D&R Headline News (March 2023)

Headlines for Thursday Mar. 30, 2023

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Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors

VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable chiplet architecture powered by multiple processors from VeriSilicon, including the CC8400 General-Purpose Graphics Processor Unit (GPGPU), VIP9400 Neural Network Processor (NPU), and VC8000D Video Processor Unit (VPU).

• Interview: Aart de Geus on AI-driven EDA
• CXL Testing Leverages PCIe Expertise
• POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design
• Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution
• China forms its own chiplet standard amid isolation
• Computing Hardware Expert Georgios Konstadinidis Joins proteanTecs Advisory Board

Headlines for Wednesday Mar. 29, 2023

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Synopsys.ai Unveiled as Industry's First Full-Stack, AI-Driven EDA Suite for Chipmakers

For the first time, engineers can now use AI at every stage of chip design, from system architecture to design and manufacturing, and access the solutions in the cloud. Renesas, a leader in the automotive space, is already using Synopsys.ai to shave weeks off product development times with enhanced silicon performance and cost reduction.

• Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering
• Report: Arm proposes change to IP royalty model
• Networking Chip Startup Enfabrica Emerges from Stealth Mode to Solve Scalability and Price-Performance Challenges for AI Growth in Cloud
• Tachyum To Use UCIe Interconnect Standards In Prodigy 2

Headlines for Tuesday Mar. 28, 2023

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Mobiveil's PSRAM Controller IP Lets SoC Designers Leverage AP Memory's Xccela x8/x16 250 MHz PSRAM Memory

Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced it is working with AP Memory, a market leader in PSRAM devices, to bring new IP controller targeting modem, connectivity, smart IoT, edgeAI, display and wearables applications.

• eMemory and UMC Expand Low-Power Memory Solutions for AIoT and Mobile Markets with 22nm RRAM Qualification

Headlines for Monday Mar. 27, 2023

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MIPI A-PHY Specification Levels Up In-Vehicle Connectivity

In a Q&A, the MIPI A-PHY working group chairs weighed in on the future of A-PHY and MASS. Edo Cohen of Valens and Raj Kumar Nagpal of Synopsys are co-chairs of the working group, and Ariel Lasry of Qualcomm serves as vice chair.

• 2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports
• Designing MPUs/MCUs with Functional Safety
• Sensor Fusion Explores AI to Prep for ADAS, AV Designs
• Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 22nm ULP is Available for Immediate Licensing for Smart Audio Chipsets

Headlines for Friday Mar. 24, 2023

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Alphawave Semi Opens Pune Office, Continues Expansion into India

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity for the world’s technology infrastructure, today announced the opening of its latest office in Pune, India, bolstering its existing footprint in the country and growing its capabilities in custom silicon and connectivity IP.

Headlines for Thursday Mar. 23, 2023

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OPENEDGES Completes the Tapeout of the 7nm HBM3 Memory Subsystem (PHY & Memory Controller) Test chip

OPENEDGES Technology, Inc. (OPENEDGES) today released a detailed update on the successful completion of the first tape out of an advanced 7nm process technology test chip for its HBM3 memory subsystem IP, including the PHY and memory controller.

• SynSense closes USD$10m Pre-B+round to bring their ultra-low-power vision processing SOC "Speck™" to mass production
• Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports
• Andes Custom Extension™ (ACE) Supports AndesCore™ 45-Series Processors to Provide Flexible Acceleration
• CEO Interview: Ian Lankshear, EnSilica
• Renesas to Acquire Panthronics to Extend Connectivity Portfolio with Near-Field Communication Technology

Headlines for Wednesday Mar. 22, 2023

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SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators

SoftBank Corp. ("SoftBank") and EdgeCortix Inc. ("EdgeCortix") announced they collaborated for technology development to improve the performance efficiency of wireless accelerators*1 by using EdgeCortix IP (intellectual property) solutions, which is characterized by high-speed processing and low power consumption applied to AI.

• BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions

Headlines for Tuesday Mar. 21, 2023

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Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation

Through this collaboration Agile Analog will make its pioneering analog IP product portfolio available to the IFS ecosystem to help drive forward innovation in semiconductor design.

• SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications
• Omni Design Opens Design Center in Hyderabad, India

Headlines for Monday Mar. 20, 2023

• TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK
• Remote.It Simplifies Secure Access to Arm Virtual Devices
• 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc

Headlines for Friday Mar. 17, 2023

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CoreHW secures €4M investment to accelerate growth in indoor positioning solutions

At CoreHW, we are proud to have developed one of the world’s most accurate and reliable Bluetooth indoor positioning solutions. Our technology has been received positively by customers, who have begun investing in product development and commercialization of their own solutions using our technology.

• M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year

Headlines for Thursday Mar. 16, 2023

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intoPIX revolutionizes the gaming experience at GDC 2023: Image quality BEYOND reality

At GDC 2023, intoPIX showcases its new concept for Wireless Displays with its unique TicoXS FIP compression. The revolutionary TicoXS FIP technology seamlessly connects displays wirelessly with latency below 1 millisecond and pixel-perfect quality.

Headlines for Wednesday Mar. 15, 2023

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Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development

Signature IP’s initial products are focused on fast and flexible implementation of Networks-on-Chip (NoCs), with future products enabling a platform-based approach to SoC development which is physically-aware and NoC-aware, delivering industry-standard interfaces and interconnect within and between silicon dies.

• proteanTecs Collaborates with BAE Systems to Enable a Zero Trust Supply Chain for Defense Applications
• VeriSilicon delivered multi-format hardware video decoder Hantro VC9000D supporting 8K@120FPS VVC/H.266 to customers
• Ashling and Imagination announce Ashling's RiscFree™ C/C++ SDK support for RISC-V-based Catapult family
• Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023

Headlines for Tuesday Mar. 14, 2023

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Codasip and IAR demonstrate dual-core lockstep for RISC-V

Codasip and IAR deliver new possibilities for low-power embedded automotive applications through the award-winning Codasip L31 core and the safety-certified version of the development toolchain IAR Embedded Workbench for RISC-V.

• Creonic Today Revealed Its New CCSDS 131.2 Wideband Demodulator IP Core with Immediate Availability
• ASUS IoT Announces Tinker V
• VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge
• At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM
• SPARK Microsystems Announces CDN$48 Million Financing Led by Idealist Capital
• Imagination and Telechips drive automotive display diversity with hardware virtualization
• Imagination and CoreAVI partner for safety-critical automotive graphics applications

Headlines for Monday Mar. 13, 2023

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CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC

CEVA today announced that Beijing ESWIN has licensed and deployed the RivieraWaves Wi-Fi 6 1x1 IP platform in its ECR6600 smart connectivity IC targeting smart homes, smart transportation, industrial IoT and more.

• Rambus Expands Industry-Leading Security IP Portfolio with Arm CryptoCell and CryptoIsland IP
• Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce
• Imperas Collaborates with MIPS and Ashling to Accelerate RISC-V Application Software Development from SoC Concept to Deployment
• Intrinsic ID Launches Software to Protect Billions of Smart, Connected Devices Addressing Worldwide Cybersecurity Challenges
• TSMC February 2023 Revenue Report
• Veriest Solutions and Neuronix AI Labs Collaborate for Neural Network Acceleration
• Mythic Raises $13 Million to Bring Its Next-generation Analog Computing Solution to Market
• Intrinsic Semiconductor Technologies Secures £7m Investment to Solve the Memory Bottleneck for Data Hungry Applications
• BrainChip integrates Akida with Arm Cortex-M85 Processor, Unlocking AI Capabilities for Edge Devices
• 1G Ethernet PHY IP Cores is now available with Blackbox licensing option in various technology nodes for advanced networking applications

Headlines for Friday Mar. 10, 2023

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EU Chips Act: Key Intellectual Property Considerations

This article highlights some of the key areas that semiconductor companies should be thinking about ahead of the act’s coming into force.

• Cadence Verisium AI-Driven Verification Platform Accelerates Debug Productivity for Renesas
• ASICFPGA releases new ISP core supporting AXI4-Lite, AXI4-Stream, new AE, and new AWB
• AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology

Headlines for Thursday Mar. 09, 2023

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CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications

RivieraWaves™ UWB Radar delivers robust sensing of object movements and breathing micro-movements for a wide suite of applications, including automotive child presence detection and gesture control, cot infant monitoring, and power-saving presence detection in laptops, TVs and smart buildings

• TSMC's 3-nm progress report: Better than expected
• ProvenRun and SiFive deliver RISC-V-based secure Trusted Execution Environment (TEE)
• Imagination launches its first edge AI course
• Think Silicon to Showcase its Latest Ultra-Low-Power Graphics and AI Solutions for Edge Computing at Embedded World 2023
• Blueshift Memory to use Codasip custom compute to develop new memory-efficient processor technology
• GOMACTech 2023: Menta, a major player in semiconductors for the defense industry
• IAR Enables Robust End-to-End Embedded Security Solution with the Launch of IAR Embedded Trust
• Atlas Credit Partners Provides $85MM Investment in Coherent Logix
• QuantWare lands €6 million to roll out groundbreaking quantum processors
• CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023
• Defacto's SoC Compiler 10.0 is Released
• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World

Headlines for Wednesday Mar. 08, 2023

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CAST Announces Very Versatile I2S-TDM Digital Audio Transceiver IP Core

Extremely configurable transceiver core can provide an efficient serial audio interface for nearly every system and application.

• Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit
• Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers
• sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs
• Orca Launches ORC5000 Platform for Low-Power ASIC Designs
• proteanTecs Joins Intel Foundry Services (IFS) Accelerator IP Alliance Program

Headlines for Tuesday Mar. 07, 2023

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Weebit Nano ReRAM IP now available in SkyWater Technology's S130 process

Weebit Nano Limited (ASX:WBT), a leading developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, announce availability of Weebit’s resistive RAM (ReRAM) IP in SkyWater’s 130nm CMOS (S130) process.

• Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology
• Weebit Nano partners with University of Florida's Nino Research Group to examine effects of radiation on Weebit ReRAM
• Sondrel extends multi-year, multi-million dollar EDA license with Synopsys
• intoPIX showcases its innovative image processing and compression solutions for human & machine vision at Embedded World 2023
• Andes Technology's N25F RISC-V Processor Enables Superior Immersive Scenarios for ASPEED Technology's Powerful Image Stitching SoC AST1230
• Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production
• DVB-T2 Demodulator + Decoder LDPC/ BCH IP Core Available For Immediate Implementation From Global IP Core

Headlines for Monday Mar. 06, 2023

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Arm priced at $30-70bn

Bankers are putting a valuation on Arm when it re-lists on the BYSE that stretches from $30 billion to $70 billion, reports Bloomberg.

• GUC Monthly Sales Report - February 2023
• Chevin Technology partners with Intel®
• UMC Reports Sales for February 2023
• Alphawave Semi Opens Ottawa Office, Expanding Canadian Presence and Technical Leadership
• OPENEDGES Announces LPDDR5X/5/4x/4 PHY Tapeout at 7nm process node
• Global Semiconductor Sales Decrease 5.2% Month-to-Month in January
• New controller IP core for secure data
• Spectral Design & Test Announces AI/ML Based Breakthrough Technology to Do Fast and Accurate Characterization & Validate Memory Compilers
• BrainChip Introduces Second-Generation Akida Platform
• DCD Presents RISC-V, Automotive & Cyber during Embedded World 2023
• Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions
• JEDEC Creates New Automotive Steering Subcommittee
• Unlocking Lightning-Fast Data Transfer: USB 3.2 Gen2x2 total solution for Host and Device functionalities in 28nm HPC+ technology

Headlines for Friday Mar. 03, 2023

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CAST Enhances RISC-V Processor Line for Low-Power and Functional Safety Applications

Semiconductor intellectual property provider CAST today announced the immediate availability of a new deeply embedded, low-power RISC-V processor IP core and enhancements to its functional safety RISC-V processor IP core.

Headlines for Thursday Mar. 02, 2023

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Arm to list in New York

Arm will go public on the New York stock exchange and not share a dual listing with the London Stock Exchange, reports Bloomberg.

• Safety element for automobiles, production or health can be implemented on the own microcontroller chip: RISC-V processor AIRISC-SAFETY from Fraunhofer Institute for Microelectronic Circuits and Systems IMS
• New Wave Design and Verification Appoints Marti Nyman as President and CEO
• UMC Introduces New 28eHV+ Platform for Wireless, VR/AR, and IoT Display Applications
• SiFive Adds Adam Dolinko as Chief Legal Officer and SVP of Corporate Development
• HDL Design House has opened New design center in Niš - Serbia
• Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C

Headlines for Wednesday Mar. 01, 2023

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Omni Design Technologies Awarded ISO 9001 Certification

Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual Property (IP) solutions today announced that it has received ISO 9001 certification for the design and development of high performance, ultra-low power IP cores.