D&R Headline News (February 2021)

Headlines for Friday Feb. 26, 2021

Top Story

Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market

Alphawave IP, the world leader in multi-standard connectivity IP solutions, today announced that it has negotiated a $54M multi-year exclusive subscription reseller agreement with VeriSilicon for the China market.

Headlines for Thursday Feb. 25, 2021

• BrainChip Inc. and NaNose Medical Successfully Detect COVID-19 in Exhaled Breath with Fast High-Accuracy Results
• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
• Palma Ceia SemiDesign Announces Nicky Wilkinson as Director IC Engineering
• Rambus and AMD Extend Patent License Agreement
• MulticoreWare Inc. Becomes CEVA's Trusted Partner for Imaging & Computer Vision

Headlines for Wednesday Feb. 24, 2021

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Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions

Codasip announced today that Nanjing Tianyihexin Electronics, an innovative company focused on leading-edge solutions in multi-touch and gesture recognition technologies, has selected Codasip’s L30 (originally Bk3) RISC‑V‑based core for their TWS headset and intelligent wearable devices solutions.

• Synopsys Delivers Breakthrough Performance with New ZeBu Empower Emulation System for Hardware-Software Power Verification
• CEVA's MotionEngine Smart TV Software Comes to More Smart TV brands via LG webOS
• Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications
• RISC-V International Unveils Fast Track Architecture Extension Process and Ratifies ZiHintPause Extension
• Achronix Announces 2020 Financial Results and Business Highlights
• AccelerComm Unveils Fully Integrated PUSCH Decoder to Supercharge 5G NR for Performance-Critical Channels
• Xilinx Revolutionizes the Modern Data Center with Software-Defined, Hardware Accelerated Alveo SmartNICs
• North American Semiconductor Equipment Industry Posts January 2021 Billings, Topping $3 Billion for First Time
• Cadence Completes Acquisition of NUMECA

Headlines for Tuesday Feb. 23, 2021

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SiPearl and Open-Silicon Research Collaborate to Accelerate Custom Silicon for High Performance Computing (HPC) Applications

SiPearl, the company designing the high-performance, energy-efficient microprocessor for the European exascale supercomputer and Open-Silicon Research, the India based entity of OpenFive, a leading provider of custom silicon solutions with differentiated IP, today announced a multi-year joint collaboration to enable expansive development of innovative High Performance Computing (HPC) applications.

• Eureka Technology IP Core Supports NASA's MARS 2020 Perseverance Rover Mission
• Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP
• Tiempo Secure is a winner of the French Government's Great Cybersecurity Challenge to make smart objects more resilient to cyberattacks

Headlines for Monday Feb. 22, 2021

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CEVA Moves to Standardize DSP-enabled Bluetooth Audio IP with New Bluebud Wireless Audio Platform for TWS Earbuds, Smartwatches and Wearables

CEVA today unveiled Bluebud™, a highly-integrated wireless audio platform aimed at standardizing DSP-enabled Bluetooth audio IP for the fast-growing Bluetooth audio markets, including True Wireless Stereo (TWS) earbuds, hearables, wireless speakers, gaming headsets, smartwatches and other wearable devices.

• Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies
• CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%
• IAR Systems introduces 64-bit Arm core support in leading embedded development tools
• Imagination's GPU selected by StarFive to create high-performance, small and low-cost BeagleV RISC-V AI single board computer
• Chipus Joins FDXcelerator Program Bringing Ultra-Low-Power and Compact Power Management Solution for Hearables and Wearables
• Secure-IC and MosChip Announce Strategic Partnership to Provide Turnkey ASIC Solutions With Embedded Security for Edge Applications
• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor

Headlines for Friday Feb. 19, 2021

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Moschip Unveils Focused Strategy For Turn-Key ASIC Solutions

MosChip Technologies Limited, a semiconductor and system design services company, unveils today, focused strategy for turn-key ASIC solutions. MosChip has over a twenty-year track record in designing semiconductor IP, products, and SoCs for IoT, networking, industrial, and consumer applications.

• Sales of Logic ICs Account for Largest Share of China's IC Market in 2020
• aicas and SiFive Bridge Flexibility and Performance with RISC-V, JamaicaVM Integration
• Achronix and Logic Fruit Introduce IP Solutions for Test and Measurement Applications

Headlines for Thursday Feb. 18, 2021

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PLDA Announces a Unique CXL Verification IP Ecosystem, Delivering Robust Verification That Reduces Time-to-Design for CXL 2.0 Applications

PLDA, the industry leader in high-speed interconnect solutions, today announced their CXL™ Verification IP Ecosystem which includes IP from partners Truechip and Avery Design Systems, who are pioneering CXL design verification.

• Synopsys Posts Financial Results for First Quarter Fiscal Year 2021
• Proposed Arm Buyout: Huang on So Many Levels
• Micro Magic, Inc. Delivers Ultra Low Power 64-Bit RISC-V Core
• Mark Redford Named Vice President, Operations & Supply Chain for Palma Ceia SemiDesign - Former Arm Executive
• JEDEC Publishes DDR4 NVDIMM-P Bus Protocol Standard
• SPARK Microsystems Announces CDN$17.5 Million Financing

Headlines for Wednesday Feb. 17, 2021

Top Story

Arteris IP Adds a Record 28 New Licensees in 2020

Arteris IP today announced that the company added 28 new licensees for its Arteris® IP Ncore®, FlexNoC®, CodaCache®, AI Package, Resilience Package, and PIANO® Interconnect IP products in 2020.

• CEVA Appoints Jaclyn Liu to its Board of Directors; Bruce A. Mann Retires
• Veriest Solutions and CEVA develop functional safety verification methodology for automotive devices
• Renesas Develops Automotive SoC Functional Safety Technologies for CNN Accelerator Cores and ASIL D Control Combining World-Class Performance and Power Efficiency
• New Website Dedicated to Advancing PUF Security Technology

Headlines for Tuesday Feb. 16, 2021

Top Story

Objections grow to Nvidia-ARM deal

Qualcomm, Google and Microsoft have all raised objections in the US to the acquisition of ARM by Nvidia

• Imec Showcases World's First Sub-5mW, IEEE 802.15.4z Ultra-Wideband Transmitter Chip
• ISSCC Plenary: A Bright Foundry Future
• CEVA, Inc. Announces Fourth Quarter and Year End 2020 Financial Results
• Flex Logix EFLX eFPGA in design for GLOBALFOUNDRIES 22FDX
• CHIPS Alliance Welcomes Antmicro and VeriSilicon to the Platinum Membership Level

Headlines for Monday Feb. 15, 2021

Top Story

videantis passes milestone of enabling 10 million production vehicles

videantis, a leading supplier of processor IP for the automotive and other embedded markets, announces that cumulative shipments of production vehicles equipped with videantis processors have surpassed the 10 million unit mark.

• U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York
• 5GNR L1/L2/L3 Phy+SW Stack IP available for SoC & FPGA Ue & gNodeB development
• Silex Insight partners with Crypto Quantique to deliver end-to-end IoT security
• High Performance Computing Demand Puts Premium on Backend Engineering Expertise

Headlines for Friday Feb. 12, 2021

Top Story

Comcores sells wireless assets to Analog Devices

Comcores, a leading supplier of digital IP-cores and sub-systems for communication technology and interface solutions for ASICs and FPGAs, announces the sale of its wireless assets to Analog Devices, Inc. (ADI) a US-based company.

• The Arm ecosystem ships a record 6.7 billion Arm-based chips in a single quarter

Headlines for Thursday Feb. 11, 2021

Top Story

TSMC to Raise $9 Billion for Expansion Amid Shortages

Taiwan Semiconductor Manufacturing Co. (TSMC) said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon.

• Israeli AI Chip Startup Raises Seed Funding
• Fraunhofer IIS and intoPIX announce joint licensing program for JPEG XS
• Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices

Headlines for Wednesday Feb. 10, 2021

Top Story

Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%

The combined capacity of the top five companies represented 54% of total global wafer capacity in December 2020, up one point from 53% in 2019. For comparison, in the year 2009, the top 10 wafer capacity leaders held 54% of total global capacity and the top five leaders accounted for 36% of capacity.

• Arteris IP Adds Two Veteran Executives to its Board of Directors
• QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port
• Tiempo Secure announces the availability of its Secure Element IP core on GF 22 FDX and TSMC 16 FFC
• eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base Stations

Headlines for Tuesday Feb. 09, 2021

Top Story

Gartner Says Apple and Samsung Extended Their Lead as Top Semiconductor Customers in 2020

Apple remained the No. 1 semiconductor chip buyer in 2020, representing 11.9% of the total worldwide market, according to preliminary results from Gartner, Inc.

• TSMC Board of Directors Meeting Resolutions
• TSMC January 2021 Revenue Report
• Fraunhofer IPMS presents TSN IP core designs with low latency for automotive on-board networks
• Device Authority, EPS Global and Intrinsic ID Announce Strategic Partnership
• Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China
• CHIPS Alliance Brings on Rob Mains as New Executive Director
• Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum

Headlines for Monday Feb. 08, 2021

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Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions

Renesas and Dialog today announced they have reached an agreement on the terms of a recommended all-cash acquisition by Renesas of the entire issued and to be issued share capital of Dialog (the “Acquisition”) for EUR 67.50 per share, representing a total equity value of approximately EUR 4.9 billion (approximately 615.7 billion yen).

• Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
• GUC Monthly Sales Report - Jan 2021
• UMC Reports Sales for January 2021
• Rianta Releases 800G Optimized Single Channel Ethernet Controller IP Core
• DVB-S2X Narrowband Demodulator / Decoder IP Core licensed to a leading US TV Semiconductor Company
• Renesas to adopt Crypto Quantique's QuarkLink security platform as part of its microcontroller ecosystem for the IoT

Headlines for Friday Feb. 05, 2021

• Synopsys Selected for Rapid Assured Microelectronics Prototypes Program

Headlines for Thursday Feb. 04, 2021

Top Story

Arteris IP FlexNoC Interconnect and Resilience Package Supports Socionext's 5nm Automotive Chip Production

Arteris IP today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive SoC fabricated using 5nm semiconductor process technology.

• Xilinx Collaborates with Fujitsu to Support 5G Deployments in the US
• RISC-V Processor Designs Emerge
• Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications
• Can Open Source Hardware Emulate Linux?
• Open Source: It's Not Just for Software Anymore
• IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust
• Sondrel builds on 7nm design work to offer 5nm
• Pulsic Delivers Real-Time, Accurate, Layout Previews to Analog Circuits Designers with the new Animate Preview
• Crypto Quantique Opens IoT Security Platform to Multiple RoTs
• Total MPU Sales Surprise With Strong Gains in 2020, More Upside in 2021
• SMIC Reports 2020 Fourth Quarter Results
• SiTune Introduces World's First 5G Infrastructure Transceiver Solutions
• AWS and Arm Demonstrate Production-Scale Electronic Design Automation in the Cloud

Headlines for Wednesday Feb. 03, 2021

Top Story

SCALINX, Semiconductor Fabless Focusing on Signal Conversion Chips Secures 10.5 Million Euros Funding

SCALINX, a fabless semiconductor company specialized in advanced signal conversion chips, today announced it has secured global financing of 10.5 million euros.

• SmartDV 2020 Revenue Increases by 51%
• Xylon Announces Availability of Its 2.3 MP HDR Automotive Video Camera

Headlines for Tuesday Feb. 02, 2021

Top Story

Intrinsic ID Reports Strong Growth in 2020 for Its Semiconductor Security Solution as COVID Accelerates Shift to Online Working and Learning

Intrinsic ID today announced its 2020 business results and outlook for 2021, citing record revenue and customer growth. Year-over-year sales were up 36% percent, marking the highest annual revenue to date.

• 2020 Global Silicon Revenue Remains Stable as Wafer Area Shipments Edge Up Despite COVID-19 Disruption
• Rambus Reports Fourth Quarter and Fiscal Year 2020 Financial Results
• This is How Intel Gets Out of Manufacturing
• LeapMind Announces Participation in Alliance Program of Xilinx, a Major US FPGA Innovator

Headlines for Monday Feb. 01, 2021

Top Story

AnalogX Announces World's Lowest Power SERDES IP in 7nm and 6nm and Expansion Plan

AnalogX, the leading provider of multi-standard connectivity SerDes IP solutions, today announces the availability of its silicon-proven 7nm & 6nm SERDES. AnalogX is the market leader in low-power SERDES IP, serving the chiplet and chip-interconnect market with 16nm, 12nm, and now 7 nm & 6 nm technology nodes.

• Reports: NXP, Infineon top Samsung's shopping list
• PUFsecurity Crypto Co-processor PUFiot Passed NIST CAVP Certification
• Top-10 IC Growth Categories Target Emerging Applications in 2021
• Advanced DDR Memory Interface PHY's and Controllers IP Cores available in advanced process nodes including TSMC 7FFC
• Imagination and PaddlePaddle announce collaboration to grow the ecosystem for artificial intelligence (AI) for developers worldwide
• Siemens Digital Industries Software appoints new Senior Vice President and Managing Director for Asia Pacific region
• Global Semiconductor Sales Increase 6.5% to $439 billion in 2020
• Jieli joins TempowOS Chipset Partner Program
• Synapse Design and Flex Logix Tape Out Mutual Customer ASIC on a New Process in Less Than a Year Using Embedded FPGA (eFPGA) Technology