D&R Headline News (September 2022)

Headlines for Friday Sep. 30, 2022

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Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies

New patent-pending OmniPOWER™ distributed regulator systems are optimized for providing power supplies (on die or to multiple dies/chiplets) for the next generation of high-performance processor cores, cache, and high-speed serial IO interfaces.

Headlines for Thursday Sep. 29, 2022

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easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences

Battery-powered extended reality (XR) devices need to sense and analyze their environments within the response time of the human senses to provide instant visual and aural feedback towards the user. And do so with extremely low power consumption and with ultra-low latency.

• Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support
• Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
• Supply Chain Experts Weigh In on CHIPS Act
• AI "unicorn" Graphcore set to cut jobs
• SEGGER licenses C++ runtime library to SiFive for code size and performance efficiency
• S2C Releases Neuro™ - Advanced Prototype Resource Management Software
• Silicon Catalyst Announces POLYN Technology as Newest Company Admitted to Semiconductor Incubator

Headlines for Wednesday Sep. 28, 2022

• Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations
• Automotive IC Marketshare Seen Rising to 10% by 2026

Headlines for Tuesday Sep. 27, 2022

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PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready

PUFsecurity Corporation, a subsidiary of eMemory Inc., announced that its Crypto Coprocessor PUFcc had achieved PSA Certified Level 2 Ready. The test was executed by SGS Brightsight, an independent security evaluation laboratory approved by the PSA Certified program.

• Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time
• Chips&Media Expands to New Markets such as Autonomous Vehicles
• Imagination and Baidu PaddlePaddle create open-source machine learning library for Model Zoo
• Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware
• Arm announces new Board Members and new Chief Financial Officer
• SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors
• U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification

Headlines for Monday Sep. 26, 2022

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CXL Spec Grows, Absorbs Others to Collate Ecosystem

The Compute Express Link (CXL) protocol is arguably the fastest-evolving specification in the computing world, with the third iteration published just a bit longer than three years after its inception. But even with many vendors developing CXL products, there is a lot of work to be done to build out the ecosystem.

• Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution
• GOWIN Semiconductor New 22nm High-Performance FPGA family - Arora V
• QuiX Quantum wins €14 million contract with the German Aerospace Center to deliver a Universal Quantum Computer
• HDMI 2.0 Tx PHY and Controller IP Cores is available with Source Code license (Unlimited use with modification rights)

Headlines for Friday Sep. 23, 2022

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Bosch plans acquisition of Radio Frequency specialist ItoM

Bosch is expanding its team of experts in the field of "System on chip" (SoC). SoC are special semiconductors that are increasingly used in control units for the automotive industry.

• Functional Safety Certification Packages for Microchip FPGAs Speed Time to Market
• CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space

Headlines for Thursday Sep. 22, 2022

• Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks
• Flex Logix Selects Semifore for Advanced Inference Chip Design
• Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October
• Split manufacturing for trustworthy electronics "Made in Germany"
• Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow
• Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio
• IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder

Headlines for Wednesday Sep. 21, 2022

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CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs

CEVA, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN™, the industry’s first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).

• Codasip joins OpenHW Group to contribute to RISC-V verification
• Perforce Joins the Global Semiconductor Alliance and Debuts IP Maturity Model
• IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades
• CEO interview: Alphawave IP's Pialis on chiplets and custom silicon
• Agile Analog launches new Digital Standard Cell Library
• Alphawave IP: Interim results for the six months ended 30 June 2022
• DRAM Market Deflates, Cyclical Downturn Looms
• QuickLogic Raises Approximately $3.2 Million with Strategic Investment by Institutional Investors

Headlines for Tuesday Sep. 20, 2022

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Movellus Secures $23M in Series B Funding to Accelerate Growth

Movellus, today announced the closing of a $23M Series B to accelerate the company’s growth. The funding will be used to expand R&D efforts and build out the marketing and sales functions to support the company’s growth plans.

• Synopsys Unveils Industry's First Unified Emulation and Prototyping System Addressing Verification Requirements Across the Chip Development Cycle
• CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors
• Achronix Acquires Key IP and Expertise from FPGA Networking Solutions Leader Accolade Technology

Headlines for Monday Sep. 19, 2022

• proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring
• Ultra-low power 5G Sub-6GHz RF Transceiver IP Cores at 22nm, available for immediate licensing for Cellular and Industrial IoT applications
• VisionFive 2 will be made compatible with all mainstream Linux Operating Systems

Headlines for Friday Sep. 16, 2022

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NeuReality preps 7nm data centre AI chip

Israeli startup NeuReality is preparing to ship its NR1 AI-server-on-a-chip ASIC in the second quarter of 2023.

• SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups
• QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors
• CMOS Image Sensors Stall in "Perfect Storm" of 2022

Headlines for Thursday Sep. 15, 2022

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Redefining the global computing infrastructure with next-generation Arm Neoverse platforms

Arm marks a new beginning for the world’s computing infrastructure with additions to its Arm Neoverse roadmap including Neoverse V2 (codenamed “Demeter”). Neoverse V2 is the latest Arm core targeted at providing leadership per-thread performance for cloud, hyperscale and HPC workloads

• NIST and Google to Create New Supply of Chips for Researchers and Tech Startups
• Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier
• Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption
• Silicon Catalyst welcomes NXP Semiconductors as Newest Strategic Partner

Headlines for Wednesday Sep. 14, 2022

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Funding round fuels videantis' growth

videantis GmbH today announced the completion of a multi-million Euro funding round to accelerate its current growth path. The funding round is an intermediate step on the way towards a later series B financing round aimed for in 2023.

• Chip industry in "hopeful denial" says Penn
• VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement that Breaks the Limits of Computer Vision
• VeriSilicon Announces the One-Stop VeriHealth Chip Design Platform for Smart Healthcare Applications
• Cadence Revolutionizes Verification Productivity with the Verisium AI-Driven Verification Platform
• Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs
• Veriest supports the development of Mobileye's innovative automotive sensor products
• New Cadence Joint Enterprise Data and AI Platform Dramatically Accelerates AI-Driven Chip Design Development

Headlines for Tuesday Sep. 13, 2022

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CAST introduces the First CANsec IP Core for CAN XL Bus Security

Semiconductor intellectual property provider CAST today announced the immediate availability of an IP core that implements CANsec security features to better protect any CAN XL bus.

• SiFive Rolls Out Powerful New RISC-V Portfolio to Address Unmet Performance and Feature Needs of Rapidly Evolving Next-Gen Digital Automobiles
• Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications
• Flex Logix Unveils First AI Integrated Mini-ITX System to Simplify Edge and Embedded AI Deployment
• Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration

Headlines for Monday Sep. 12, 2022

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Expanded Partnership Between Arteris and Arm to Accelerate Automotive Electronics

Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it is expanding its partnership with Arm to help speed up automotive electronics innovation.

• Rambus Initiates Accelerated Share Repurchase Program
• ARM, IBM team on low power analog AI chip
• Cortus Announces the Launch of its New Secure Low Power RISC-V Microcontrollers
• SoC.one and Imagination Technologies Partner to Enable Adoption of RISC-V for Automotive Design
• Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control
• 1G Ethernet PHY IP Cores solution for all your Gigabit network applications is available for immediate licensing

Headlines for Friday Sep. 09, 2022

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Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP

Andes Technology today announced Andes’ Entry-Level RISC-V core serves as the computing engine in the new G020 RISC-V MCU ASSP from Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions.

• Fraunhofer IIS and Astrodesign cooperate to offer JPEG XS solutions for video equipment manufacturer
• OPENEDGES Listing on KOSDAQ this September
• Brite Semiconductor Provides USB IP Total Solution
• Flex Logix's Barrie Mullins To present at the 2022 AI Hardware Summit
• intoPIX SDKs rev up performance to meet the rapidly increasing encoding and decoding demand of Software-based Production & Pro-AV

Headlines for Thursday Sep. 08, 2022

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intoPIX unveils new FastTicoRAW & FastTicoXS codecs for Apple silicon and makes the switch to ARM-based technology simple

ntoPIX, the leading provider of innovative mezzanine compression technologies, today revealed at IBC its lineup of FastTicoRAW & FastTicoXS (JPEG XS) Codecs optimized for ARM chipsets, including Apple silicon and the M1 chip.

• Memory Market Collapse to Lift TSMC to Top Spot in 3Q22 Ranking
• SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge
• Samsung Sounds Alarm About '22 Chip Market Landing
• Fraunhofer IIS announces its JPEG XS SDK 5.0 solutions achieving 25% higher speed for en- and decoding
• Global Semiconductor Equipment Billings Increase 7% in Q2 2022, SEMI Reports
• QuickLogic Awarded a $6.9 Million Base Contract to Develop Strategic Radiation Hardened FPGA Technology
• TSMC August 2022 Revenue Report
• IPrium releases CCSDS 131.2 Turbo SCCC Modulator
• Chris Stevens, Industry Veteran Joins BrainChip to Lead WW Sales
• Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution

Headlines for Wednesday Sep. 07, 2022

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Morse Micro Raises $140M in Series B Funding to Accelerate IoT Connectivity and Revolutionize our Digital Future

Morse Micro, a fabless semiconductor company reinventing Wi-Fi for the Internet of Things (IoT), today announced $140M in Series B funding. The round was led by MegaChips Corporation, a leading ASIC and SoC services company based in Japan.

• Global Top Ten IC Design House Revenue Spikes 32% in 2Q22, Ability to Destock Inventory to be Tested in 2H22, Says TrendForce
• NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions
• Global Semiconductor Sales Increase 7.3% Year-to-Year in July, but Growth Slows

Headlines for Tuesday Sep. 06, 2022

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Intrinsic ID Collaborates with Synopsys to Boost SoC Security and Accelerate Time to Market

The Synopsys tRoot™ HSM IP now offers easy integration with Intrinsic ID QuiddiKey® hardware IP implementing SRAM PUF, enabling designers with little security experience to quickly add system and data protection features to their SoC designs.

• UMC Reports Sales for August 2022
• DELTACAST announces low-bitrate SMPTE 2110-22 video streaming support in its IP Virtual Card with intoPIX JPEG XS Software
• Sondrel complements its Architecting the Future IP platforms with pre-packaged supply chains for reduced risk
• Alphawave Adopts Diakopto's PrimeX™ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies

Headlines for Monday Sep. 05, 2022

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Qualcomm hits back at ARM over lawsuit

Qualcomm is accusing its processor IP supplier ARM of attempting to interfere with its internal design operation after the takeover of startup Nuvia.

• Sonical partners with Dolphin Design to build the future of hearables
• New U.S. Rule Could "Impair" China's AI Progress
• GUC Monthly Sales Report - August 2022
• Elevate your High-speed data transmissions to the next level for all Display interfaces with the MIPI D-PHY/ LVDS Combo PHY IP Cores in 40nm

Headlines for Friday Sep. 02, 2022

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Arasan achieves ISO 26262 ASIL B automotive safety certification for its Total eMMC IP Solution

Arasan announced today that their eMMC Total IP which includes the eMMC Controller IP and the eMMC PHY IP have achieved the Automotive Safety Integrity Level B, the architectural metrics SPFM (Single Point Fault Metric) and LFM (Latent Fault Metric) certification.

• Imagination hires Michael Trzupek as new Chief Financial Officer
• USB Promoter Group Announces USB4® Version 2.0

Headlines for Thursday Sep. 01, 2022

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Alphawave IP Announces Completion of Acquisition of OpenFive

Alphawave IP Group plc (“Alphawave” or “Company”) (LN:AWE), a global leader in high-speed connectivity for the world’s technology infrastructure is pleased to announce that it has completed the acquisition of OpenFive.

• Intel Taps MIPS eVocore for Intel Pathfinder for RISC-V
• Avant Technology Represents NSITEXE's RISC-V Processor IP Products in Taiwan and China
• Cadence Completes Acquisition of OpenEye Scientific
• Synopsys Approves Stock Repurchase Program with Authorization Up to $1.5 Billion
• Menta SAS is exhibiting at DVCon India 2022 and will offer a Technical Workshop