D&R Headline News (August 2021)

Headlines for Tuesday Aug. 31, 2021

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GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2.0) Total Solution

Global Unichip Corp. (GUC) disclosed today that its 2nd generation GLink 2.0 (GUC multi-die interLink) interface, using TSMC 5nm process and TSMC advanced packaging technology for multi-die integration in AI, HPC and Networking applications, has passed full silicon qualification.

• Haawking licenses SEGGER's emRun for RISC-V
• Foundry Revenue for 2Q21 Reaches Historical High Once Again with 6% QoQ Growth Thanks to Increased ASP and Persistent Demand, Says TrendForce
• Rambus Demonstrates Industry-first PCIe 5.0 Digital Controller IP for FPGAs
• Renesas Completes Acquisition of Dialog Semiconductor
• Synaptics to Acquire DSP Group, Expanding Leadership in Low Power AI Technology

Headlines for Monday Aug. 30, 2021

• Microprocessor Sales Will Continue Double-Digit Growth in 2021

Headlines for Friday Aug. 27, 2021

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Can AI Design a Better Chip Than a Human?

Is entirely autonomous chip design possible? Can AI behave as an “artificial architect,” designing and optimizing entire chips?

• Xenergic joins GlobalFoundries FDX Network

Headlines for Thursday Aug. 26, 2021

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JEDEC Publishes XFM Embedded and Removable Memory Device Standard to Expand Storage Solutions in Embedded and Automotive Applications

EDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD233: XFM Embedded and Removable Memory Device (XFMD) standard. XFMD (XFM stands for Crossover Flash Memory) is a new universal data storage media providing an NVMe® over PCI Express® interface in a small, thin form factor.

• Synopsys Initiates $175 Million Accelerated Share Repurchase Agreement
• North American Semiconductor Equipment Industry Posts July 2021 Billings
• Espressif Systems Announces an IEEE 802.15.4 + Bluetooth 5 (LE) RISC-V SoC
• Cerebras Systems Announces World's First Brain-Scale Artificial Intelligence Solution
• Lattice Certus-NX FPGAs Optimized for Automotive Applications
• Rambus Preps for HBM3
• UK Regulator Says Nvidia-Arm Deal Could Stifle Innovation

Headlines for Wednesday Aug. 25, 2021

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CAES to Enable Critical Infrastructure for Next Generation Lunar Landers

CAES was selected by Astrobotic, a space robotics company, to supply flight control processors and critical infrastructure microelectronics for the Peregrine and Griffin lunar landers that will study the surface of the Moon.

• Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference
• Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem
• Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip

Headlines for Tuesday Aug. 24, 2021

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Imagination, update on 2021 progress

Imagination Technologies today announces initial unaudited results for the first half of 2021 (H1/2021), where overall revenues increased by 55% to $76m (H1/2020: $49m).

• Synopsys Enables First-Pass Silicon Success for Achronix's New FPGA for Data and AI Acceleration Applications
• eTopus Selects Diakopto's ParagonX Platform for Ultra-High Speed SerDes IP
• Engineering recruitment stepped up by surge in demand for ultra-low power memory solutions
• PragmatIC Semiconductor re-invents the iconic processor that changed the world

Headlines for Monday Aug. 23, 2021

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Nvidia-Arm merger would substantially lessen competition says U.K. government report

An Arm-Nvidia merger would involve a Substantial Lessening Of Competition (SLC) concludes the Competition and Markets Authority (CMA) in its Phase One review of the proposed merger for the Department Of Culture Media and Sport (DCMS).

• BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space
• ARM Nvidia deal goes to full investigation in the UK

Headlines for Friday Aug. 20, 2021

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Samsung Passes Intel to Become World's Largest Semi Supplier in 2Q21

Driven by surging demand and rising prices for DRAM and flash memory, Samsung, the world’s largest memory supplier, saw its total semiconductor sales increase 19% in 2Q21 to $20.3 billion, moving it past Intel and into first place to become the world’s largest semiconductor supplier for 2Q21.

Headlines for Thursday Aug. 19, 2021

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Andes Technology and Cyberon Collaborate to Provide Edge-Computing Voice Recognition Solution on DSP-capable RISC-V Processors

Cyberon and Andes Technology announced their collaboration on the edge-computing voice recognition solution, Cyberon DSpotter, by exploring Andes DSP-capable RISC-V CPU cores such as the popular D25F and comprehensive software development environment to provide a cost-effective, high performance, and easy-to-deploy solution.

• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2021
• Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation

Headlines for Wednesday Aug. 18, 2021

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Rambus Completes Acquisition of PLDA

Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the completion of the acquisition of PLDA.

• Arasan Chip Systems announces its 2'nd Generation Sureboot QSPI IP
• Hirose and eTopus Technology Develop Combined 112Gbps Interconnect Solution for AI Training Applications

Headlines for Tuesday Aug. 17, 2021

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Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem

Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the Rambus HBM3-ready memory interface subsystem consisting of a fully-integrated PHY and digital controller.

• BrainChip Receives Akida Chips from Socionext America
• CSEM and USJC team up to develop an ultra-low-power chip
• Major Update to MIPI DSI-2 Specification Enables Advancements in Mobile Displays
• Xpeedic EDA Cloud Platform on Microsoft Azure

Headlines for Monday Aug. 16, 2021

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Renesas and Dialog Semiconductor Announce Conclusion of Final Regulatory Review and the Expected Closing Date for Renesas' Proposed Acquisition of Dialog Semiconductor

Renesas Electronics and Dialog Semiconductor are pleased to announce that the Taiwan Fair Trade Commission has waived its jurisdiction to review the recommended all-cash acquisition of Dialog Semiconductor by Renesas.

• CrossBar Aims to Secure Computing with ReRAM
• The Worldwide Semiconductor Market is expected to show an outstanding growth-rate of 25.1 percent in 2021
• Motivo, Inc. Raises $12 Million Series A to Accelerate AI-Enabled Chip Design and Improve Manufacturing Yields
• Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development
• Palma Ceia SemiDesign Named to EE Times "Silicon 100 Startups Worth Watching In 2021"

Headlines for Thursday Aug. 12, 2021

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Facebook Open Sources Time Appliance For Data Center Networks

Facebook engineers have built a time appliance for network synchronization and open-sourced the entire specification, which should drive the price of the function down significantly.

• Precise-ITC FlexO/OTUw IP Core - Optimized Optical Networks
• Data Movement Depends on PCIe
• Automotive MCU Sales to Surge 23% in 2021 Despite Shortages
• Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
• Avnu Alliance Announces Silicon Validation Task Group

Headlines for Tuesday Aug. 10, 2021

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Mythic Licenses Codasip's L30 RISC-V Core for Next-Generation AI Processor

Codasip announced today that Mythic, the pioneering AI processor company with breakthrough analog compute-in-memory technology, has selected Codasip’s L30 (originally Bk3) RISC-V-based core for Mythic’s next generation Analog Matrix Processor (Mythic AMP™).

• Mixel Achieves ISO 26262 for Automotive Functional Safety and ISO 9001 Certification for IP Quality Management System
• Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables
• TSMC Board of Directors Meeting Resolutions
• TSMC July 2021 Revenue Report
• Faraday Accelerates Software Development for IIoT ASIC with SoReal! 2.0 Virtual Platform
• Sondrel creates unique modelling flow software to cut ASIC modelling time from months to a few days
• SiliconArts releases Ray Tracing IP Core to Intel Solutions Marketplace, open source ray tracing APIs on Github

Headlines for Monday Aug. 09, 2021

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Chips&Media Announces 1 billion Cumulative Shipments of Multimedia IP

Chips & Media, a semiconductor hardware intellectual property (IP) provider targeting multimedia, today reported its remarkable record of 1 billion cumulative shipments containing its multimedia IPs.

• CEVA, Inc. Announces Second Quarter 2021 Financial Results

Headlines for Friday Aug. 06, 2021

• Imagination appoints Wallace Pai as Chairman of Imagination, China

Headlines for Thursday Aug. 05, 2021

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CAST IP Helps Socionext Develop Advanced Autonomous Driving Systems

IP cores and related support services from intellectual property provider CAST, Inc. have significantly facilitated the development of advanced automobile driving solutions by leading Systems-on-Chip provider Socionext, Inc.

• SMIC Reports 2021 Second Quarter Results
• AccelerComm joins DARPA Toolbox initiative for advanced communications research projects
• Robust Growth Rates Expected For Nearly All IC Products in 2021
• Chips&Media Expects a Supercycle in Semiconductors This Year
• UMC Reports Sales for July 2021
• GUC Monthly Sales Report - July 2021

Headlines for Wednesday Aug. 04, 2021

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Arasan Announces the Industry's First ONFI v5.0 Compliant NAND Flash IP

Arasan Chip Systems, a leading provider of semiconductor IP for the Internet of Things (IoT), mobile and automobile SoCs announces the immediate availability of their Total IP Solution for Nand Flash compliant to the Open Nand Flash Interface (ONFI) 5.0 Specification.

• StarFive to release open source single board platform Q3 2021

Headlines for Tuesday Aug. 03, 2021

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Omni Design Announces Silicon Validated Gigasample+ Low Power ADC and DAC on TSMC 28nm Technology

Omni Design Technologies today announced the availability of the Quark family of silicon validated Analog-to-Digital (ADC) and Digital-to-Analog (DAC) Converters sampling at greater than 1Gsps on TSMC 28nm HPC+ process

• Rambus Reports Second Quarter 2021 Financial Results
• Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1
• CEO interview: Globalfoundries' Tom Caulfield on the European project
• Intrinsic ID Partners with DARPA to Provide Streamlined Access to Industry-Leading PUF Technology
• DVB-S2X/S2/S Demodulator IP Core licensed to a Major Chinese Semiconductor company for integration into an 8K TV SOC
• Marvell to acquire Innovium for $1.1 Billion

Headlines for Monday Aug. 02, 2021

Top Story

NSITEXE Announces a RISC-V 32bit CPU supporting ISO26262 ASIL D

NSITEXE commences sales of RISC-V based 32bit general purpose CPU “NS31A”, which supports ISO 26262 ASIL D level functional safety.

• NSITEXE achieves world's first RISC-V processor with vector extension certified for ISO 26262 ASIL D ready product
• Imagination opens Cambridge office
• IAR Systems collaborates with NSITEXE to accelerate functional safety development for RISC-V