D&R Headline News (January 2022)

Headlines for Monday Jan. 31, 2022

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AMD Acquisition of Xilinx Heats Up Competition with Intel

AMD’s acquisition of Xilinx in an all-stock transaction valued at $35 billion promises to raise the stakes in the second-ranked CPU maker’s competition with Intel.

• Arasan expands Total MIPI Display IP with seamlessly integrated VESA DSC IP
• LeapMind Announces AI Image processing model which operates on edge devices
• GOWIN Semiconductor USB 2.0 PHY Interface and Device Controller IPs Achieve USB-IF Certification
• Samsung Readies Gate-All-Around Ramp
• CAES Collaborates with Lattice Semiconductor to Provide Radiation-Tolerant FPGAs for Distributed Satellite Computing Applications

Headlines for Friday Jan. 28, 2022

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Logic Design Solutions Launches NVME Host IP on Xilinx Ultrascale & Ultrascale Plus FPGA

The LDS-NVME-HOST-K7U & LDS-NVME-HOST-ZUP IP completes an existing family of Xilinx NVME HOST IP of Logic Design Solutions (LDS) in order to provide a complete panoply in embedded recording domain.

• Blue Danube Systems Enters Agreement to Be Acquired by NEC Corporation

Headlines for Thursday Jan. 27, 2022

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Frame Buffer Compression IP Subsystem for TCON IC Manufacturers Launched by Hardent

Hardent, Inc., a leading provider of video compression IP cores, today announced the availability of a new VESA® Display Stream Compression (DSC) Frame Buffer Compression IP Subsystem.

• Xilinx Reports Record Revenue of $1.01 Billion in Fiscal Third Quarter
• Alphawave Welcomes Tony Chan Carusone as Chief Technology Officer
• Taiwan's Intellectual Property and Commercial Court Announced Its Ruling on UMC and Other Defendants with Respect to Micron Case
• Pearl Semi selects Siemens' Symphony AMS platform for its novel low-noise digital PLL design
• JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
• Rambus Delivers PCIe 6.0 Controller for Next-Generation Data Centers
• SmartDV and NSITEXE Sign Agreement to Deploy NSITEXE's RISC-V 32bit CPU Core throughout North America, China, India, Taiwan

Headlines for Wednesday Jan. 26, 2022

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CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets

CEVA, the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announced today that it has expanded its IP market reach by introducing the Fortrix™ SecureD2D IP solution, enabling secure data exchange between different chiplets within a Heterogenous System on Chip (HSoC).

• Jerome Nadel Joins BrainChip as Chief Marketing Officer
• Report: Nvidia prepares to abandon Arm deal
• Analog IP supplier Agile Analog builds footprint in Asia-Pacific with new sales and engineering operation based in Taiwan
• Ceremorphic Exits Stealth Mode; Unveils Technology Plans to Deliver a New Architecture Specifically Designed for Reliable Performance Computing
• Thalia launches next generation IP reuse tools for smarter, more agile semiconductor product development
• Kinetic Technologies Adopts Diakopto's ParagonX Platform for High-Performance Power Management and Video/Audio Interface ICs
• DVB-S2X/S2/S/T2/T/C Combo Demodulator & Decoder IP Core licensed to - Asia's leading TV Semiconductor Company

Headlines for Tuesday Jan. 25, 2022

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CFX announces commercial availability of anti-fuse OTP technology on 55nm Logic process

CFX, the one stop shop of embedded flash memory IP and stand alone flash memory IC provider announced today commercial availability of anti-fuse OTP technology on 55nm Logic Low Power process.

• North American Semiconductor Equipment Industry Posts December 2021 Billings
• The Real Reason Behind the Automotive Industry IC Shortage - A Step-Function Surge in Demand!
• NucleiSys Adopts Breker's System Coherency TrekApp

Headlines for Monday Jan. 24, 2022

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Weebit Nano demonstrates its first crossbar ReRAM arrays

Weebit Nano Limited is pleased to announce that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays that combine its ReRAM technology with a selector.

• Imagination wins Linley Group 2021 Analysts' Choice Award
• Forecasters Foresee a $600B Chip Industry
• AI expands HBM footprint
• Prepare for chip recession says analyst
• MPEG LA Offers One-Stop License for ATSC 3.0
• Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution
• Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications
• BrainChip Reflects on a Successful 2021, with Move to Market Readiness Behind Next-Generation Edge-Based AI Solutions
• Wi-Fi ax + BLE v5.3 + 15.4, 2.4GHz RF Transceiver IP core in 22nm, licensed to a Chinese customer for IoT chipset

Headlines for Friday Jan. 21, 2022

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Kalray Enters into Exclusive Negotiations for the Acquisition of Arcapix Holdings Ltd, a Leading Provider of Software-defined Storage Solutions for Data-intensive Applications

Kalray today announced that it has entered into exclusive negotiations for the acquisition of 100% of the shares of Arcapix Holdings Ltd, a leading provider of software-defined storage and data management solutions for data-intensive applications.

• Access Advance Welcomes HONOR to the HEVC Advance Patent Pool

Headlines for Thursday Jan. 20, 2022

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Morello research program hits major milestone with hardware now available for testing

Securing the world’s data will be one of the greatest technology challenges over the next decade of compute. This is why Arm has been collaborating with the University of Cambridge for several years on its CHERI architecture, which defines hardware capabilities that would provide a fundamentally more secure building block for software.

• Siemens collaborates with UMC on design kits for automotive and power applications
• Seeing Machines Might Be the Next Arm
• Amcor announces strategic investment in PragmatIC Semiconductor
• Wi-Fi Alliance 2022 Wi-Fi trends
• Cadence Palladium Z2 Enterprise Emulation Platform Accelerates Microchip's Data Center Solutions SoC Development
• Secure-IC Raises €20 Million to Accelerate the Deployment of its Cybersecurity Solutions for Connected Objects

Headlines for Wednesday Jan. 19, 2022

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Arm Predicts Stagnation if Nvidia Deal Fails

Arm faces significant hurdles to growth as a standalone company if Nvidia’s proposed acquisition falls through, according to documents released as part of the U.K. regulator’s ongoing merger inquiry.

• Silex Insight integrates cryptographic coprocessor with Mbed TLS 3.x
• Gartner Says Worldwide Semiconductor Revenue Grew 25.1% in 2021, Exceeding $500 Billion For the First Time
• MediaTek Shows The World's First Live Demos of Wi-Fi 7 Technology to Customers and Industry Leaders
• NSITEXE and Green Hills Software Partner on RISC-V Solutions
• Atmosic Announces $72 Million in Additional Funding and Launches New Bluetooth 5.3 SoC Family with Energy Harvesting Technology

Headlines for Tuesday Jan. 18, 2022

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Imagination and Andes jointly validate GPU with RISC-V CPU IP

Imagination Technologies and Andes Technology announce the successful testing and validation of the IMG B-Series Graphics Processing Units (GPU) with the RISC-V compliant Andes AX45, a 64-bit highly performance-efficient and configurable superscalar Central Processing Unit (CPU).

• EnSilica and Omni Design Collaborating on Multiple SoCs
• MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface
• L&T Technology Services wins USD45 million EV deal from U.S. Auto Tier-1
• QuickLogic Announces Large Display Bridge Purchase Order and Provides Preliminary Selected Fourth Quarter Fiscal 2021 Financial Results
• Successful Transmission of High-Quality, Ultra-Low-Latency Video over 60 GHz Wireless Communications System
• Faraday IP Solutions Certified by SGS-TUV for ISO 26262 ASIL-D Ready
• IC Sales Seen Growing by Double-Digits for Third Year in a Row
• BrainChip Achieves Full Commercialization of its AKD1000 AIoT Chip with availability of Mini PCIe Boards in high volume

Headlines for Monday Jan. 17, 2022

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Deep Vision Adopts SiFive RISC-V to Add OpenCV-Enabled AI Support

SiFive, Inc., the founder and leader of RISC-V computing, today announced that Deep Vision will integrate SiFive RISC-V processor IP into its next-generation inference accelerators to enable more comprehensive computer vision and voice in edge devices.

• Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports
• TSMC's 2022 Expansion Budget Exceeds $40 Billion
• Baikal Electronics allies with IP-cores domestic developer
• Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
• MIPI UFS 3.1, M-PHY 4.1, Unipro 1.8, ONFi 4.1 and many more IP Cores are available for immediate licensing for your advanced UFS Device Applications as a complete bundled solution
• Alphawave IP: Q4 2021 Trading and Business Update
• Fraunhofer's MPEG-H Audio selected as the sole mandatory audio system for Brazil's next-generation TV 3.0 broadcast service

Headlines for Friday Jan. 14, 2022

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Five AI Inference Trends for 2022

It’s an exciting time to be a part of the rapidly growing AI industry, particularly in the field of inference. Once relegated simply to high-end and outrageously expensive computing systems, AI inference has been marching towards the edge at super-fast speeds.

• Ceva Adds Homogenous AI Acceleration to Third-Gen Engine
• SmartDV Joins Open RF Association

Headlines for Thursday Jan. 13, 2022

• TSMC Reports Fourth Quarter EPS of NT$6.41
• Efabless Series A-1 Round Led by New North Ventures Drives Open-Source-Enabled Chip Design
• Access Advance Announces the Initial Group of VVC/H.266 Video Patent Pool Licensors

Headlines for Wednesday Jan. 12, 2022

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OPENEDGES Announces the Industry First 4-/8-bit Mixed-Precision Neural Network Processing Unit IP

OPENEDGES Technology, Inc., the world’s leading memory system and AI platform IP provider, today announced the first commercial release of mixed-precision (4-/8-bit) computation NPU IP, ENLIGHT.

• Aptiv Announces the Acquisition of Wind River, A Leading Provider of Intelligent Edge Software Solutions, From TPG
• VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving
• Nvidia-Arm plays "strong-Intel" card in UK deal probe
• Intilop Partners with IBM in Extreme Networking to deliver one thousand TCP & UDP connections on IBM's Big Data servers
• Semi Content in Electronic Systems Reached Record High in 2021
• Rambus Root of Trust Delivers FIPS 140-2 CMVP Security in Kyocera Multifunction Products
• Industry's First use of TLM for the At-Speed Verification of a PCIe-Based Avionics Design Requiring DO-254 Compliance
• PCI-SIG Releases PCIe 6.0 Specification Delivering Record Performance to Power Big Data Applications
• Kyocera Selects Rambus for IoT Security
• Xylon releases a new version of its MPSoC IP Framework for Multi-Camera Vision Applications

Headlines for Tuesday Jan. 11, 2022

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Chip shortage in 2022 and beyond: What you need to know

It seems most semiconductor companies believe that the supply imbalance will continue in 2022 and possibly even into 2023.

• Intel Agilex I-Series FPGA: REFLEX CES launches a brand new board with 400 Gigabit Ethernet capability
• Alphawave Collaborates with Microchip on AlphaCore 112Gbps IP for 800G and 1.6T Ethernet Applications
• Sondrel explains the vital coordinating role of Systems Architects

Headlines for Monday Jan. 10, 2022

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2022 Semiconductor Sales to Grow 11% After Surging 25% in 2021

Above average increases are expected in all major product categories, which will lift the global market to record-high revenues in 2022 despite growth rates easing from last year’s economic rebound, says report.

• HEVC Advance Patent Pool Momentum Grows
• Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications
• Mauna Kea Semiconductors (MKSemi) Raises $12.8 Million Pre-A+ Round, Launches Breakthrough Low Power Ultra-Wideband Product
• TSMC December 2021 Revenue Report
• eDisplay Port/Display Port v1.4 Tx PHY and Controller IP Cores in 12FFC and 40LP for cutting edge display applications is available for immediate licensing

Headlines for Friday Jan. 07, 2022

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CEVA's Bluetooth Dual Mode 5.3 SIG Qualified Platform Offers Improved Security, Less Interference and Better Power Consumption for Wireless Audio

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that its RivieraWaves Bluetooth® Dual Mode 5.3 Platform has achieved Bluetooth SIG Qualification, along with its GAF (Generic Audio Framework) and LC3 codec.

Headlines for Thursday Jan. 06, 2022

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CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture

CEVA today announced NeuPro-M, its latest generation processor architecture for artificial intelligence and machine learning (AI/ML) inference workloads.

• Analog Compute is Key to The Next Era of AI Innovation
• Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker
• Arteris IP Added to Russell 2000 Index
• Lattice FPGAs Power Next Generation Lenovo Edge/AI Experiences
• UMC Reports Sales for December 2021
• Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi applications
• SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition

Headlines for Wednesday Jan. 05, 2022

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Winner Micro Licenses CEVA's Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC

CEVA today announced that Beijing Winner Microelectronics Co. (Winner Micro), a supplier of wireless communications chips for the IoT, has licensed the RivieraWaves BLE5 and Wi-Fi 6 IP platforms

• GUC Monthly Sales Report - December 2021
• Dolphin Design, a leader in Edge Computing and AI platforms for the Internet of Things (IoT), is expanding into Asia and opens a processing center in Singapore

Headlines for Tuesday Jan. 04, 2022

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CEVA Bluebud Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More

CEVA today announced that it has enhanced the software offerings and tool kits for its highly successful Bluebud wireless audio platform with the addition of Bluebud-HD, a pre-configured software package that includes all the audio, voice and context-aware software required in premium TWS earbuds, gaming headsets, hearables, wearables and other smart audio products.

• Credo Appoints Lip-Bu Tan as Chairman and Bolsters Board with the Addition of Industry Veterans Sylvia Acevedo and Manpreet Khaira
• Global Semiconductor Sales Increase 23.5% Year-to-Year in November; Industry Establishes Annual Record for Number of Semiconductors Sold
• Synapse Design, a QuEST Global Company, joins TSMC Design Center Alliance (DCA)

Headlines for Monday Jan. 03, 2022

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ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems

CEVA-BX1 DSP powers audio/voice workloads in ASPEED’s AST1230 smart camera SoC; CEVA ClearVox voice front-end software is available to ASPEED’s customers to address most challenging multi-microphone conferencing use cases

• Axiomise Unveils Intelligent Debug Solution for Formal Verification of RISC-V Cores
• WiLAN Subsidiary Polaris Signs License Agreement with Marvell
• USB 4.0, MIPI DSI/CSI 2.0, Display Port 1.4, HDMI 2.1, DDR5, PCIe5.0, 1G Ethernet IP Cores and many more Wired Interface IP Cores available for immediate licensing