D&R Headline News (May 2021)

Headlines for Monday May. 31, 2021

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Dolphin Design joins Arm Approved Design Partner Program

Dolphin Design, a leading provider of semiconductor IP and design platforms, with full turnkey SoC services, announce that they have been selected to join the Arm® Approved Design Partner program.

• Quarterly Revenue of Top 10 Foundries Breaks Records in 1Q21 Owing to Price Hikes Caused by Tight Foundry Capacities, Says TrendForce
• Arm Upgrades Its Entire PC And Mobile Portfolio
• Join Innosilicon at TSMC 2021 Online Technology Symposium
• SEGGER's emRun Runtime Library Licensed by SiFive for Superior Code Size and Performance Improvements
• Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

Headlines for Thursday May. 27, 2021

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Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC's N3 Process Technology

Synopsys, Inc. (Nasdaq: SNPS) today announced the availability of its DesignWare® process, voltage and temperature (PVT) monitoring and sensing subsystem IP on TSMC's industry-leading N3 process technology.

• Mirabilis Design and E-Elements Technology team up to provide concept-to-implementation design flow for AI applications
• Silex Insight launches high performance (2Tbps) SM4-GCM Multi-booster
• DCD-SEMI accelerates AES security with the latest IP Core
• USB Promoter Group Announces USB Power Delivery Specification Revision 3.1
• Siemens launches PCI Express 6.0 Questa Verification IP solution
• Precise-ITC launches 10G-1.6T Ethernet/FiberChannel/FlexO IP Core
• AImotive launches aiWare4, featuring advanced wavefront processing, upgraded safety and low-power features
• Arm battens down the spending hatches
• Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS

Headlines for Wednesday May. 26, 2021

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5G Ethernet Subsystem to reduce development time is now available

Comcores ApS, a fast-growing specialized supplier of Intellectual Property (IP) Cores, today announced the availability of Ethernet Subsystem solution, a silicon agnostic and easy-to-use integration of 10G/25G Ethernet MAC and PCS for Time-Aware Applications.

• Imperas Simulation Reference Models selected by IAR Systems for Arm 64bit
• Synopsys Digital and Custom Design Platforms Certified for TSMC's Latest 3nm Process Technology
• eYs3D Microelectronics, Co. Raises $7 Million Series A from Leading Industry Strategic Investors for Vision/AI Chips
• Hardent Joins Samsung SAFE IP Partner Program & Launches New Display IP Subsystem Solution in Collaboration with Rambus
• Oracle adds Arm Neoverse-based cloud instances with OCI Ampere A1
• proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan
• Siemens expands Simcenter with AI-driven generative engineering for systems architectures
• Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices
• Cadence Collaboration with Arm Enables Customers to Successfully Tape out Next-Generation Arm Mobile Designs

Headlines for Tuesday May. 25, 2021

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Arm Total Compute solutions bring performance, security and Armv9 to the broadest range of Client devices

Over the past 12 months digital experiences have never been more important, with our personal devices connecting us to family and friends, our home devices helping us stay entertained, and business devices giving us the opportunity to work anywhere, any time.

• Global 200mm Fab Capacity on Pace to Record Growth to Meet Surging Demand and Address Chip Shortage, SEMI Reports
• Synopsys Enables First-Pass Silicon Success for Early Adopters of Next-Generation Armv9 Architecture-based SoCs
• Top-15 Semi Companies Log Year-Over-Year Growth of 21% in 1Q21
• PLDA Announces XpressRICH PCI Express 6.0 Controller IP for Next Generation SoC Designs
• Avery Design Launches PCI Express 6.0 Verification IP to Enable Early Development, Compliance Checking for New Version of Standard

Headlines for Monday May. 24, 2021

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Logic Fruit Technologies Launches ARINC 818 RTL IP Core for Avionics applications

Logic Fruit Technologies Pvt. Ltd, leading provider of IPs, Embedded Solutions, and product engineering services today announced the release of ARINC 818 IP Core.

• U.S. Chip Makers Embrace Collaboration
• RISC-V Functional Safety Processor IP Core Introduced by CAST and Fraunhofer IPMS
• GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric Advanced Packaging Technology
• Arm partners are shipping more than 900 Arm-based chips per second based on latest results
• Siemens receives three Samsung Foundry SAFE EDA awards
• JVCKENWOOD Deploys Cadence Spectre FX Simulator and Comprehensive Design Flows to Improve Productivity
• Cadence Introduces the Spectre FX FastSPICE Simulator Delivering up to 3X Performance Gains with Superior Accuracy
• Cadence Accelerates Cloud Hyperscale Infrastructure with Third-Generation 112G-LR SerDes IP on TSMC's N5 Process
• Cadence Announces New Low-Power IP for PCI Express 5.0 Specification on TSMC N5 Process

Headlines for Thursday May. 20, 2021

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Avery Design Systems and Rambus Extend Memory Model and PCIe VIP Collaboration

Avery Design Systems, a leader in functional verification solutions, and Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, announced today they are extending their long-term memory model and PCIe® Verification IP (VIP) collaboration.

• Intrinsic ID Wins InfoSec Award for ‘Next Gen in Embedded Security' - Announced at RSA Conference by Cyber Defense Magazine
• Memory Upswing Returns, New Record High Expected in 2022
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2021
• SEMIFIVE collaborates with Arm to accelerate its custom SoC designs
• Sony Senior VP & Playstation LSI Leader, Takayasu Muto Joins Secure-IC's Strategic Committee
• Credo Announces 3.2Tbps XSR-Enabled High-Speed Connectivity Chiplet with 112Gbps Lane Rates
• Chips&Media Making its Presence at the 2021 Embedded Vision Summit as an Exhibitor
• Lattice Propel Design Environment Supports New RISC-V Processor and IP Cores
• Efabless Launches chipIgnite with SkyWater to Bring Chip Creation to the Masses
• LeapMind's "Efficiera" Ultra-low Power AI Inference Accelerator IP Was Verified RTL Design for ASIC/ASSP Conversion
• Silvaco Announces Appointment of Industry Veteran Ernest E. Maddock to Board of Directors

Headlines for Wednesday May. 19, 2021

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Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics

To provide high-performance, low-power graphics, Ambiq’s newest Apollo4 SoC family now incorporates Think Silicon’s NEMA®|pico GPU and NEMA®|dc display controller IP. The Apollo4 SoC family is the fourth-generation processor solution built upon Ambiq’s proprietary Subthreshold Power-Optimized Technology (SPOT™) platform.

• Raytheon Technologies and GLOBALFOUNDRIES Partner to Accelerate 5G Wireless Connectivity
• Unisantis unveils Dynamic Flash Memory as DRAM alternative
• Shift from 8'' Wafer Fabs to 12'' Could Ease IC Shortages

Headlines for Tuesday May. 18, 2021

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Intrinsic ID's SRAM PUF Deployed by Avnet ASIC Solutions to Secure Advanced SoCs

Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) security IP for embedded systems, today announced that Avnet ASIC Solutions (Avnet) has licensed QuiddiKey® to create a strong root-of-trust to secure System on Chip (SoC) for its customers.

• Thalia's AMALIA Technology Analyzer de-risks Analog IP reuse for major IP houses and IC manufacturers
• MoSys Announces Optimized P4 Pipeline Support for Stellar Packet Classification Platform IP for FPGAs
• Aphawave shares remain below offer price
• Siemens accelerates digital marketplace strategy with acquisition of Supplyframe
• Riviera-PRO Enables VHDL-2019 Users to Unleash the Power of the Language's New Additions

Headlines for Monday May. 17, 2021

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Agile Analog closes new funding round to go global with revolutionary analog IP technology

Agile Analog, a supplier of highly configurable process node agnostic analog IP building blocks, today announced that it closed a US$19m funding round led by OMERS Ventures

• South Korea plans US$450 billion semiconductor spend
• AI Startups Plateau, AI SoCs Soar, and the Edge Diverges
• GOWIN Releases USB 2.0 PHY and Device Controller IP for Their FPGA Products
• Vidatronic Appoints Jiangsu JITRI Intelligent Integrated Circuit Design as Its Representative for China
• Xpeedic On-Chip Passive EM Simulation Suite Certified for Samsung Foundry 8LPP Process Technology
• SMIC Reports 2021 First Quarter Results

Headlines for Thursday May. 13, 2021

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Faraday Announces 16G Programmable SerDes in UMC 28HPC+

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its 16G Programmable SerDes is now available in the UMC 28nm HPC+ process.

• Synopsys Extends Verification Hardware Market Leadership with Breakthrough Emulation Performance
• New Fab Plans: the Plot Thickens
• Siemens expands industry-leading IC verification portfolio with acquisition of Fractal Technologies
• Bluespec, Inc. Joins the Xilinx Partner Program, Offering Drop-in Ready RISC-V Processors for Xilinx FPGAs

Headlines for Wednesday May. 12, 2021

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Imagination announces major updates to PowerVR SDK and Toolkit, including ray tracing code examples.

Imagination Technologies today releases Version 21.1 of the popular PowerVR SDK and Toolkit, adding new features and ray tracing support enhancements to increase functionality and enhance the workflow of developers, technical artists, and engineers across a variety of disciplines.

• Real Intent Expands ISO 26262 Functional Safety Compliance for Static Sign-Off Products
• MIPI CSI 3, DSI 2 Tx & Rx Advanced Controller & PHY IP Cores available in major Fabs & Nodes for SOC Designs for Imaging and Display Applications
• Vastai Technologies Closes US$75 Million Series A+ Financing

Headlines for Tuesday May. 11, 2021

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Silex Insight extends their AES-GCM Crypto Engine offering by introducing an ultra-low latency version for PCI Express 5.0 and Compute Express Link 2.0

Silex Insight, a leading provider for flexible security IP cores, announces today a complete family (3 variants) of their NIST-compliant AES-GCM crypto engines by adding an ultra-low latency version to their portfolio to serve high-performance computing (HPC) SoCs using the PCI Express® (PCIe®) 5.0 architecture or Compute Express Link™ (CXL™) 2.0 interface.

• Mythic Raises $70 Million in Series C Funding Led by BlackRock and Hewlett Packard Enterprise
• Dialog Semiconductor Selected as SiFive Preferred Power Management Partner for RISC-V Development Platforms
• BrainChip Demonstrates Akida Neuromorphic Processor as Part of Data Science Week

Headlines for Monday May. 10, 2021

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CEVA to Acquire Intrinsix Corp, Expanding its Offering to Include Full Turnkey IP Platforms

CEVA today announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments.

• Synopsys ZeBu Server 4 Adopted by Xsight Labs for Intelligent Networking Switch Processor
• OpenPOWER Foundation announces LibreBMC, a POWER-based, fully open-source BMC
• TSMC April 2021 Revenue Report
• CEVA, Inc. Announces First Quarter 2021 Financial Results
• Sondrel's latest reference IP platform enables ultra-powerful signal and data processing SoCs to be created faster for lower costs
• IBM Unveils World's First 2 nm Chip
• NeuReality unveils novel AI-centric platform to empower the growth of real-life AI applications
• AEDVICES Consulting set up a new organization to boost its growth

Headlines for Thursday May. 06, 2021

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CEVA's Bluetooth Dual Mode 5.2 Platform Achieves SIG Qualification, Expedites IC Design for TWS Earbuds and More

CEVA, Inc. , the leading licensor of wireless connectivity and smart sensing technologies, today announced that its RivieraWaves Bluetooth® Dual Mode 5.2 Platform has achieved Bluetooth SIG Qualification. S

• Arm v9, the Next 10 Years
• CCSDS 231.0-B-3 LDPC Encoder and Decoder IP Core from Creonic Now Available
• UMC Reports Sales for April 2021

Headlines for Wednesday May. 05, 2021

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Synopsys Completes Acquisition of MorethanIP

Synopsys, Inc. today announced it has completed its acquisition of MorethanIP, a provider of Ethernet Digital Controller IP supporting data rates from 10G to 800G.

• OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor
• PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer
• Synopsys Delivers Enhanced Memory Design Productivity to Nanya Technology
• GUC Monthly Sales Report - Apr 2021
• Xilinx Reports Fiscal Fourth Quarter and Fiscal Year 2021 Results
• Lattice Semiconductor Reports First Quarter 2021 Results
• Achronix Announces First Quarter 2021 Financial Results and Business Highlights
• Karen Rogge Joins Rambus Board of Directors

Headlines for Tuesday May. 04, 2021

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Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip

Movellus, Inc. today announced that Esperanto Technologies has adopted Movellus’ Maestro AI intelligent clocking solution for its ET-SoC-1 chips.

• Rambus Reports First Quarter 2021 Financial Results
• MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams
• SmartDV Unveils Automation Tool Suite for Use with Its Extensive Verification IP Portfolio
• Samsung Expected to Recapture #1 Semi Supplier Ranking in 2Q21
• Pixilica Signs Development Agreement with SiliconArts for RayCore GPU Core
• Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards
• Synopsys to Showcase New Application Security Orchestration Solution at RSA Conference

Headlines for Monday May. 03, 2021

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Flex Logix And The Air Force Research Laboratory Sign A Broad License To Use EFLX Embedded FPGA IP In GLOBALFOUNDRIES' 12LP And 12LP+ Processes

Flex Logix® Technologies announced today that it has signed a broad license with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) to use Flex Logix's EFLX® eFPGA IP in GLOBALFOUNDRIES 12 nm process in any US Government program and activity.

• Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
• FPGAs in the Storm
• BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to "any MCU/SoC"
• Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
• PathPartner Joins BlackBerry QNX Channel Partner Program to Deliver Safety-Critical and Secure Software Solutions for Automotive Industry
• Faraday Reports First Quarter 2021 Revenues at NT$1,535 Million