sales for September 2020
• TSMC September 2020 Revenue Report
• Pushing the boundaries of performance and security to unleash the power of 64-bit computing
• Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference
• Intento Design Expands Analog Automation with IDX-PVT, Eliminating the Need for Design-by-Verification
• Cadence Announces Complete DDR5/LPDDR5 IP Solution for TSMC N5 Process Technology
• Attopsemi's I-fuse Memory Solution Now Qualified and Available on X-FAB's 130nm RF-SOI Technology

Headlines for Wednesday Oct. 07, 2020

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CAST Introduces Ultra-Low Latency TSN Ethernet Switch IP Core

Today at the virtual TSN/A Technology and Applications Conference, silicon intellectual property provider CAST, Inc. announced a new IP core that implements a switch for Time-Sensitive Networking (TSN) Ethernet networks as increasingly used in automotive, industrial, medical, and other systems.

• VSORA Introduces Small Footprint, Low-Power PetaFLOPS Platform Enabling L4/L5 Autonomous Driving
• Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System
• SmartDV Unveils SmartConf Testbench Generator

Headlines for Tuesday Oct. 06, 2020

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Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications

These 32-bit MCUs boost operating performance up to 200 MHz using the Arm® Cortex®-M33 core based on Armv8-M architecture with Arm TrustZone® technology.

• Eximius Design Joins TSMC Design Center Alliance Program

Headlines for Monday Oct. 05, 2020

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OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions

Interlaken C2C Controller IP from OpenFive and AXLinkIO SerDes IP from AnalogX achieves ultra-low latency and <1pJ/bit solution for a Tier-1 customer

• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q2 2020
• Intel's Roadmap: A Closer Look at Process Technologies and Production Plans
• Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August
• GUC Monthly Sales Report - September 2020
• Imagination Technologies Group Ltd. Announces new CEO Simon Beresford-Wylie
• TurboConcepts successfully completes research project FlexDEC-5G for designing FEC decoders for 5G
• China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce
• Efabless Extends Partnerships for Rapid Development Solution of Custom ICs
• Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology
• Toshiba Information Systems Adopts Blue Pearl Software Visual Verification Suite by to Improve Quality and Accelerate FPGA and ASIC Development

Headlines for Thursday Oct. 01, 2020

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Arteris IP to Acquire Assets of Magillem Design Services, Creating World's Premier System-on-Chip Assembly Company

Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced a definitive agreement with Magillem Design Services (EPA: MLMGL) under which Arteris IP will acquire the assets of Magillem Design Services (“Magillem”). Substantially all Magillem team members will be joining Arteris IP.

• Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs
• Efinix Announces Availability of Reconfigurable Acceleration Platform
• New MIPI Debug and Trace Solution Available for Mobile, IoT and Automotive