D&R Headline News (November 2020)

Headlines for Monday Nov. 30, 2020

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Andes Announces New RISC-V Processors: Superscalar 45-Series with Multi-core Support and 27-Series with Level-2 Cache Controller

Andes Technology Corporation, the leader in RISC-V CPU solutions, today proudly announces new members of AndesCore™: high performance superscalar A45MP and AX45MP multicore processors, and A27L2 and AX27L2 processors with Level-2 (L2) cache controller.

• Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC"
• Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor
• Nordic Semiconductor expands into Wi-Fi by acquiring the entire Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group
• BrainChip Appoints Geoffrey Carrick as Non-Executive Director
• Xiphera announces FPGA-based TLS 1.3 IP core for mission-critical applications
• Arteris IP Completes Acquisition of Magillem Design Services Assets, Creating World's Premier System-on-Chip Integration Company
• Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure

Headlines for Thursday Nov. 26, 2020

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Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its memory compilers based on UMC’s 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tapeouts.

• intoPIX demos newest compression technologies shaping the future of lossless quality wired/wireless transmission: 4K/8K JPEG XS, TICO-RAW and FlinQ - lowest latency & power, highest quality
• IAR Systems delivers extended optimization and trace capabilities for RISC-V development
• Innatera raises EUR 5M to bring neuromorphic intelligence to the sensor-edge

Headlines for Wednesday Nov. 25, 2020

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Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development

Gyrfalcon Technology (GTI) today announced AI-X™, a new full-stack solution for AI development ideal for small and medium enterprises (SMEs)

Headlines for Tuesday Nov. 24, 2020

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Intel to Keep Its Number One Semiconductor Supplier Ranking in 2020

Seven top-15 semiconductor suppliers forecast to show ≥22% growth this year with Nvidia expected to post a huge 50% increase.

Headlines for Monday Nov. 23, 2020

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CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth® Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification.

• China TSMC Rival HSMC Runs Out of Cash, Ex-CEO Says
• Audio Weaver + TalkTo reference design now available on Qualcomm QCS400 series of audio System-on-Chips (SoCs)
• North American Semiconductor Equipment Industry Posts October 2020 Billings
• Mythic launches industry-first AI analog matrix processor

Headlines for Friday Nov. 20, 2020

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Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign

Palma Ceia SemiDesign announced today the availability of the company’s Wi-Fi HaLow Reference Platform, including all necessary hardware and software, for the design of Wi-Fi HaLow devices and systems based on the IEEE 802.11ah specification.

Headlines for Thursday Nov. 19, 2020

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Ferroelectric Memory GmbH (FMC) Raises $20 Million to Accelerate Next-Generation Memory for AI, IoT, Edge Computing, and Data Center Applications

Ferroelectric Memory GmbH (FMC), the ferroelectric hafnium oxide technology leader, today announced that it has completed a $20 million Series B funding. The round of financing was led by the new investors M Ventures and imec.xpand, with participation of SK hynix, Robert Bosch Venture Capital, and TEL Venture Capital.

• AI Startup Deep Vision Powers AI Innovation at the Edge
• Secure Thingz supports next-generation Secure Install technologies for IP Protection and malware prevention
• Xilinx Collaborates With Texas Instruments to Develop Energy Efficient 5G Radio Solutions
• Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI
• SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge
• Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification

Headlines for Wednesday Nov. 18, 2020

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Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products

SiFive and Bouffalo Lab today announced the adoption of SiFive E2-Series Core IP based on RISC-V as part of Bouffalo’s new IoT Bluetooth, Zigbee, Thread and WiFi products, the BL70x and BL602.

• Foundry Revenue Expected to Increase by 23.8% YoY in 2020, with Advanced Nodes and 8-Inch Capacities Being Key to Industry Competitiveness in 2021, Says TrendForce
• Wafer Capacity by Feature Size Shows Strongest Growth at <10nm
• Fugaku Tops Supercomputer Rankings Again as Arm HPC Ecosystem Expands
• First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced
• BrainChip Appoints Todd Vierra Director of Technical Sales

Headlines for Tuesday Nov. 17, 2020

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Kandou Raises $92.3 Million in Series C Funding

Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round.

• GUC Die-to-Die (D2D) Total Solution Opening the New Era of Flagship SoC
• Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications
• Marvell Announces Industry's First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
• Arteris IP Achieves Major Milestone: 150th Licensee

Headlines for Monday Nov. 16, 2020

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Apple M1 Processor, Passing on the Chiplets

Recent angry comments to EE Times‘ interview with Intel’s Ramune Nagisetty disparaged the current heterogenous integration and chiplet discussions as more of a rehash than an innovation and furthermore simply a way for American manufacturers to obfuscate their inability to stay at the leading edge of wafer fabrication.

• BrainChip Demonstrates How Its Akida Technology Is Delivering the Next-Generation of AI at the Edge at First-Ever AI Field Day
• SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip
• Lattice Expands Radiant Software Tool Capabilities

Headlines for Thursday Nov. 12, 2020

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Synopsys Acquires In-chip Monitoring Solutions Leader Moortec

Synopsys, Inc. (NASDAQ: SNPS) today announced that it has acquired Moortec, a leading provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors.

• Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives
• Lattice Accelerates Development of Low Power FPGA-Based Custom Solutions with Lattice Design Group
• Imagination launches multi-core IMG Series4 NNA - the ultimate AI accelerator delivering industry-disruptive performance for ADAS and autonomous driving
• Faraday's 22nm Fundamental IP Adopted for Intelligent IoT Devices
• Silvaco Acquires Memory Compiler Technology of Dolphin Design SAS
• De-RISC first anniversary, a H2020 project which will create the first RISC-V, fully European platform for space
• Google Partners with SkyWater and Efabless to Enable Open Source Manufacturing of Custom ASICs
• Vidatronic Achieves up to 10X Speedup Using the Cadence Spectre X Simulator

Headlines for Wednesday Nov. 11, 2020

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CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).

• Efinix Announces Trion Titanium Tapeout at TSMC 16 nm Process Node
• TSMC October 2020 Revenue Report

Headlines for Tuesday Nov. 10, 2020

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PLDA Announces CXL 2.0 Support in their XpressLINK Family of CXL Controller IP

PLDA, the industry leader in high-speed Interconnect solutions, today announced CXL 2.0 support for its XpressLINK™ and XpressLINK-SOC™ CXL IP solutions.

• CXL Consortium Releases Compute Express Link 2.0 Specification
• Silex Insight delivers state-of-the-art security features to the award-winning Secure Vault technology from Silicon Labs
• CAST Releases MIPI I3C Basic Slave Controller IP Core
• Synopsys Announces Industry's First CXL 2.0 VIP Solution for Breakthrough SoC Performance
• Graphcore leverages multiple Mentor technologies for its massive, second-generation AI platform
• Pinnacle Imaging Systems Announces Denali 3.0 ISP
• Kameleon Security and Xilinx Collaborate on New Cybersecurity Solution for Servers, Cloud Computing and Data Centers
• Avery Design Debuts QEMU Virtual Host to SystemVerilog PCIe VIP HW-SW Co-simulation Solution for Pre-silicon System-level Simulation of NVMe SSD and PCIe Designs

Headlines for Monday Nov. 09, 2020

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Cadence Achieves Industry-First ASIL B(D) Compliance Certification for Automotive Radar, Lidar and V2X DSP IP

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification.

• MosChip Technologies appoints Semiconductor Business Veteran, Swamy Irrinki As "Vice President of Marketing and Business Development" to Oversee and Drive Continued Business Growth
• European Processor Initiative: Second year of activities
• UMC Reports Sales for October 2020

Headlines for Friday Nov. 06, 2020

• CEVA SenslinQ Platform Wins 2020 ASPENCORE World Electronics Achievement Award
• Driven by Accelerating Demand for Leading 5G RF Solutions, GLOBALFOUNDRIES and Soitec Announce RF-SOI Wafer Supply Agreement
• Learn the Latest on RISC-V and Vector Processing at All Six Andes Technology Corporation's Presentations at the 2020 RISC-V Summit

Headlines for Thursday Nov. 05, 2020

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PLDA XpressSWITCH IP for PCIe technology first ever switch soft IP to pass PCI-SIG's PCIe 4.0 compliance tests

PLDA XpressSWITCH IP passed all Gold and Interoperability tests as a Switch Component at PCIe 4.0 architecture speed (16 GT/s)

• GUC Monthly Sales Report - Oct 2020
• CEVA, Inc. Announces Third Quarter 2020 Financial Results
• eMemory NeoFuse IP Qualified on GLOBALFOUNDRIES Advanced High Voltage Platform for OLED Applications
• New Wave Design and Verification Appoints New President

Headlines for Wednesday Nov. 04, 2020

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Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family

Imagination Technologies announces that its BXS-4-64 GPU will be included in Texas Instruments (TI) Jacinto™ processor families for automotive applications. BXS offers up to 60% higher performance for automotive graphics applications, like surround view technology, thanks to its bespoke design for the automotive market needs.

• 300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports
• 28FDSOI "SoC White Box" SERDES & Controller IPs' are available for immediate licensing
• 55 BCDLite Solution Positions GLOBALFOUNDRIES for Continued Leadership in Audio Amplifiers for Mobile Devices

Headlines for Tuesday Nov. 03, 2020

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Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips

Arteris IP today announced that Bosch has licensed Arteris FlexNoC Interconnect IP and the accompanying Resilience Package for use in multiple ISO 26262-compliant automotive projects.

• Xylon Announces a New Version of logiVIEW Multiview 3D Video Transformation Engine IP Core
• NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions
• Inaccel announces record-breaking speed on facial detection test using an FPGA cluster
• Rambus Reports Third Quarter 2020 Financial Results
• Rambus Announces New Stock Repurchase Program
• Movellus Joins GLOBALFOUNDRIES Ecosystem Program, as Partner Providing Application-Optimized PLLs, DLLs, & Comprehensive Clocking Solutions
• Aldec Introduces Hardware Assisted RTL Simulation Acceleration for Microchip FPGA Designs

Headlines for Monday Nov. 02, 2020

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Telink and Andes Announce the TLSR9 SoC with RISC-V Processor

Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series.

• Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year
• Sondrel announces tape-out of its largest chip design
• Q3 Global Semiconductor Sales Increase 11 Percent Compared to Q2
• Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards