D&R Headline News (January 2021)

Headlines for Thursday Jan. 28, 2021

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Synopsys Demonstrates Silicon Proof of DesignWare 112G Ethernet PHY IP in 5nm Process for High-Performance Computing SoCs

Synopsys today announced the silicon proof of DesignWare® 112G Ethernet PHY IP in 5nm FinFET process, delivering significant performance, power and area advantages.

• Faraday Reports Fourth Quarter 2020 Revenues at NT$1,430 Million, 2020 Annual Revenues NT$5,495 Million, Mass Production Up 18% YoY
• Intrinsic ID's QuiddiKey PUF Selected by Fungible in Drive to Secure Next Gen Data Centers
• Adopt the intoPIX JPEG XS Plugin for Adobe Premiere and ease your live video workflow
• RV64X: A Free, Open Source GPU for RISC-V
• Amber Solutions Closes 2020 With Series B Funding Totaling More Than $8.5 Million
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4x4:4 Transceiver
• MPEG LA Announces Development of VVC (Versatile Video Coding) Pool License
• EdgeQ Adds Former Qualcomm CEO Paul Jacobs & CTO Matt Grob as Advisors to Disrupt the Current Closed RAN Ecosystem with RISC-V based Highly Programmable 5G and AI Platform
• Xilinx Reports Third Quarter Fiscal Year 2021 Results

Headlines for Wednesday Jan. 27, 2021

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Synopsys Delivers Industry's First Integrity and Data Encryption Security IP Modules for PCI Express 5.0 and Compute Express Link 2.0 Specifications

Synopsys today announced the availability of the DesignWare® Integrity and Data Encryption (IDE) Security Modules to help designers protect against data tampering and physical attacks in high-performance computing (HPC) SoCs using the PCI Express® (PCIe®) 5.0 architecture or Compute Express Link™ (CXL™) 2.0 interface.

• Mirabilis Design integrates Fast Functional Processors into VisualSim Architect to close the software design, development and validation loop
• North American Semiconductor Equipment Industry Posts December 2020 Billings
• Palma Ceia SemiDesign Names Robert Young Chief Technology Officer
• Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance
• Andes Technology Corp. Announces EdgeQ to Deliver Converged 5G and AI Silicon Platform with AndesCore RISC-V License for the 5G Open Radio Access Network
• Gowin Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability
• IC Insights Releases the New 2021 Edition of The McClean Report
• EvoNexus partners with Arm to Accelerate Launch of New Semiconductor Startups

Headlines for Tuesday Jan. 26, 2021

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USB 4.0, USB 3.2, USB 3.0, USB 2.0 Silicon Proven PHYs in TSMC, UMC & SMIC Foundries available from T2MIP

T2M-IP The global independent semiconductor IP Cores & Technology provider, is pleased to announce the immediate availability of industry’s smallest USB Interface IP Cores on advanced nodes from TSMC, UMC and SMIC foundries, which are silicon proven and are implemented in numerous production SOC’s.

• Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners
• CXL gathers speed with 2.0 spec

Headlines for Monday Jan. 25, 2021

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Avery Design Announces CXL 2.0 VIP

Avery Design Systems today announced availability of CXL 2.0 VIP. Computer Express Link (CXL) is an open industry-standard interconnect offering coherency and memory semantics using high- bandwidth, low-latency connectivity between host processor and devices such as accelerators, memory buffers, and smart I/O devices

• 2020 Activities, Outlook for 2021 & Update of the Financial Objectives: Kalray Aims to Become a European Champion in Intelligent Processors
• Imperas Leads The RISC-V Processor Verification Ecosystem
• KeyASIC Inked Technologies and IP Deal of RM21Mil

Headlines for Friday Jan. 22, 2021

• eInfochips Wins Design Services Company of the Year Award from IESA

Headlines for Thursday Jan. 21, 2021

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Arasan announces its Total eMMC IP solution for TSMC 22nm process

Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of its eMMC PHY IP for TSMC 22nm process technology

• Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
• Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
• MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
• Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
• Foxconn and Winbond Make Strategic Investment in Kneron

Headlines for Wednesday Jan. 20, 2021

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Industry R&D Spending To Rise 4% After Hitting Record in 2020

Intel stays on top of research and development ranking, but its share of total industry R&D expenditures dipped after its spending decreased 4% in 2020. AMD moved into the R&D top 10, says new report.

• Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
• Attopsemi Released White Paper "I-fuse - Most Reliable and Fully Testable OTP"
• Powerful FPGA Design Creation and Simulation IDE Adds VHDL-2019 Support & OSVVM Enhancements

Headlines for Tuesday Jan. 19, 2021

• Sondrel Selects Synopsys Fusion Design and Verification Platforms to Displace Legacy Design Tools
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing

Headlines for Monday Jan. 18, 2021

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PLDA Announces XpressLINK-SOC CXL Controller IP with Support for the AMBA CXS Issue B Protocol

PLDA, the industry leader in high-speed interconnect solutions, today announced that PLDA’s industry-leading XpressLINK-SOC™ CXL IP provides full support for the AMBA® CXS Issue B (CXS-B) interface protocol.

• TSMC Boosts Capital Expenditure Budget on Strong Outlook
• DCD With EBBM in USA & Greece

Headlines for Thursday Jan. 14, 2021

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Qualcomm to Acquire NUVIA

Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has entered into a definitive agreement to acquire NUVIA for approximately $1.4 billion before working capital and other adjustments.

• Intel Appoints Tech Industry Leader Pat Gelsinger as New CEO
• Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
• TSMC Reports Fourth Quarter EPS of NT$5.51
• BeagleBoard.org and Seeed Introduce the First Affordable RISC-V Board Designed to Run Linux
• Ginger Lee Named Chief Financial Officer for Palma Ceia SemiDesign
• TSMC to Kick off Mass Production of Intel CPUs in 2H21 as Intel Shifts its CPU Manufacturing Strategies, Says TrendForce
• Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology
• Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
• Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices

Headlines for Wednesday Jan. 13, 2021

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Value of Semiconductor Industry M&A Agreements Sets Record in 2020

Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of $118.0 billion, surpassing the previous record of $107.7 billion reached in 2015

• Netflix Now Streaming xHE-AAC Audio on Android Mobile
• Syntiant Surpasses Milestone of 10 Million Processors Shipped
• Arm's powerful compute and graphics platform at the heart of the new Samsung Exynos 2100

Headlines for Tuesday Jan. 12, 2021

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Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs

Synopsys, Inc. (Nasdaq: SNPS) and Socionext, Inc. today announced their collaboration to expand Socionext's use of Synopsys' broad DesignWare® IP to include Synopsys' HBM2E IP for maximum memory throughput in AI and high-performance computing (HPC) applications.

• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip
• Secure-IC And Menta Co-Develop Solution To Optimize Embedded Cybersecurity
• SEGGER introduces new Open Flashloader for direct programming of any RISC-V system

Headlines for Monday Jan. 11, 2021

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Wi-Fi Alliance Wi-Fi predictions for 2021

Wi-Fi® played a critical role in providing digital infrastructure to support increased connectivity demands during the global pandemic.

• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras
• ESD Alliance Reports Strong Electronic Design Automation Industry Revenue Growth for Q3 2020
• Flex Logix Appoints Dana McCarty as Vice President of Sales and Marketing for AI Inference Products
• DSP Concepts and Cambridge Consultants work to accelerate audio and voice innovation
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core

Headlines for Friday Jan. 08, 2021

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Achronix to List on Nasdaq Through Merger with ACE Convergence

Achronix Semiconductor Corporation, a leader in high-performance field-programmable gate arrays (FPGAs) and embedded FPGA (eFPGA) IP, and ACE Convergence Acquisition Corp. (ACE) (Nasdaq: ACEV), a special-purpose acquisition company, today announced that they have entered into a definitive agreement for a business combination that would result in the combined entity continuing as a publicly listed company.

• UMC Reports Sales for December 2020
• TSMC December 2020 Revenue Report

Headlines for Thursday Jan. 07, 2021

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Andes Technology Provides RISC-V CPU Core to SK Telecom

Andes Technology Corp. today announced that its 64-bit AndesCore™ AX25 RISC-V processor has been adopted by SK Telecom (hereinafter referred to as “SKT”), Korea’s leading ICT company, for the development of artificial intelligence products.

• Kevin Steptoe Joins Palma Ceia SemiDesign as EVP Program Management
• DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor
• Jim Keller joins Tenstorrent as President and CTO.
• China Forecast to Fall Far Short of its "Made in China 2025" Goals for ICs
• IQ-Analog Antenna Processor ASIC Powers Lockheed Martin Phased Array Sensors
• Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps

Headlines for Wednesday Jan. 06, 2021

Top Story

Imagination, update on 2020 progress

Imagination Technologies today announces initial unaudited results for 2020, overall revenues increased by 44% to $125m (2019: $87m).

• Industry Veterans Cathal Phelan, John Kent, and Michael Reiha Join Silvaco Technical Advisory Board
• Achronix in talks to IPO
• CFX announces commercial availability of anti-fuse OTP technology on 90nm BCD process
• GUC Monthly Sales Report - Dec 2020
• More HDMI 2.1 Enabled Products Reach The Market Bringing Advanced Consumer Entertainment Features To a Wide Audience
• Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed
• Edgewater Announces New Funding and Organizational Changes

Headlines for Tuesday Jan. 05, 2021

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Arteris IP FlexNoC Interconnect and Resilience Package Licensed by MegaChips for Automotive Ethernet TSN Switch Chip

Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that MegaChips has licensed Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package for use as the on-chip communications backbone for an automotive Ethernet TSN switch chip.

• Global Smartphone Production Expected to Reach 1.36 Billion Units in 2021 as Huawei Drops Out of Top-Six Ranking, Says TrendForce
• CEVA and DARPA Establish Partnership for Technology Innovation
• EPS Global and Intrinsic-ID Announce Strategic Partnership

Headlines for Monday Jan. 04, 2021

Top Story

Wave Computing and MIPS Technologies Reach Agreement to Exit Bankruptcy

Company expects to exit bankruptcy in January 2021 pending creditor and court approval of Tallwood-led reorganization plan

• Global Semiconductor Sales Increase 7 Percent Year-to-Year in November
• Greek IP company Adveos bought by Shanghai-based Beken
• OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory