D&R Headline News (October 2022)

Headlines for Monday Oct. 31, 2022

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Intel signs 7 out of top 10 fabless companies, sees 18A test chip

Amongst its warning on lower income in Q4 and 2023, eeNews Europe highlights the seven out of the top ten foundry customers that Intel says it has signed. The company has taped out a test chip for its 18A process for a foundry customer this quarter.

• Rambus and Samsung Electronics Extend Comprehensive Agreement
• Floadia Announces MTP IP without extra Mask Available on 55nm
• Monthly Semiconductor Sales Decrease 0.5% Globally in September
• EnSilica growth continues with new Bristol ASIC design office
• MIPI DSI and CSI Controllers IP Cores, for your High-Resolution Cameras, Display and Consumer Products, is available for immediate licensing

Headlines for Friday Oct. 28, 2022

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Xiphera provides versatility and compact footprint with two new SHA-3 IP cores

Xiphera expands support for SHA-3 (Secure Hash Algorithm) by launching two new Intellectual Property (IP) cores: the resource-optimised compact version XIP3030C and the performance-optimised version XIP3030H.

• Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs

Headlines for Thursday Oct. 27, 2022

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Report: TSMC stops work on Chinese AI chip amid sanctions confusion

Foundry Taiwan Semiconductor Manufacturing Co. Ltd. has stopped making AI chips for Chinese startup Biren while it ensures compliance with US requirements, according to a Bloomberg report.

• TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
• Blueshift Memory Awarded Innovate UK Smart Grant to Develop AI Computer Vision Module
• Siemens partners with TSMC for 3nm product certifications and other technology milestones
• Weebit Nano successfully qualifies its ReRAM module
• Zynq® UltraScale+™ MPSoC FPGA: REFLEX CES adds a new FPGA version to its Zeus Zynq® UltraScale+™ MPSoC System-on-module
• SiMa.ai Welcomes New Investor MSD Partners Bringing Total Investment to $187 Million - SiMa.ai extends oversubscribed series B1 funding to $67 Million
• Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings
• Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow
• Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies
• Synopsys, Ansys and Keysight Accelerate 5G/6G SoC Designs with New mmWave Reference Flow for TSMC Process Technology
• Cadence's New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
• GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring

Headlines for Wednesday Oct. 26, 2022

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Flex Logix EFLX4K eFPGA IP Core on TSMC 7nm Technology Now Available

Flex Logix® Technologies, Inc., a leading innovator in AI inference IP and the leading supplier of eFPGA IP, today announced that it has completed porting and delivered the EFLX4K eFPGA IP core, both the Logic and DSP versions, on TSMC 7nm technology to its lead customer for integration into a production ASIC.

• GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology
• Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports
• More than 50 members join SOAFEE to enable the software-defined vehicle of the future
• Cadence Digital and Custom/Analog Design Flows Achieve Certification for TSMC's Latest N4P and N3E Processes

Headlines for Tuesday Oct. 25, 2022

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Avery Continues to Drive CXL Adoption with New Virtual Platform Features in Support of Version 3.0

Avery Design Systems, the leader in functional verification solutions, continues to drive the industry adoption of the Compute Express LinkTM (CXL™) open industry-standard interconnect, introducing new features in its QEMU software virtual machine emulator based Linux host and SoC RTL co-simulation solution for system-level verification of complete CXL HW-SW systems.

• Alphawave IP Achieves Its First Testchip Tapeout for TSMC N3E Process
• Flex Logix Opens Up Licensing to its InferX AI Technology
• Faraday Reports Third Quarter 2022 Results
• Cadence Reports Third Quarter 2022 Financial Results
• Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum
• Rambus Delivers PCIe 6.0 Interface Subsystem for High-Performance Data Center and AI SoCs
• SEGGER introduces streaming trace probe for SiFive RISC-V cores
• Cadence Joins Intel Foundry Services USMAG Alliance to Accelerate Chip Design Development
• SiFive and Synopsys Collaborate to Accelerate SoC Design
• Sondrel lists on London Stock Exchange's AIM market

Headlines for Monday Oct. 24, 2022

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U.S. Chip Sanctions "Put Temporary Checkmate on China"

Biden Administration’s escalation of the chip war with China is expected to at once hamper China’s foundry industry and cost multinational chipmakers billions of dollars in lost sales.

• Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications
• Intel Foundry Services Forms Alliance to Enable National Security, Government Applications
• How the CHIPS Act Will Impact Engineers
• Faraday Unveils Design Implementation Services for FinFET Technology Targeting all Foundries
• Socionext to present its Automotive Expertise at electronica 2022
• Nextera Video and Adeas ST 2110 and NMOS FPGA Cores Receive Latest JT-NM Tested Badges
• RISC-V Celebrates Upstreaming of Android Open Source Project RISC-V Port

Headlines for Friday Oct. 21, 2022

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Agile Analog fast tracks IoT design with macros for analog functions

Agile Analog™, the analog IP innovators, now has available a complete set of the key analog IP needed to fast track an IoT design. Arranged in six blocks, they wrap round the customer’s choice of processor core and memory to provide all the vital analog functions required to interface between the digital world of the processor and the analog real world.

• WiLAN Subsidiaries Enter into License Agreement with Micron
• Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology

Headlines for Thursday Oct. 20, 2022

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Marvell Announces Industry's Most Comprehensive 3nm Data Infrastructure IP Portfolio

The new 3nm Marvell silicon, which is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle, is available for new product designs and includes foundational IP building blocks such as long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure.

• CoMira Solutions Expands Global Support

Headlines for Wednesday Oct. 19, 2022

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videantis and ADTechnology to build 5nm ADAS/AD SoCs

videantis and ADTechnology today announced a collaboration to jointly build automotive SoCs (System-on-Chip) for advanced driver assistance systems (ADAS) and autonomous driving (AD) using Samsung Foundry’s advanced 5nm process.

• Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025, SEMI Reports
• SmartDV Achieves ISO 9001:2015 Certification
• NEUCHIPS Secures $20 Million in Series B2 Funding to Deliver AI Inference Platform for Deep Learning Recommendation
• USB-IF Announces Publication of New USB4® Specification to Enable USB 80Gbps Performance

Headlines for Tuesday Oct. 18, 2022

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Arasan Partners with Testmetrix on its 4.5 GSPS C-PHY / D-PHY HDK and Compliance Test Platform

Arasan Chip Systems, a leading provider of semiconductor IP today announced that its MIPI DSI-2, CSI-2 and C-PHY / D-PHY Combo IP have been successfully implemented on the Testmetrix C/D-PHY HDK and Compliance Test Platform.

• Change drives innovation: New executive assignments at Arm will bring fresh perspectives, renewed focus and growth opportunities
• Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform® Ecosystem Forum
• IAR Systems' Functional Safety Certified Development Tools for RISC-V support latest SiFive Automotive Solutions
• VESA Releases DisplayPort 2.1 Specification
• Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design

Headlines for Monday Oct. 17, 2022

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Andes Announces the N25F-SE Processor, the World First RISC-V CPU IP with ISO 26262 Full Compliance

Andes Technology, a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and founding premier member of RISC-V International, today announces its safety-enhanced AndesCore® N25F-SE is the first RISC-V CPU IP certified to be fully compliant with ISO 26262 functional safety standards for the development of automotive applications.

• Electronic System Design Industry Hits Record Revenue of Nearly $3.8 Billion in Q2 2022, ESD Alliance Reports
• First RISC-V laptop uses Alibaba TH1520 SoC
• TSMC Cuts Expansion Plan to $36B as Outlook Sours
• MOSCHIP joins TSMC Design Center Alliance
• Alphawave IP: Q3 2022 Trading and Business Update
• Introducing T2M's impressive collection of Silicon Proven, Automotive Grade Interface IP Cores

Headlines for Friday Oct. 14, 2022

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Brite Semiconductor Provides MIPI IP Total Solution

Brite Semiconductor today announced providing MIPI IP total solution for custom ASIC/SoC design service. This solution consists of a series of MIPI controller and PHY. It will help the System Manufacturer and IC companies to design high quality ASIC/SoC products while speeding up time to market.

Headlines for Thursday Oct. 13, 2022

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Weebit Nano advances its ReRAM selector development to fit embedded & discrete applications

Weebit Nano, a leading developer of next-generation memory technologies for the global semiconductor industry, has made significant progress in its selector development with new results confirming its ReRAM selector is suitable for both embedded and discrete (stand-alone) applications

• US restricts Sea Turtles in chip industry
• Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process
• Foundries defy chip market downturn
• BrainChip Fortifies Neuromorphic Patent Portfolio with New Awards and IP Acquisition
• Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon.
• TCP/IP Hardware Stack IP Core now Available from CAST
• Alphawave IP Acquires Optical DSP Chip Developer Banias Labs, Advancing its Optical DSP Products for Data Centers
• proteanTecs Edge™ Applications Now Available on the Advantest ACS Solution Store

Headlines for Wednesday Oct. 12, 2022

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US Government to Fund Expansion of IP Ecosystem for SkyWater's 90 nm Rad-Hard Platform

SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the Department of Defense (DOD) is investing $12 million to expand the intellectual property (IP) ecosystem for the company’s 90 nm radiation-hardened (rad-hard) by process offering, as part of the previously announced $27 million investment.

• Global 300mm Semiconductor Fab Capacity Projected To Reach New High in 2025, SEMI Reports
• New Cadence Certus Delivers Up to 10X Faster Concurrent Full-Chip Optimization and Signoff
• Cadence and Google Cloud Collaborate to Advance the Electronic System and Semiconductor Design Ecosystem
• Quadric Appoints Former Cadence VP Dhanendra Jani as New VP of Engineering
• Achronix Appoints Mahesh Karanth as CFO

Headlines for Tuesday Oct. 11, 2022

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DCD-SEMI introduces multiprotocol combo: HDLC, UART, SPI... with bigger FIFO and...

The DEMSCC - Dual channel Multiprotocol Enhanced Serial Communication Controller, means a brave new world for well-known serial IP users. The new IP Core is available with AXI, AHB, APB wrappers enabling ultimate functionalities for all modern microcontrollers, both from DCD-SEMI and other vendors.

• Tiempo Secure becomes a Strategic Member of RISC-V International
• SEMI ESD Alliance Adds Axiomise to Member Roster
• POLYN Introduces Voice Processing Tiny AI Chip Delivering Industry-First Voice Extraction
• Andes Technology Announces Return of the Annual RISC-V CON on October 18th in the San Jose Airport DoubleTree Hotel

Headlines for Monday Oct. 10, 2022

• EnOcean accelerates its growth and breadth of energy-saving solutions through the acquisition of the assets of the edge computing solutions business from Renesas
• TSMC September 2022 Revenue Report
• Introducing PCIe 4.0 PHY IP Cores in 7nm for a reliable, Low area and High-Speed Interface Peripheral slot for all your High-End Devices

Headlines for Friday Oct. 07, 2022

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Creonic Releases DVB-RCS2 Multi-carrier Satellite Receiver IP Core

Creonic GmbH, the market leader for satellite communication (SATCOM) IP cores, today announced the immediate availability of its multi-carrier DVB-RCS2 receiver, allowing to implement efficient satellite communication networks.

• Sondrel announces its intention to list on London Stock Exchange's AIM market on 21 October 2022

Headlines for Thursday Oct. 06, 2022

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Arm chops staff

Arm has laid off 20% of its UK workforce of 3,500 employees and 18% of its global workforce of 6,950 people.

• No suggestion from Softbank about Samsung investing in Arm, say reports
• UMC Reports Sales for September 2022
• Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
• GUC Monthly Sales Report - September 2022
• GBT Filed a Non-Provisional Patent for Automatic Generation of Integrated Circuits Layout Blocks

Headlines for Wednesday Oct. 05, 2022

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Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity

Credo (NASDAQ: CRDO) today announced the Screaming Eagle 112G LR (Long Reach) DSP device with 1.6 Terabits per second (Tbps) of retiming capacity. By supporting port speeds of 1.6T, 800G, 400G, 100G and down to 10G – Screaming Eagle can satisfy the massive data transit requirements of hyperscalers, enterprises, 5G carriers and service provider customers.

• Synopsys Unveils Breakthrough Golden Signoff ECO Solution, Delivering 10x Productivity Improvement

Headlines for Tuesday Oct. 04, 2022

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Global Semiconductor Sales Increase 0.1% Year-to-Year in August

SIA today announced global semiconductor industry sales were $47.4 billion during the month of August 2022, a slight increase of 0.1% over the August 2021 total of $47.3 billion but a decrease of 3.4% compared to the July 2022 total of $49.0 billion.

• SEGGER and Cadence team up to add native J-Link support for Cadence Tensilica cores
• Synopsys Expands Code Sight Standard Edition with IntelliJ Support
• Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes
• QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs
• EU chip plan would cost €500bn, says NXP CEO
• Samsung Foundry Certifies Cadence Voltus-XFi Custom Power Integrity Solution for 5LPE Process Technology
• Cadence and Samsung Foundry Collaborate to Certify RFIC Design Reference Flow on 8nm Process Technology

Headlines for Monday Oct. 03, 2022

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SEMIFIVE Announces New 5nm HPC SoC Platform

Built on its in-house methodology used in its first two SoC Platforms (AI Inference Platform and AIoT Platform), SEMIFIVE’s latest HPC SoC Platform is designed and optimized on Samsung Foundry’s mass production proven 5nm FinFET technology.

• Synopsys and Samsung Foundry Enable 3nm Process Technology for Power- and Performance-Demanding Mobile, HPC and AI Designs
• Siemens' Calibre platform now certified for Samsung's advanced 3nm process technology
• Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
• Mobileye files for IPO, reveals data
• Introducing superfast serial interfacing with JESD204B Tx - Rx PHY IP Cores in 12nm, 28nm and 40nm for all type of ADC/DAC and ASIC/FPGA connections