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Andes Technology Corporation, the leader in RISC-V CPU solutions, today proudly announces new members of AndesCore™: high performance superscalar A45MP and AX45MP multicore processors, and A27L2 and AX27L2 processors with Level-2 (L2) cache controller.
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its memory compilers based on UMC’s 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tapeouts.
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Gyrfalcon Technology (GTI) today announced AI-X™, a new full-stack solution for AI development ideal for small and medium enterprises (SMEs)
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Seven top-15 semiconductor suppliers forecast to show ≥22% growth this year with Nvidia expected to post a huge 50% increase.
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CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth® Low Energy (LE) 5.2 Platform has achieved Bluetooth SIG Qualification.
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Palma Ceia SemiDesign announced today the availability of the company’s Wi-Fi HaLow Reference Platform, including all necessary hardware and software, for the design of Wi-Fi HaLow devices and systems based on the IEEE 802.11ah specification.
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Ferroelectric Memory GmbH (FMC), the ferroelectric hafnium oxide technology leader, today announced that it has completed a $20 million Series B funding. The round of financing was led by the new investors M Ventures and imec.xpand, with participation of SK hynix, Robert Bosch Venture Capital, and TEL Venture Capital.
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SiFive and Bouffalo Lab today announced the adoption of SiFive E2-Series Core IP based on RISC-V as part of Bouffalo’s new IoT Bluetooth, Zigbee, Thread and WiFi products, the BL70x and BL602.
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Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round.
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Recent angry comments to EE Times‘ interview with Intel’s Ramune Nagisetty disparaged the current heterogenous integration and chiplet discussions as more of a rehash than an innovation and furthermore simply a way for American manufacturers to obfuscate their inability to stay at the leading edge of wafer fabrication.
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Synopsys, Inc. (NASDAQ: SNPS) today announced that it has acquired Moortec, a leading provider of in-chip monitoring technology specializing in process, voltage and temperature (PVT) sensors.
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CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
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PLDA, the industry leader in high-speed Interconnect solutions, today announced CXL 2.0 support for its XpressLINK™ and XpressLINK-SOC™ CXL IP solutions.
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Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® Tensilica® ConnX B10 and ConnX B20 DSPs are the industry’s first DSPs optimized for automotive radar, lidar and vehicle-to-everything (V2X) to achieve Automotive Safety Integrity Level B in support of D (ASIL B(D))-compliant certification.
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PLDA XpressSWITCH IP passed all Gold and Interoperability tests as a Switch Component at PCIe 4.0 architecture speed (16 GT/s)
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Imagination Technologies announces that its BXS-4-64 GPU will be included in Texas Instruments (TI) Jacinto™ processor families for automotive applications. BXS offers up to 60% higher performance for automotive graphics applications, like surround view technology, thanks to its bespoke design for the automotive market needs.
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Arteris IP today announced that Bosch has licensed Arteris FlexNoC Interconnect IP and the accompanying Resilience Package for use in multiple ISO 26262-compliant automotive projects.
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Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series.