D&R Headline News (January 2023)

Headlines for Tuesday Jan. 31, 2023

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Faraday Announces Multi-site Manufacturing Support in ASIC

Faraday Technology today announced to offer multi-site manufacturing support across all regions for ASIC customers. With its long-term close collaboration with global foundry and OSAT vendors, Faraday is able to provide customers the multi-site support to mitigate manufacturing risks due to economy, accidents, epidemics, or geopolitics.

• Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
• Tachyum Successfully Runs UEFI on Prodigy FPGA
• Hardware Root of Trust: The Key to IoT Security in Smart Homes
• Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
• QuickLogic Partners with Andes Technology for eFPGA Joint Promotion

Headlines for Monday Jan. 30, 2023

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Intel kills its RISC-V Pathfinder development kit programme

Intel has discontinued its recent programme that brought together a wide range of RISC-V technologies.

• EU Parliament Adopts Position on Chips Act
• Linaro to Acquire Arm Forge Software Tools Business
• BrainChip Tapes Out AKD1500 Chip in GlobalFoundries 22nm FD SOI Process
• Gidel introduces groundbreaking edge computer with NVIDIA Jetson Orin NX system-on-module and high-bandwidth camera frame grabber for real-time image acquisition compute and AI processing
• Q4 loss at Intel
• 10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing

Headlines for Thursday Jan. 26, 2023

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Axiomise Accelerates Formal Verification Adoption Across the Industry

Axiomise, the leading provider of cutting-edge formal verification solutions, marked its fifth anniversary in 2022 with an impressive list of highlights, including training, consulting, services, and custom app development such as formalISA.

• IAR Systems fully supports the brand-new Industrial-Grade PX5 RTOS
• Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
• intoPIX to feature TicoXS FIP technology for premium 4K & 8K AVoIP wireless AV at ISE 2023
• Sevya joins TSMC Design Center Alliance
• Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies

Headlines for Wednesday Jan. 25, 2023

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Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design

Avery Design Systems, a leader in functional verification solutions, and high-speed connectivity IP innovator CoMira Solutions today announced a partnership aimed at enabling chiplet design using the UCIe (Universal Chiplet Interconnect Express) die-to-die interface standard.

• Weebit Nano nears productisation, negotiating initial customer agreements
• Open Compute Project Foundation and JEDEC Announce a New Collaboration

Headlines for Tuesday Jan. 24, 2023

• VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry
• Nexperia invests in sustainable alternatives to batteries

Headlines for Monday Jan. 23, 2023

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Xiphera announces the first IP core for the quantum-secure xQlave™ product family

Xiphera introduces XIP6110B, the first member of the xQlave™ product family of quantum-secure cryptographic IP cores. XIP6110B implements CRYSTALS-Kyber Key Encapsulation Mechanism (KEM) that was recently selected as one of the four PQC algorithms to be standardised by the American NIST (National Institute of Standards and Technology).

• New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
• AI Must Be Secured at the Silicon Level
• Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
• CEO Interview: Stephen Fairbanks of Certus Semiconductor
• Accellera's Security Annotation for Electronic Design Integration Standard 1.0 Moves Toward IEEE Standardization
• Accellera Announces the Formation of the Clock Domain Crossing Working Group
• GUC Delivers its First TSMC N3 Chip and First AI-Optimized N5 Design Using Cadence Digital Solutions
• OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting
• The latest ASIL-B,C,D and ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing

Headlines for Friday Jan. 20, 2023

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Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners

The OCTAPUS initiative is an EU funded project, which started in September 2022 and is funded until February 2026. OCTAPUS stands for “Optical Circuit switched Time-Sensitive Network (TSN) architecture for highspeed Passive optical networks and next generation Ultra-dynamic & reconfigurable central office environments”, and the goal is to deliver an agile, low-cost and energy efficient Photonic Integrated Circuit (PIC) technology framework.

Headlines for Thursday Jan. 19, 2023

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Andes Technology Collaborates with LDRA to Deliver Integrated Tool Suite for Safety-Critical Software on Andes RISC-V CPU Solutions

Andes Technology, a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and founding premier member of RISC-V International, today announced the integration of AndeSight™ IDE with LDRA tool suite.

• Foundry Revenue Is Forecasted to Drop by 4% YoY for 2023 Due to Slow Inventory Consumption and Falling Wafer Input from Customers, Says TrendForce

Headlines for Wednesday Jan. 18, 2023

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Analog Bits Awarded ISO 9001 and ASIL B Ready Certifications

Analog Bits, the industry’s leading provider of low-power mixed-signal IP (Intellectual Property) solutions, has received ISO 9001 Certification for design and development of low-power clocking, sensors, and interconnected IPs.

Headlines for Tuesday Jan. 17, 2023

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Gartner Says Worldwide Semiconductor Revenue Grew 1.1% in 2022

Worldwide semiconductor revenue increased 1.1% in 2022 to total $601.7 billion, up from $595 billion in 2021, according to preliminary results by Gartner, Inc. The combined revenue of the top 25 semiconductor vendors increased 2.8% in 2022 and accounted for 77.5% of the market.

• Settlement Reached in Lawsuit Brought by Tachyum Against Cadence

Headlines for Monday Jan. 16, 2023

• National Instruments up for sale
• Analog IPs Automate Integration, Tune to Fab Nodes
• Unveiling the Future of Home Entertainment: a truly immersive Multimedia experience through HDMI 1.4 Tx-Rx PHY and Controller IP Cores

Headlines for Friday Jan. 13, 2023

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Alphawave to outline long-term strategy and financial targets

Alphawave IP Group plc (LSE: AWE, “Alphawave”, the “Company”), today will host its inaugural Capital Markets Day for investors and financial analysts in London. At the event, the management team will present the Company’s long-term business strategy and financial targets as it enters the next stage of technology leadership in connectivity for digital infrastructure markets.

• Alphawave Semi: Q4 2022 Trading and Business Update
• Imagination collaborates with Synopsys to accelerate 3D visualisation in mobile and data centre
• Certus Semiconductor releases ESD library in GlobalFoundries 12nm Finfet process

Headlines for Thursday Jan. 12, 2023

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The Importance of 3D IC Ecosystem Collaboration

Not too long ago, packaging technologies were thought of as inconvenient back-end processes. But times have changed, and rising advancements in artificial intelligence, big data, cloud computing and autonomous vehicles have pushed the computing envelope unlike ever before (along with the need for packaging technologies).

• Apple to replace Broadcom IC with in-house designed part
• EDA Tools for Analog: Where Do I Go From Here?
• Arteris Announces New Employment Inducement Grants
• VSORA Secures $4.2 Million in Financing from Otium Capital, Angel Investors
• Chipletz selects Siemens' EDA solutions for its Smart Substrate IC packaging technology
• TSMC Reports Fourth Quarter EPS of NT$11.41
• Should open source sniff the geopolitical wind and ban itself in China and Russia?
• Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s
• Alphawave IP Announces Appointments to its Executive Leadership team
• Bluespec collaborates with Synopsys to address growing verification demands for RISC-V design community

Headlines for Wednesday Jan. 11, 2023

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Imagination's IMG DXT GPU unlocks scalable, premium ray tracing for all mobile gamers

Imagination Technologies launches IMG DXT, a groundbreaking ray tracing GPU that scales to unlock cutting-edge graphics for all mobile device users.

• PDF Solutions and proteanTecs Announce Collaboration to Deliver Combined Solutions for Semiconductor Analytics to Address the Needs of Data Centers and Automotive Makers

Headlines for Tuesday Jan. 10, 2023

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Arteris Acquires Semifore to Accelerate System-on-Chip Development

Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has completed the acquisition of Semifore, Inc., a leading provider of hardware/software interface (HSI) technology.

• RISC-V SBC VisionFive 2 Officially Shipped
• Tachyum Closes DDR5 Timing at over 6400MT/s Providing Massive Bandwidth for Prodigy Chip
• TSMC December 2022 Revenue Report
• Ceremorphic Introduces Custom Silicon Development for Advanced Nodes Using In-House Technology to Speed Customer HPC Chip Development
• Global Semiconductor Sales Decrease 2.9% Month-to-Month in November
• Semiconductor and Embedded Systems Architecture Labs (SEAL) makes new technology available to everyone for learning and innovation

Headlines for Monday Jan. 09, 2023

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Rapid Silicon Announces $30M Series A Round

Rapid Silicon, a provider of AI and intelligent edge-focused FPGAs based on open-source technology, today announced its $30M Series A Round.

• CEVA Audio Front End Software Solution Becomes Alexa Voice Service (AVS) Qualified
• Digital Blocks AMBA Peripherals I3C, I2C, eSPI, xSPI Controller IP Core Families Extend Leadership with enhancements containing feature-rich, system-level integration features.
• CCSDS AR4JA LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• Display Port/eDisplay Port v.1.4 Tx-Rx PHY & Controller Silicon Proven IP Cores with high Bandwidth and 4K/8K Resolution is ready for immediate licensing

Headlines for Friday Jan. 06, 2023

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Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs

CEVA today announced that Sino Wealth Electronic has licensed and deployed CEVA's Bluetooth connectivity platform - RivieraWaves Bluetooth Low Energy 5 IP in its latest SH87F881X family of connectivity MCUs targeting white goods and the broader Industrial IoT (IIoT) markets.

• Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars
• UMC Reports Sales for December 2022

Headlines for Thursday Jan. 05, 2023

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Dolphin Design and Neovision joint forces to make AI processing viable for ambient computing electronics

Dolphin Design, a leader in silicon IPs for Very Edge Computing embedding AI, integrated power management, and audio IPs, and Neovision, an AI Engineering Consulting company, specializing in Deep Learning & Computer Vision, announced today during CES at Las Vegas that the companies have entered into a strategic partnership that will bring serious AI vision tasks into the sub-mW range, opening a new era of battery-operated consumer applications.

• Ventana Introduces CES Audience to World's Highest Performance RISC-V CPU, Veyron V1
• Syntiant Unveils NDP115 Neural Decision Processor at CES 2023
• SNIA Spec Gets Data Moving in CXL Environment
• SpacemiT makes important breakthroughs in RISC-V High-Performance Cores
• VESA Showcases Product Demos Supporting DisplayPort 2.1 and Other High-Performance Video Standards at CES 2023
• SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility
• CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution
• GUC Monthly Sales Report - December 2022
• €270m for RISC-V chiplets to build European exascale supercomputers

Headlines for Wednesday Jan. 04, 2023

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CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances

CEVA today announced that LG Electronics (LG) has licensed and deployed the CEVA-XM4 intelligent vision DSP in its Edge AI system-on-chip (SoC) 'LG8111' to advance the user experience of a new generation of smart home appliances.

• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023

Headlines for Tuesday Jan. 03, 2023

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Weebit Nano tapes-out first 22nm demo chip

Weebit Nano Limited has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module in an advanced 22nm FD-SOI (fully depleted silicon on insulator) process technology.

• Edge Impulse and BrainChip Partner to Further AI Development with Support for the Akida platform
• RISC-V Summit 2022: All Your CPUs Belong to Us
• Estimated Shipments of iPhone 14 Devices in 2022 Have Been Lowered to 78.1 Million Units Due to Impact of COVID-19 Lockdown on Foxconn's Base in Zhengzhou, Says TrendForce
• intoPIX Showcases Ultra-low Latency Wireless Display Concept at CES Las Vegas 2023

Headlines for Monday Jan. 02, 2023

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Digital Blocks DMA Controller Verilog IP Core Family Extends Leadership with enhancements to AXI4 Memory Map and Streaming Interfaces

Digital Blocks, a leading developer of silicon-proven semiconductor Intellectually Property (IP) soft cores for system-on-chip (SoC) ASIC, ASSP, & FPGA developers, announces enhancements to DMA Controller Verilog IP Core offerings with capabilities to stream data to and from memory such as between Network Interfaces and System Memory.

• USB 3.0 IP, MIPI D-PHY v1.2 IP, Display Port v1.4 IP, 1G Ethernet IP, the Best-Selling Interface IP Cores solutions through T2M in 2022