D&R Headline News (July 2021)

Headlines for Friday Jul. 30, 2021

• Efabless & OpenROAD Advance Commercial Open Source Chip Design

Headlines for Thursday Jul. 29, 2021

Top Story

SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications

SmartDV™ Technologies, the leader in Design and Verification Intellectual Property (IP), today announced the greatest number of commercially available Design and Verification IP solutions to support the MIPI protocol standards for mobile and other critical applications.

• Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports
• IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
• Ampere to Acquire OnSpecta to Accelerate AI Inference on Cloud-Native Applications
• Optima Design Automation Announces TUV Certification of its Entire Safety Platform for ISO 26262 ASIL-D Functional Safety Verification

Headlines for Wednesday Jul. 28, 2021

Top Story

PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification

For the trillions of connected devices worldwide, FIDO Alliance proposed a specification agreement in April of this year—FIDO Device Onboard (FDO), which defines how IoT devices are connected to the cloud simply and securely.

• JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
• Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D

Headlines for Tuesday Jul. 27, 2021

Top Story

CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems

Avery Design Systems and CAST announced today they have expanded their partnership to offer joint solutions supporting the design and verification of automotive SoCs that utilize the emerging CAN XL and TSN Ethernet 1/10G networking and control protocols.

• TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale
• Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time
• Blaize, leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth
• IoT Pioneer Wiliot Secures $200 Million Investment Round Led by SoftBank Vision Fund 2

Headlines for Monday Jul. 26, 2021

• Bankrupt Tsinghua Unigroup advertises for investors
• TSMC considers German fab
• TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
• DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing

Headlines for Friday Jul. 23, 2021

• Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results

Headlines for Thursday Jul. 22, 2021

Top Story

CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth 5.3 IP

CEVA today announced the general release of its RivieraWaves Bluetooth 5.3 IP. Supporting a multitude of features to further enhance security, robustness and low power operation, the RivieraWaves Bluetooth 5.3 IP is now available as a complete hardware/software solution for new designs and as a software-only upgrade for compatible existing designs.

• DVB-S2X Wideband Demodulator IP Core from Creonic Now Available with Time-Slicing Support (Annex M)
• Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
• Kameleon Security Adds Investment from Xilinx to Deliver Hardware Cybersecurity for Servers
• Agile Analog brings analog IP to RISC-V International
• European Commission forms processor, semiconductor alliance
• Is TSMC-Sony A Sign Of Things To Come?
• NovaSparks Unveil the First FPGA Market Data Aggregator
• Moschip Continues to Soar Consecutively for the 6th Quarter
• Achronix Announces Record Second Quarter 2021 Financial Results and Business Highlights

Headlines for Wednesday Jul. 21, 2021

Top Story

Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product

Attopsemi™ Technology, innovator of the revolutionary I-fuse™ OTP IP, together with ABLIC Inc., the IC vendor of best analog semiconductor solutions, have a successful collaboration. The companies jointly announced that I-fuse™ OTP IP is now qualified on a Japanese Wafer Fab’s 130nm BCD process, and embedded into ABLIC’s IC Products.

Headlines for Tuesday Jul. 20, 2021

Top Story

CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing

CAES, a leader in advanced mission-critical electronics for aerospace and defense, announced today that it has been awarded a contract from Vinnova, a Swedish government agency dedicated to promoting innovation, to develop next generation RISC-V based space computing capabilities.

• CrossBar Announces ReRAM Based PUF Keys
• GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
• GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

Headlines for Monday Jul. 19, 2021

Top Story

Dolphin Design and CEA-List join forces for a new embedded AI computing platform

Dolphin Design and CEA-List have formed a new joint R&D lab of embedded systems. Their goal is to achieve the best tradeoff for Edge AI devices between SW flexibility, energy efficiency, and peak performance. Specifically, CEA-List's PNeuro® hardware accelerator integrates AI into the computing platform developed in the joint lab, and is combined with the processing platform developed by Dolphin Design.

• Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
• CXL Product Pipeline Gets Flowing
• TSMC in "Due Diligence" on Possible Japan Fab
• Chip Shortages May Persist Until 2023, Analysts Say
• Intel in talks to buy Globalfoundries
• Secure-IC establishes new references to secure the Internet of Things
• Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application
• Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites

Headlines for Thursday Jul. 15, 2021

Top Story

Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks

Innatera, the Dutch startup making neuromorphic AI accelerators for spiking neural networks, has produced its first chips, gauged their performance, and revealed details of their architecture.

• Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports
• TSMC Reports Second Quarter EPS of NT$5.18
• Realtek selects Imagination GPU for use in DTV
• Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer.
• Xenergic Raises 40 MSEK In New Share Issue
• Weebit completes design and tape-out of embedded ReRAM module
• Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
• Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud
• Is analog IC fab renaissance in the works?
• Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release

Headlines for Wednesday Jul. 14, 2021

Top Story

Neuromorphic processor leader Innatera appoints Prof. Alberto Sangiovanni-Vincentelli Chairman of Board

Innatera, the pioneering Dutch neuromorphic processor company, announced the appointment of Prof. Alberto L. Sangiovanni-Vincentelli as Chairman of its Board of Directors.

Headlines for Tuesday Jul. 13, 2021

Top Story

Achronix and ACE Convergence Acquisition Corp Mutually Agree to Terminate Merger Agreement

Achronix Semiconductor and ACE Convergence Acquisition Corp. (ACE) (Nasdaq: ACEV), a special-purpose acquisition company focused on the Industrial and Information Technology sectors, today announced that both companies have mutually agreed to terminate their merger agreement, effective immediately.

• IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications
• Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
• IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs
• TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards

Headlines for Monday Jul. 12, 2021

Top Story

Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension

Imperas simulation technology and RISC-V reference models updated to cover the RISC-V P Extension for SoC architecture exploration and early software development

• Flexible fab could slash chip shortage
• "Insolvent" Tsinghua Unigroup Aims to Restructure
• Algolux Closes $18.4 Million Series B Round for Robust Computer Vision

Headlines for Friday Jul. 09, 2021

Top Story

Pim Tuyls: IoT Security, Technology Scaling, and Quantum Threats

We caught up with CEO and a founder of Intrinsic ID, Pim Tuyls, to understand more about the world of PUF security, the challenges for IoT security as technology scales, and how to deal with the potential impact of other threats including quantum computing.

• TSMC June 2021 Revenue Report
• Fraunhofer IPMS RISC-V processor core for functional safety supported by development tools from IAR Systems

Headlines for Thursday Jul. 08, 2021

Top Story

Faraday Succeeds in 5G NR mmWave ASIC

Faraday Technology today announced that it has successfully delivered 5G NR mmWave ASIC projects for small cell baseband/IF and RRU (Remote Radio Unit).

• PUFsecurity Provides Free Access to its Root of Trust and Security Co-Processor Solutions
• Liverpool 5G Create and Blu Wireless develop industry-boosting IP
• Secure-IC receives the Cybersecurity Made in Europe label

Headlines for Wednesday Jul. 07, 2021

Top Story

Corigine Delivers a Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development

Corigine today announced production availability of its MimicPro prototyping systems based on Xilinx UltraScale FPGAs.

• Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance - 2U Accelerator box with Linux iWARP/RoCE
• 14nm FinFET production USB3.0/PCIe3.0/SATA3.0/SGMII Combo PHY IP Core, available for immediate licencing.

Headlines for Tuesday Jul. 06, 2021

Top Story

Rambus Completes Acquisition of AnalogX

Rambus, a provider of industry-leading chips and silicon IP making data faster and safer, today announced the completion of the acquisition of AnalogX. With this acquisition, Rambus augments its family of PCIe 5.0 and 32G Multi-protocol PHYs with SerDes technology specifically built for ultra-low power and very low latency.

• Global Semiconductor Sales in May Up 26.2% Year-to-Year, 4.1% Month-to-Month
• Think Silicon and the Aristotle University of Thessaloniki Create a Research Team to Solve Engineering Challenges of Next-Generation Graphics and AI Processors
• WiLAN Subsidiaries Sign License Agreement with PSMC

Headlines for Monday Jul. 05, 2021

Top Story

Sondrel's SFA 100 IP platform for intelligence gathering chips at the Edge

Designed to be the solution for an AI compute device right at the Edge, Sondrel’s new SFA 100 IP reference platform makes creating high-performance, battery-powered IoT devices easy and fast. The design has an onboard Arm® CPU to locally process data gathered from its associated sensors for onward transmission via wire or wireless connection for further analysis.

• Apple and Intel first to use TSMC 3nm
• GUC Monthly Sales Report - June 2021
• Andes Technology Announces Over 2 Billion Shipments Of Andes-Embedded SoCs In 2020
• UMC Reports Sales for June 2021

Headlines for Thursday Jul. 01, 2021

Top Story

Allegro DVT Launches the World's First Hardware-Based VVC/H.266 Decoder Silicon IP

Allegro DVT, the leading provider of video processing silicon IPs, today announced the immediate availability of its AL-D320 video decoder semiconductor IP core supporting the latest Versatile Video Coding (VVC/H.266) format.

• Plans start for TSMC 2nm fab
• NVMe Gets Refactored
• BSC, Codeplay and SiFive help accelerate applications on RISC-V thanks to V-extension support in LLVM
• IPrium releases 32-channel J.83B Modulator
• PathPartner Collaborates with Intel to Deliver AI-based Weld Defect Detection to the Manufacturing Industry
• Access Advance Launches VVC/H.266 Video Patent Pool
• Wi-Fi Alliance furthers Automated Frequency Coordination specification and compliance development to accelerate Wi-Fi 6E