D&R Headline News (May 2023)

Headlines for Wednesday May. 31, 2023

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Intel Foundry Services Ushers in a New Era

In April, Intel Foundry Services (IFS) and Arm announced a multigenerational agreement to enable chip designers to build low-power compute system-on-chip (SoCs) on Intel technology. We are excited to provide our customers with the opportunity to design their mobile SoCs on Intel’s leading-edge 18A process technology paired with the latest, most powerful Arm CPU core — the recently launched next-generation Cortex-X4 — for improved power and performance.

• Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future
• Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era

Headlines for Tuesday May. 30, 2023

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SDIC Licenses 8051 Microcontroller IP Cores from CAST

CAST today announced that Hangzhou SDIC Microelectronics Inc. — a leading analog mixed-signal IC design and fabless semiconductor vendor — has licensed 8051 microcontroller IP cores from CAST for a new suite of chips now under development.

• U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility
• MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities of its New High-Performance eVocore P8700 RISC-V Multiprocessor
• Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
• AndeSentry™ Collaborative Framework Enables Comprehensive RISC-V Security Solutions

Headlines for Monday May. 29, 2023

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New Arm Total Compute Solutions enable a mobile future built on Arm

Today we are announcing Arm Total Compute Solutions 2023 (TCS23), which will be the platform for mobile computing, offering our best ever premium solution for smartphones. TCS23 delivers a complete package of the latest IP designed and optimized for specific workloads to work seamlessly together as a complete system.

• Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
• M31 Technology: Q1 EPS NT$2.24, Up 75% YoY, Revenue Growth for the 19th Consecutive Month
• MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry
• Socionext Introduces Ultra-compact, Ultra-low-power 60GHz Radio-frequency Ranging Sensors for Automotive Applications
• SiFive Gives WorldGuard to RISC-V International to Make this Robust Security Model More Accessible to the RISC-V Community
• JESD204C PHY & Controller IP Cores with proven automotive compatibility are instantly licensable for extremely reliable performance for your SOC's

Headlines for Thursday May. 25, 2023

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Nanusens announces that it can now create ASICs with embedded sensors

Now both sensor and its control circuit can be shrunk simultaneously as IP blocks to required CMOS process node to create ASICs with integrated sensors

• Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement
• China bars Micron ICs destined for key infrastructure
• TSMC lays out a killer roadmap
• Crypto Quantique signs first major client in Taiwan
• DRAM Industry Q1 Revenues Decline 21.2% QoQ, Marking Third Consecutive Quarter of Downturn, Says TrendForce
• FIVEberry Establishes Broad and Easy Access to RISC-V Technology
• JEDEC Publishes Major Update to JEP30 PartModel Guidelines
• Alphawave Semi has published its audited results for the year ended 31 December 2022

Headlines for Wednesday May. 24, 2023

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Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets

Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest successful silicon bring-up of its advanced 2-16 Gbps BlueLynx D2D interconnect IP in a 12nm test chip.

• Experts Weigh Impact of Intel-Arm Collaboration
• Apple announces multibillion-dollar deal with Broadcom for components made in the USA
• BrainChip and CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing

Headlines for Tuesday May. 23, 2023

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Imagination launches IMG CXM, the smallest GPU to bring effortless user interfaces into homes

Imagination Technologies is bringing seamless visual experiences to cost-sensitive consumer devices with the new IMG CXM GPU range which includes the smallest GPU to support HDR user interfaces natively.

• Intel Launches Agilex 7 FPGAs with R-Tile, First FPGA with PCIe 5.0 and CXL Capabilities
• PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s
• Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices

Headlines for Monday May. 22, 2023

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CEVA and proteanTecs Announce Partnership to Optimize Reliability and Power of Complex SoCs

proteanTecs and CEVA have announced a partnership to enhance the reliability and power/performance of advanced chips by combining CEVA’s leading IP platforms with proteanTecs’ deep data analytics.

• Fabless Semiconductor Innovator Stathera Announces US $15M Series A Funding Round
• We don't compete with our customers - TSMC
• NVIDIA Grace Drives Wave of New Energy-Efficient Arm Supercomputers
• New £1 billion strategy for UK's semiconductor sector
• Quadric's DevStudio Speeds Software Development with Industry's First Integrated ML + DSP Cloud-Based Code Development Platform
• Syntiant's Deep Learning Computer Vision Models Deployed on Renesas RZ/V2L Microprocessor
• Axelera AI Raises $50M to Democratize Edge AI
• Audio Pioneer xMEMS Announces General Availability of the World's Only All-Silicon, Solid-State Fidelity Micro Speakers
• USB 4.0 Host and Device Controller IP Cores unleashing the Power of High-Speed Connectivity with tunnelling of Display Port and PCIe is now available for Licensing

Headlines for Friday May. 19, 2023

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K-Best MIMO Decoder IP Core Available For Immediate Integration From Global IP Core

The MIMO Decoder accepts two independent input streams, and the channel estimation matrix. The inputs to the MIMO Decoder are the estimated channel matrix and the received vector of symbols.

Headlines for Thursday May. 18, 2023

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proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment

proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that the company’s die-to-die interconnect monitoring agents passed the pre-silicon IP assessment stage in the TSMC9000 quality program.

• SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2023
• Rambus and Socionext Renew Patent License Agreement
• Arasan Announces immediate availability of its SUREBOOT™ Total xSPI PHY IP

Headlines for Wednesday May. 17, 2023

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Arasan announces the immediate availability of its 2nd Generation MIPI D-PHY for GlobalFoundries 22nm SoC Designs

Arasan Chip Systems announces the immediate availability of its 2nd generation MIPI D-PHY IP products supporting MIPI D-PHY v1.1 at upto 1.5gbps and MIPI D-PHY v1.2 supporting speeds of upto 2.5gbps for GlobalFoundries 22nm SoC designs redesigned for ultra low power consumption and area.

• Weebit Nano to present recent ReRAM-based developments at the International Memory Workshop (IMW) 2023
• Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
• Ansys Signs Definitive Agreement to Acquire Diakopto, Expands Multiphysics Simulation Portfolio for Semiconductor Designers
• VESA Updates Adaptive-Sync Display Standard with Tighter Specifications
• BrainChip and Teksun Demonstrate Rapid Adoption of AI Solutions at Embedded Vision Summit
• MIPI DevCon Returns to Silicon Valley to Explore MIPI in Automotive, IoT and Mobile

Headlines for Tuesday May. 16, 2023

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BrainChip and Quantum Ventura Partner to Develop Cyber Threat Detection

BrainChip announced today Quantum Ventura Inc., a San Jose-based provider of AI/ML research and technologies, will use BrainChip’s Akida™ technology to develop new cyber threat-detection tools.

• NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM

Headlines for Monday May. 15, 2023

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Andes Technology Announces The New Product Line, AndesAIRE™, Ultimately Efficient AI/ML Solutions For Edge And End-Point Inference

Andes Technology today announced the launch of new product line, AndesAIRE™ or Andes AI Runs Everywhere, ultimately efficient solutions designed for edge and end-point inference, including the first generation of AI/ML hardware accelerator intellectual property (IP), the AndesAIRE™ AnDLA™ I350 (Andes Deep Learning Accelerator), and the neural network software tools and runtimes, the AndesAIRE™ NN SDK.

• AccelerComm secures £21.5m funding to supercharge 5G radio performance
• Indian chip startups get seed funds from Sequoia Capital
• Ethernovia Raises $64 Million to Accelerate the Revolution of Vehicle Networks
• proteanTecs to Present in Open Compute Project (OCP) Webinar on Silent Data Errors for Resilient Data Centers
• Upgrade Your Display and Camera SOC's with proven MIPI C-D Combo PHY and CSI / DSI Controller IP Cores for both Tx and Rx

Headlines for Thursday May. 11, 2023

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Arteris Selected by BOS Semiconductors for Next-Generation Automotive Chips

Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that BOS Semiconductors has licensed Arteris products for next-generation automotive SoCs.

• SMIC Reports 2023 First Quarter Results
• Canonical enables Ubuntu on StarFive's VisionFive 2 RISC-V single board computer
• BrainChip Showcases Edge AI Technologies at 2023 Embedded Vision Summit
• Kalray, Arteris, Secure-IC, and Thales, Win the Call for Projects Related to the AI Acceleration Strategy of the "France Relance 2030 - Future Investments" Plan
• Alphawave Semi Update on Audit Process
• CryoCMOS Consortium develops 4K & 77K transistor models to enable CryoIP development

Headlines for Wednesday May. 10, 2023

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CEVA Acquires Spatial Audio Business from VisiSonics to Expand its Application Software Portfolio for Embedded Systems targeting Hearables and other Consumer IoT Markets

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today announced the acquisition of the RealSpace® 3D Spatial Audio business, technology and patents from VisiSonics Corporation.

• TSMC April 2023 Revenue Report
• CEVA, Inc. Announces First Quarter 2023 Financial Results
• Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard
• OPENEDGES' 12nm LPDDR5/4x/4 PHY is Ready for Mass Production by Novachips' SSD
• Upgrade To Solid Sands' Latest SuperTest Version Supports Andes To Its Ambitions For Further Growth In The Automotive Sector
• StarIC appoints Redtree Solutions as Sales Representative in Pan-Europe

Headlines for Tuesday May. 09, 2023

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FuriosaAI Enhances Next-Generation AI Chips with proteanTecs' Deep Data Analytics

South Korean AI semiconductor startup leverages system health and performance monitoring to gain unparalleled visibility inside each device

• Qualcomm to Acquire Autotalks

Headlines for Monday May. 08, 2023

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Flex Logix Cancels AI Chip, Markets IP for AI and DSP

Flex Logix, an eFPGA company, has stopped selling its InferX X1 AI accelerator chip, and will instead bring the architecture to market as licensable IP, Flex Logix CEO Geoff Tate told EE Times.

• IC designers leave Graphcore for Meta
• Arteris Announces Financial Results for the First Quarter 2023 and Estimated Second Quarter and Full Year 2023 Guidance
• GUC Monthly Sales Report - April 2023
• BrainChip Joins Arm Tech Talk to Discuss Cutting-Edge AI Solutions that Deliver Exceptional Performance and Efficiency
• LC3plus audio codec optimized for ARM®, RISC-V, HI-FI & Kalimba™ DSPs for Bluetooth® LE Audio are available for Immediate Licensing

Headlines for Friday May. 05, 2023

• UMC Reports Sales for April 2023

Headlines for Thursday May. 04, 2023

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NEO Semiconductor Launches Ground-Breaking 3D X-DRAM Technology, A Game Changer in the Memory Industry

NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced the launch of its ground-breaking technology, 3D X-DRAM™.

• Alphawave IP Group Plc Announces CFO Transition

Headlines for Wednesday May. 03, 2023

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Via Licensing and MPEG LA Unite to Form Via Licensing Alliance, the Largest Patent Pool Administrator in the Consumer Electronics Industry

New “Pool of Pools” Leverages Decades of Licensing Expertise and Economies of Scale to Further Streamline Intellectual Property Distribution for Innovators and Technology Implementers

• Via Licensing Alliance Appoints Three New Members to its Board of Directors
• UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications
• AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023
• Crypto Quantique Announces Robert Clyde as Chairman of the Board of Directors

Headlines for Tuesday May. 02, 2023

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Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets

Ncore and FlexNoC interconnect IP enable advanced Tenstorrent RISC-V computing for modular, efficient and performant next-generation AI at scale.

• Worldwide Silicon Wafer Shipments Decline in Q1 2023, SEMI Reports
• Rambus Reports First Quarter 2023 Financial Results
• Global Semiconductor Sales Decrease 8.7% in First Quarter; March Sales Tick Up Month-to-Month for First Time Since May 2022
• BrainChip Pushes the Edge in 2023 with Akida Innovations, Expanded Partner Ecosystem
• PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab

Headlines for Monday May. 01, 2023

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Softbank files to list Arm on the Nasdaq

SoftBank has filed for a public offering of Arm shares on the Nasdaq.

• Electronic System Design Industry Logs $3.9 Billion in Revenue in Q4 2022, ESD Alliance Reports
• Processor Startup Innovates Memory Allocation Management
• EC approves €7.4bn subsidy for ST-GloFo JV fab
• TSMC's 3-nm Push Faces Tool Struggles
• Samsung makes $3.4bn Q1 chip loss
• Cadence Reports First Quarter 2023 Financial Results
• EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering
• GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility
• Arm Announces Confidential Submission of Draft Registration Statement for Proposed Initial Public Offering
• EU-Funded NimbleAI to Deliver 3D Neuromorphic Chip
• LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!!