D&R Headline News (November 2021)

Headlines for Tuesday Nov. 30, 2021

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IAR Systems and Codasip collaborate to enable low-power RISC-V based applications

IAR Systems®, the world leader in software tools and services for embedded development, and Codasip, the leading supplier of customizable RISC-V processor IP, today announced their partnership enabling joint customers to build low-power embedded applications based on RISC-V.

• CEO interview: Minima's Tuomas Hollman on why static timing sign-off is over
• MIPS selects Imperas Reference Models for RISC-V Processor Verification
• Micron and UMC Announce Global Settlement
• Key ASIC Signed LOI to Acquire Wafer FAB in The US

Headlines for Monday Nov. 29, 2021

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intoPIX Unveils "TicoXS FIP" During its ProAV Virtual Event This Week

Not yet officially announced but not exactly a secret either; intoPIX, leading expert in video compression for ProAV, has again extended its large range of JPEG XS codecs with the addition of the Flawless Imaging Profile (FIP) in its revolutionary “TicoXS FIP” Codec.

• Silicon Catalyst Partners with Sony Semiconductor Solutions to Accelerate Semiconductor Startups
• Synopsys Expands Use of AI to Optimize Samsung's Latest Mobile Designs
• Profile of a traceability tool promising automation in SoC designs
• USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP cores with Superfast speed and High-power efficiency for lag-less data processing is Silicon Proven and available in 8nm LPP for licensing

Headlines for Thursday Nov. 25, 2021

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Samsung Selects Texas as Site for $17 Billion Fab

Samsung has chosen a small Texas town near Austin as the site of a $17 billion chip fab, supporting the U.S. effort to strengthen its domestic electronics supply chain.

• GPU shipments increase year-over-year in Q3
• Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire RISC-V SoC FPGA for Embedded Vision Applications at the Edge
• SynSense and Prophesee partner to combine neuromorphic engineering expertise for developing one-chip event-based smart sensing solution for ultra-low power edge-AI
• The Democratization of Chip Design
• WiLAN Subsidiary Acquires Wired Connectivity Patent Portfolio
• North American Semiconductor Equipment Industry Posts October 2021 Billings
• Siemens receives three 2021 TSMC OIP Partner of the Year awards for next-generation design enablement
• AMIQ EDA Joins OpenHW Group and Contributes Linting Capabilities for CORE-V Open-Source RISC-V Cores and Testbenches

Headlines for Wednesday Nov. 24, 2021

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VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification

VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced its Image Signal Processor (the Vivante ISP) IP ISP8000L-FS V5.0.0, designed for advanced and high-performance camera applications, has now been certified ASIL-B as Safety Element out of Context (SEooC) in compliance with the ISO 26262 standard.

Headlines for Tuesday Nov. 23, 2021

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CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic)

SensPro has already been licensed by multiple leading automotive semiconductor players for next-generation automotive SoCs. As an automotive IP supplier, the SensPro safety certification reflects the company’s commitment to a safety-focused design methodology for its processors, tools and software targeting automotive applications.

• Grovf Inc. Releases Low Latency RDMA RoCE V2 FPGA IP Core for Smart NICs

Headlines for Monday Nov. 22, 2021

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MediaTek and TSMC Unveil the World's First 7nm 8K Resolution Digital TV System-on-Chip

MediaTek and TSMC today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial intelligence (AI) engines, Motion Estimation and Motion Compensation (MEMC), Versatile Video Coding (VVC) decoding and picture-in-picture (PiP) technology.

• BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions
• Announcing superfast, HD Audio & Video through HDMI 2.0 Tx & Rx PHY & Controller IP Cores uncompressed data transfer in 28HPC+ and 12FFC!
• Codasip Adopts Imperas for RISC-V Processor Verification

Headlines for Friday Nov. 19, 2021

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Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family

Elmos Semiconductor SE (FSE: ELG) today announced a long-term partnership with semiconductor IP leader Arm, whose energy-efficient processor designs have enabled advanced computing in more than 200 billion chips to date.

Headlines for Thursday Nov. 18, 2021

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sureCore designs special high performance multi-port memory for Semidynamics AI chip

sureCore, the embedded memory specialist, has designed a power and area efficient, high performance, multi-port, embedded memory solution for Semidynamics’ new RISC-V-based, tensor processing chip.

• Annual Revenue Growth to Skyrocket Among Top 25
• UK Widens Probe of Nvidia-Arm Deal
• Imperas Models - reference for the newly ratified RISC-V Specifications
• GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand
• Access Advance Welcomes ZTE as a Licensor and Licensee of the HEVC Advance Patent Pool
• Samsung and Its Foundry Partners Reveal Solutions for a Strong Design Infrastructure at 3rd SAFE Forum 2021
• DCD-SEMI joins CAN in Automation, a leading CAN manufacturers' group
• DVB-S2X/S2/S/T2/T/C Combo Demodulator/Decoder IP Cores licensed to America's leading TV Semiconductor Company

Headlines for Wednesday Nov. 17, 2021

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RISC-V Low-Power Embedded Processor IP Core Now Available from CAST

Implementing a two-stage pipeline, the new 32-bit BA51 Low-Power Deeply Embedded RISC-V Processor is compact—just 16k gates in its minimum configuration–but can still run at over 500 MHz in modern ASIC processes.

• Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification
• Renesas Enters FPGA Market with the First Ultra-Low-Power, Low-Cost Family Addressing Low-Density, High-Volume Applications
• Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs
• Siemens extends support of multiple IC design solutions for Samsung Foundry's latest process technologies
• Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library

Headlines for Tuesday Nov. 16, 2021

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Intrinsic ID and Rambus Raise the Bar for Hardware Security with Integration of PUF Technology and Rambus Root of Trust

Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) security IP today announced the availability of integrated solutions that combine the Intrinsic ID PUF technology with Rambus Root of Trust security cores.

• Arteris IP Helps Automate System-on-Chip Semiconductor Design Traceability with Harmony Trace Design Data
• BBright UHD Media Gateway integrates intoPIX JPEG XS technology
• Faraday Announces Proven MIPI D-PHY for Samsung Foundry 14LPC Process
• Analog Bits to Demonstrates Low Latency PCIe/CXL Gen 5 on Samsung 8nm at SAFE Forum 2021
• Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications

Headlines for Monday Nov. 15, 2021

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Floadia Announces eNVM of 150 degree C retention on HHGrace 180BCD

Floadia Corporation announces that its high-quality eNVM (embedded Non-volatile Memory), with product name “ZT”, supporting 150 degree C retention of 10 years, is now available on Shanghai Huahong Grace Semiconductor Manufacturing Corporation (HHGrace) 180BCD (Z8) platform.

• CXL Consortium Showcases First Public Demonstrations of Compute Express Link Technology at SC21
• Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads
• Lattice Acquires Mirametrix
• SMIC Management Shakeup Continues
• BrainChip appoints Sean Hehir as New Chief Executive Officer
• SMIC Reports 2021 Third Quarter Results
• IAR Systems enables next generation automotive applications with NXP's S32K3 MCU family
• eDisplay Port / Display Port v1.4 Tx PHY and Controller IP Cores is available in 40nm ULP and 12nm FFC for your picture perfect UHD, 8K, 4K Display Applications

Headlines for Friday Nov. 12, 2021

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VeriSilicon's Neural Network Processor IP Embedded in Over 100 AI Chips

VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced its neural network processor (the Vivante1 NPU) IP designed for artificial intelligence (AI) applications now features in more than 100 AI chips supplied by 50 licensees.

• Net Insight teams up with intoPIX to develop next-generation JPEG XS compliant solutions

Headlines for Thursday Nov. 11, 2021

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Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications

'H-Cube' applies advanced silicon interposer technology and hybrid-substrate structure, allowing efficient integration of 6 HBMs, as well as lower cost benefit

• After Strong Gains, DRAM Prices Expected To Retreat in 4Q21
• New Lattice sensAI Solution Stack Accelerates Next-Generation Client Devices
• Cerebras Systems Raises $250M in Funding for Over $4B Valuation to Advance the Future of Artificial Intelligence Compute

Headlines for Wednesday Nov. 10, 2021

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Menta and Secure-IC Partnership Expands to Provide the Most Secure eFPGA IP Available

Menta and Secure-IC today announced a new milestone in their groundbreaking technology partnership: the availability of a 28nm test chip and board incorporating Menta’s eFPGA and Secure-IC’s integrated Secure Elements solutions.

• TSMC October 2021 Revenue Report
• NSITEXE unveils A New Product AI accelerator "ML041", realizes high power efficiency
• Weebit undertakes capital raising to support accelerated growth; introduces major Israeli institutional investors onto the register
• Introducing JESD204B Controllers and matching PHYs for high-speed, high-resolution device interconnection for high density systems!

Headlines for Tuesday Nov. 09, 2021

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TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder

TSMC and Sony Semiconductor Solutions (“SSS”) today jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes to address strong global market demand for specialty technologies, with SSS participating as a minority shareholder.

• Flex Logix Accelerates Growth With New Office In Austin; Prepares For Global Expansion Of Its Edge AI Inference Product Line
• CEVA, Inc. Announces Third Quarter 2021 Financial Results
• Imagination and Mobica partner to create virtualized automotive environment
• NSITEXE DR1000C, a RISC-V based parallel processor IP with vector extension (DFP: Data Flow Processor) has been licensed for Renesas' new RH850/U2B Automotive MCUs
• Digital Blocks DB9000 TFT LCD and OLED Display Controller & Processor IP Application Leadership Advancements
• BrainChip Completes Testing Production Version of the Akida Chip
• Diakopto's ParagonX Platform Selected by The Six Semi for High-Speed Memory PHYs

Headlines for Monday Nov. 08, 2021

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Corigine Brings Prototyping And Emulation Acceleration To The Desktop With MimicTurbo GT Card

The card along with the Corigine MimicTurbo prototyping software solution simplifies the deployment of FPGA based prototyping at the desktop, thus greatly accelerating silicon verification and pre-silicon software development at semiconductor companies.

• Heterogeneous Computing Is About Optimizing Resources
• Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 40nm ULP is available for immediate licensing for Audio SoC applications.
• GUC Monthly Sales Report - Oct 2021
• IAR Systems enables early technology adoption of the AI-capable Arm Cortex-M55 core
• Mythic Adds Two Silicon Valley Veterans to Its Leadership Team

Headlines for Friday Nov. 05, 2021

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sureCore-led consortium wins £6.5M Innovate UK grant to develop cryogenic CMOS IP to accelerate Quantum Computing scalability

Innovate UK has awarded a grant of £6.5 million to a seven-member consortium led by sureCore with a remit to jointly develop advanced cryogenic semiconductor IP. This will dramatically accelerate the growth of the Quantum Computing (QC) industry by reducing the constrains associated with interconnects thus enabling efficient qubit/system scaling.

Headlines for Thursday Nov. 04, 2021

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Samsung and Alphawave IP Announce Acceleration of Deep Partnership with Flagship Global Hyperscaler Design Win at 4nm

Alphawave IP and Samsung are pleased to announce they have secured a strategic design win with a flagship global hyperscaler for a leading-edge datacentre system-on-chip (SoC). This represents one of the first global hyperscaler design wins in Samsung’s 4nm technology, and highlights Alphawave’s continued leadership of its connectivity technology.

• Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
• Imagination launches the most advanced ray tracing GPU
• Codasip Expands Ecosystem with XtremeEDA
• Kneron Edge AI SoC Powered by Andes RISC-V Processor Core D25F
• UMC Reports Sales for October 2021
• Embedded FPGA (eFPGA) technology: Past, present, and future
• eMemory and UMC Bring New ReRAM Intellectual Property to Market
• Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports

Headlines for Wednesday Nov. 03, 2021

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Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor

Nextchip have licensed aiMotive’s latest aiWare4™ NPU hardware IP for their next-generation ASIL-B compliant SoC for AVP and other challenging automotive applications

• Tessolve Joins GlobalFoundries' Design Enablement Network Program as a Design Partner to Bring Advanced Design Solutions to Accelerate Customer Product Development
• TSMC Recognizes Long-Standing Collaboration with Synopsys on Semiconductor Innovation with Multiple OIP Partner of the Year Awards
• proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring
• Sondrel develops Performance Verification Environment to fast-track ASIC creation

Headlines for Tuesday Nov. 02, 2021

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Synopsys Acquires AI-Powered, Real-Time Performance Optimization Leader Concertio

To enrich its silicon lifecycle management solution with real-time, in-field optimization technologies, Synopsys, Inc. (NASDAQ: SNPS) today announced that it has acquired Concertio Inc., the leading provider of AI-powered performance optimization software.

• Wi-Fi CERTIFIED HaLow delivers long range, low power Wi-Fi
• Codasip appoints Brett Cline to drive company growth worldwide
• IBM and NeuReality team up to build the next generation of AI inference platforms
• DDR5 Ecosystem Ramps Up
• Rambus Reports Third Quarter 2021 Financial Results
• GlobalFoundries Announces Closing of Initial Public Offering
• Weebit delivers its most successful quarter, achieving key business and technical milestones
• Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design

Headlines for Monday Nov. 01, 2021

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Andes Technology Issues GDR to Be Listed on Luxembourg Stock Exchange for Expansion Plan

Andes Technology (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading RISC-V CPU IP supplier, announced today that it successfully issued its overseas depositary receipts (GDR) on the Luxembourg Stock Exchange on September 13.

• M31 Technology Receives 2021 TSMC OIP Partner of the Year Award
• Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP
• USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP Cores for High Bandwidth, Low Power data communication in PCs, Mobiles, SSDs, and other Multimedia Devices.