D&R Headline News (March 2021)
Headlines for Wednesday Mar. 31, 2021
Arm's solution to the future needs of AI, security and specialized computing is v9
Armv9 is the first new Arm architecture in a decade, building on the success of Armv8 which today drives the best performance-per-watt everywhere computing happens.- Codasip to Offer Secure Boot Solutions with Veridify Tools
- SiFive and DARPA collaborate to bring the power of RISC-V to Technology Innovation
Headlines for Tuesday Mar. 30, 2021
Intel 2.0
Thankfully, I am not in the shoes of Intel’s new CEO, Pat Gelsinger. He obviously relishes it, but very few are quite up to his new challenge.- Xylon's New Wireless Vehicle Router Enables Remotely Supervised Test Data Harvesting on Roads Around the World
- Magnachip Enters into Definitive Agreement with Wise Road Capital in a Take Private Transaction Valued at $1.4 Billion
Headlines for Monday Mar. 29, 2021
GUC Enlists AWS Partner proteanTecs to Increase ASIC Reliability and Quality at Scale
Global Unichip Corporation (GUC) helps system and semiconductor companies develop application-specific integrated circuits (ASICs), or microchips. Each generation of ASICs has a more complex design and uses more advanced semiconductor processes, making it harder to reach quality targets.Headlines for Friday Mar. 26, 2021
Siemens delivers next-generation, comprehensive hardware-assisted verification system
Siemens Digital Industries Software today unveiled its next-generation Veloce™ hardware-assisted verification system for the rapid verification of highly sophisticated, next-generation integrated circuit (IC) designs.- Intel Drops a Bomb, Not the Ball
- GUC and Ansys Expedite Advanced-IC Designs for Next-Generation Applications with State-of-the-Art Simulation Workflow
Headlines for Thursday Mar. 25, 2021
Revenue of Top 10 IC Design (Fabless) Companies for 2020 Undergoes 26.4% Increase YoY Due to High Demand for Notebooks and Networking Products, Says TrendForce
The emergence of the COVID-19 pandemic in 1H20 seemed at first poised to devastate the IC design industry. However, as WFH and distance education became the norm, TrendForce finds that the demand for notebook computers and networking products also spiked in response, in turn driving manufacturers to massively ramp up their procurement activities for components.- PLDA Joins ETP4HPC to share its expertise in High Speed Interconnect Solution IP with the European High Performance Computing Ecosystem
- Imagination launches IMG Labs to create breakthrough technologies
- North American Semiconductor Equipment Industry Posts February 2021 Billings, Surpassing $3 Billion for Second Consecutive Month
- Mitacs and OpenHW Group partner on $22.5M first-of-its-kind open-source research program
- Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership
Headlines for Wednesday Mar. 24, 2021
Achronix Adopts Movellus Maestro Clock Network for Its Speedster7t FPGAs
Movellus, Inc. today announced that Achronix, a leader in high-performance FPGAs and embedded FPGA (eFPGA) IP, has adopted Movellus' Maestro intelligent clocking solution for its Speedster®7t FPGAs.- Intel Surprises with $20B Expansion of Foundry Business
- Synopsys Collaborates with Keysight Technologies to Deliver Integrated Custom Design Flow for 5G Designs
- CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots
- WISeKey Partners with Cortus to Secure Automated Vehicles Capable of Controlling All Aspects of Driving Without Human Intervention
- Cadence Successfully Tapes Out Tensilica SoC on GLOBALFOUNDRIES 22FDX Platform Using Adaptive Body Bias Feature
- GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions
Headlines for Tuesday Mar. 23, 2021
Valtrix and Codasip Cooperate on Verification of RISC-V Systems
Valtrix Systems, the provider of design verification products for building functionally correct CPU and system-on-chip implementations, and Codasip, the leading supplier of customizable RISC-V® embedded processor IP, announced today that they are cooperating on the verification of RISC-V-based systems.Headlines for Monday Mar. 22, 2021
Flex Logix raises $55M to accelerate market adoption of AI inference and eFPGA solutions
Flex Logix Technologies, Inc., supplier of the fastest and most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, announced today the close of a $55 million oversubscribed Series D funding round.- Global Semiconductor Materials Market Sets New High With 5% Expansion in 2020, SEMI Reports
- Chip Makers Must Learn New Ways to Play "D"
- OpenPOWER Foundation Provides Microwatt for Fabrication on Skywater Open PDK Shuttle
Headlines for Thursday Mar. 18, 2021
SiFive and ArchiTek Enable Secure, Private, Flexible Edge AI Computing With AiOnIc Processor
SiFive and Osaka R&D venture ArchiTek Corporation today announced ArchiTek’s first in-house developed AI processor, AiOnIc®, featuring the ArchiTek Intelligence® Pixel Engine (aIPE), and SiFive E3-Series RISC-V processor Core IP.- Global Fab Equipment Spending Poised to Log Three Straight Years of Record Highs, SEMI Reports
- More than Chiplets | Facebook Enters the Fray
- Smart Lighting Platform "end to end" Management Solution licensed by leading European Lighting Company
- Siemens' Veloce Virtual Network App Certified for IxVerify 3.0
- Sondrel designs its first Radiation-Hard chip
Headlines for Wednesday Mar. 17, 2021
Synopsys Launches Industry's First Complete IP Solution for PCI Express 6.0
Synopsys, Inc. (Nasdaq: SNPS) today announced the industry's first complete IP solution for the PCI Express® (PCIe®) 6.0 technology that includes controller, PHY and verification IP, enabling early development of PCIe 6.0 system-on-chip (SoC) designs. Built on Synopsys' widely deployed and silicon-proven DesignWare® IP for PCIe 5.0, the new DesignWare IP for PCIe 6.0 supports the latest features in the standard specification including, 64 GT/s PAM-4 signaling, FLIT mode and L0p power state.- Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology
- Arasan announces its next generation of C-PHY/ D-PHY Combo IP Core compliant with the latest MIPI Specifications
- Panasonic Starts Licensing IP Core for Semiconductors Complying with the IEEE 1901-2020 International Standard
- Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis
Headlines for Tuesday Mar. 16, 2021
Qualcomm Completes Acquisition of NUVIA
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has completed its acquisition of the world-class CPU and technology design company, NUVIA for $1.4 billion before working capital and other adjustments.- Secure-IC Announces Partnership With U.S. DARPA To Foster Security Technology Innovation
- Ron Black Joins Codasip as Executive Chairman
- Socionext's latest generation of smart display controllers uses APIX3 technology from Inova Semiconductors
- Alphawave IP and EnSilica Announce Partnership for Expansion in the United Kingdom and Europe
- James Mitarotonda Joins Rambus Board of Directors
- Xilinx Expands into New Applications with Cost-Optimized UltraScale+ Portfolio for Ultra-Compact, High-Performance Edge Compute
- Lattice Partners with DARPA Toolbox Initiative to Accelerate Technology Innovation
- QuickLogic Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Programmable Logic
Headlines for Monday Mar. 15, 2021
NUVIA Selects Avery Design for Next Generation PCIe Verification
Avery Design Systems today announced NUVIA who is reimagining silicon in a new way, creating compute platforms that redefine performance for the modern data center, has deployed Avery PCIe Verification IP (VIP) for subsystem and SoC verification.- Rockley Selects Synopsys for Silicon Photonics Design Solutions
- A high-performance and optimized Video IP: Chips&Media at the Semiconductor360 Live 2021
Headlines for Friday Mar. 12, 2021
Cornami Partners with Inpher, Pioneer in Secret Computing, to Deliver Quantum-Secure Privacy-Preserving Computing on Encrypted Data
Cornami and Inpher announced today their partnership to collaborate on delivering commercially viable Fully Homomorphic Encryption (FHE) functionality to the market.Headlines for Thursday Mar. 11, 2021
Allegro DVT Releases New Versions of its Encoder and Decoder IPs with Support for 12-bit sample size and 4:4:4 Chroma Format
Allegro DVT, the leading provider of video processing silicon IPs, today announced the release of new versions of its D3x0 and E2x0 decoder and encoder IPs with extended of sample sizes up to 12-bit and chroma sampling ranging from 4:2:0, 4:2:2 up to 4:4:4.- Mixel, Rambus and Hardent Collaborate to Deliver State-of-the-Art Integrated MIPI Display Subsystem Solution
- OpenHW Group and Mitacs announce OpenHW Accelerate
- SiPearl passes a key milestone for Rhea's launch by moving into an accelerated simulation phase with Siemens' Veloce platform
- Vtool Appoints EmergeTek as Cogita Sales Representative
- Tortuga Logic Announces Expansion of Product Portfolio with Development of New Security Governance Platform
Headlines for Wednesday Mar. 10, 2021
Latest News- Eta Compute's Low Power AI Vision Board Accelerates Design, Test, and Deployment of Transformative Embedded Vision Solutions
- Compound Photonics Partners with GLOBALFOUNDRIES to Manufacture World's First Monolithic Microdisplay for Real-Time AR
- IC Insights Raises Its 2021 IC Market Forecast from 12% to 19% Growth
- 10 Millionth Achronix Speedcore eFPGA IP Core Shipped
- TSMC February 2021 Revenue Report
- QuickLogic, SparkFun and Crowd Supply Launch the SparkFun Thing Plus - QuickLogic EOS S3 Development Kit
- USB 4.0, USB 3.2, USB 3.1, USB 3.0, USB 2.0, Device, Hub, Host & Dual Mode proven Interface IP Controllers are available immediately to License
Headlines for Tuesday Mar. 09, 2021
Alphawave and PLDA Announce a Collaboration to Create Tightly-Integrated Controller and PHY IP Solutions for Interconnects Including PCIe 5.0, CXL and PCIe 6.0
Companies will Deliver high performance Interconnect Solutions optimized for latency and power and targeted at the Datacenter, AI and Automotive Industries- GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar
- Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC
- Codasip Announces Commercial Add-ons to SWeRV Core EH1
- EPI EPAC1.0 RISC-V core boots Linux on FPGA
- AMD and Xilinx Special Meetings of Stockholders to be Held on April 7, 2021
Headlines for Monday Mar. 08, 2021
Intel stung for $2bn in Waco judgment
VLSI Technology, which was bought by Philips Semiconductors (now NXP) in 1999 for $1 billion, has successfully sued Intel for patent infringement in a court in Waco, Texas and been awarded $2.18 billion damages.- Progress in Importation of US Equipment Dispels Doubts on SMIC's Capacity Expansion for Mature Nodes for Now, Says TrendForce
- Intel to Collaborate with Microsoft on DARPA Program
- UMC Reports Sales for February 2021
- GUC Monthly Sales Report - February 2021
- Weebit Nano continues ReRAM innovation: Files new patents optimising programming of ReRAM
- Automakers Will Go Fabless
Headlines for Thursday Mar. 04, 2021
Silex Insight unleashes their new video codec (Colibri), that will shape the future of AV over IP distribution over 1GbE
Silex Insight has developed a video codec with industry-leading quality, powerful features and incredible efficiency called Colibri. It is the smartest video codec Silex Insight has ever developed and the first one designed specifically for the AV over IP market with focus on graphical elements for distribution over 1GbE network.- IAR Systems announces availability of RISC-V development tools with certification for IEC 61508 and ISO 26262
- proteanTecs Joins the TSMC IP Alliance Program
- BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI
- Revenue per Wafer Climbs As Demand Surges for 5nm/7nm IC Processes
- GPU shipments soar once more in Q4
- Wanxiang Blockchain Forms RISC-V International Blockchain SIG with Ecosystem Partners
- Thalia successfully completes 20th 22nm analog IP reuse engagement
- Leopard Imaging Collaborates with Socionext, Hailo, and AWS to Launch EdgeTuring
- Airborne System Design Assurance: Aldec Adds 60+ New HDL Rules to ALINT-PRO's DO-254 Plug-In
Headlines for Wednesday Mar. 03, 2021
Achronix and Mobiveil Announce Partnership to Deliver High-Speed Controller IP and FPGA Engineering Services
Achronix and Mobiveil announced today a partnership to offer Mobiveil’s soft IP portfolio to designers targeting Achronix devices.Headlines for Tuesday Mar. 02, 2021
Wave Goodbye, Hello MIPS as Chapter 11 Resolved
Wave Computing said it has emerged from Chapter 11 and will continue business going forward as MIPS.Headlines for Monday Mar. 01, 2021
Arasan announces the immediate availability of its MIPI C-PHY / D-PHY Combo IP for SoC Designs on TSMC 22nm Process
Arasan Chip Systems today announced the immediate availability of its MIPI C-PHY / D-PHY Combo IP supporting speeds of up to 2.5 Gbps for SoC designs on TSMC 22nm process- AMD, TSMC & Imec Show Their Chiplet Playbooks at ISSCC
- Verisilicon High-Performance and High-Quality AI Video Processor Powers Leading Datacenters
- Introducing Dolphin Design's new Audio CODEC for TWS devices with ANC capabilities
- Velodyne Lidar Licenses TSN IP Core from CAST
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative
- Metrics Announces an EDA as a Service Partnership Program with Semiconductor Intellectual Property Vendors
- Imperas Donates Latest RV32/64K Crypto (scalar) Architectural Validation Test Suites to the RISC-V Verification Ecosystem