D&R Headline News (June 2023)

Headlines for Friday Jun. 30, 2023

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CAST Introduces New MACsec Protocol Engine IP Cores

Semiconductor intellectual property provider CAST today announced the availability of a new IP core that serves as a custom-hardware engine for the MACsec Ethernet security protocol in FPGA or ASIC designs.

Headlines for Thursday Jun. 29, 2023

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Secure-IC's Securyzr achieves ISO 26262 ASIL-D certification, reinforcing its commitment to Automotive Safety and Security

Secure-IC, the rising leader, and the unique global provider of end-to-end cybersecurity solutions for embedded systems and connected objects, announces today its Securyzr™ successfully became ISO 26262 ASIL-D certified.

• Celestial AI, the Creator of the Photonic Fabric Optical Interconnect Technology Platform, Raises $100 Million in Series B Funding
• Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor
• Cadence AI-Based Virtuoso Studio Certified for Samsung Foundry PDKs for Mature and Advanced Nodes
• Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform
• Cadence Delivers Certified, Innovative Backside Implementation Flow to Support Samsung Foundry SF2 Technology
• Cadence Digital and Custom/Analog Design Flows Certified for Samsung Foundry's SF2 and SF3 Process Technologies
• Samsung Foundry Certifies Cadence Virtuoso Studio Flow to Automate Analog IP Migration on Advanced Process Technologies
• OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification services
• Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
• Worldwide Semiconductor Foundry Market Grew 27.9% YoY in 2022, Projected to Decrease by 6.5% YoY in 2023 due to Inventory Adjustments, IDC Finds
• AMD Introduces World's Largest FPGA-Based Adaptive SoC for Emulation and Prototyping
• Quadric Joins the Silicon Catalyst In-Kind Partner Ecosystem
• Weebit Nano's ReRAM IP now fully qualified in SkyWater Technology's S130 process
• Intel and Movellus Develop Different Fixes For IC Voltage Droop
• Bluespec Launches New MCUX RISC-V Processor That Enables Developers to Implement Custom Instructions and Add Accelerators
• Ansys and Synopsys Accelerate RFIC Semiconductor Design with New Reference Flow for Samsung Technology

Headlines for Wednesday Jun. 28, 2023

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CEVA Introduces Channel Sounding over Bluetooth® to Enable High-Accuracy Secure Positioning for Automotive, Industrial and the IoT Ecosystem

CEVA today announced support for Channel Sounding to its RivieraWaves Bluetooth® IP portfolio to meet the surging demand for high-accuracy secure positioning in the automotive, industrial and broader IoT markets.

• Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023
• Siemens extends support for Samsung Foundry's latest process technologies
• Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes
• Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process
• DCAN FD Full - a final step to CAN XL?
• M31 Announces New 12nm Digital PLL IP to Drive the Benefits of IoT Clock Technology

Headlines for Tuesday Jun. 27, 2023

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Dolphin Design unveils an innovative IP for sound classification cutting down energy by 99%

Dolphin Design, a leader in semiconductor IP solutions for power management, audio, and processing with ASIC design services, today announced the launch of WhisperExtractor, a game-changer mixed-signal IP for the voice and audio-enabled SoCs.

• YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets
• MAXEYE License and Deploy CEVA Sensor Fusion Software in Digital Pen for Leading Global Mobile OEM
• Arasan furthers the compliance of their I3C IP with its participation in the I3C Interop at MIPI Member Meeting
• Blue Pearl Software and NanoXplore SAS team to Accelerate Development and Verification of Radiation Hardened FPGA Designs
• Andes Technology Unveils the Annual Andes RISC-V CON, Scheduled for June 27th at the San Jose Airport DoubleTree Hotel
• Comcores Unveils JESD204 IP Core Integration Guide to Streamline Customer PHY Integration Challenges
• Logic Fruit Technologies: Exhibiting and Showcasing Cutting-Edge Solutions at Design Automation Conference (DAC) 2023

Headlines for Monday Jun. 26, 2023

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SEMIFIVE announces commercialization of its 5nm HPC SoC Platform with lead partner Rebellions, AI Chipmaker startup based in Korea

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced successful commercialization of its 5nm HPC SoC Platform with its lead partner Rebellions, an AI hardware and software solution startup.

• How Will 5G Advanced Change RF Design?
• Rapidus CEO Chasing Single-Wafer-Processing Dream
• DB GlobalChip Deploys Cadence's Spectre FX and AMS Designer, Accelerating IP Verification by 2X
• BrainChip Selects IPro Silicon IP to Serve Israel's high growth AI market
• 12Bit ADC and DAC IP Cores with High-Speed, High-Performance for Wireless applications that requires RF are available for immediate licensing

Headlines for Friday Jun. 23, 2023

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aiMotive achieves an industry first milestone with ISO26262 ASIL B certification for aiWare4 NPU IP

We are thrilled to announce that our aiWare4 Neural Processing Unit (NPU) has achieved ISO 26262 ASIL B certification – making it the world’s first ASIL B certified NPU IP in the industry.

Headlines for Thursday Jun. 22, 2023

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Codasip partners with SmartDV to accelerate chip design projects

Codasip, the leader in RISC-V custom compute, today announced that it has selected SmartDV Technologies as its preferred provider of peripheral design IP. Codasip’s customers can now license a selection of SmartDV peripheral IP under a single license agreement and contract.

• DRAM Alternative Spawns U.K. Startup
• Intel Provides Update on Internal Foundry Model

Headlines for Wednesday Jun. 21, 2023

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OPENEDGES Achieves Tapeout of LPDDR5x/5/4x/4 PHY IP on 5nm SF5A Process Technology

OPENEDGES Technology is proud to announce today a groundbreaking achievement: the tapeout of 8,533 Mbps LPDDR5x/5/4x/4 PHY IP on Samsung Foundry 5nm SF5A process technology.

Headlines for Tuesday Jun. 20, 2023

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Quadric Announces Vision Transformer Support for Chimera GPNPUs

Quadric® today announced that its ChimeraTM general purpose neural processing unit (GPNPU) processor intellectual property (IP) supports vision transformer (ViT) machine learning (ML) inference models.

• Global Top Ten IC Design Houses Break Even in Q1, Hope for Recovery in Q2 Bolstered by AI Demand, Says TrendForce
• Can Any Novel Architecture Topple the Mighty GPU?

Headlines for Monday Jun. 19, 2023

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Chips Acts' Role in Reshaping a Global Industry

As the world has navigated multiple macroeconomic and geopolitical challenges in recent years, one thing has become clear to global leaders: Semiconductors are indispensable.

• MosChip Announces the appointment of Semiconductor Industry Veteran Dr. Naveed Ahmed Sherwani to the Board of Directors
• Blueshift Memory and Crypta Labs to develop quantum-resilient cybersecurity memory module
• SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM
• Introducing T2M's Key IP Cores Empowering AI Chipsets and unleashing the true AI Potential

Headlines for Friday Jun. 16, 2023

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Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle

Creonic GmbH, a leading IP core provider in the field of communications, today announced immediate availability of its Ultrafast BCH Decoder. Its unique pipeline architecture allows it to decode one BCH codeword per clock cycle, achieving tremendous data rates.

• DFSPI IP Core from DCD supports all serial memories available on the market.
• M31 Has Expanded MIPI IP Portfolio, Successfully Validated 7nm MIPI C/D PHY Combo IP

Headlines for Thursday Jun. 15, 2023

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Secure-IC & NSITEXE extend strategic partnership to provide security solutions for Cyber-Physical Systems (CPS)

The partnership consists of several major collaborations, including a best-in class Network Secure Subsystem for CPS comprising the first worldwide cybersecurity enhanced ASIL-D grade RISC-V core and a full integrated HSM (Hardware Security Module) to answer the strong challenges regarding security in automotive and industrial MCU applications.

• Samsung fab cobbling IP offerings for data-intensive SoCs
• Simplifying the Analog and Mixed-Signal IC Design Process
• MosChip's strategic initiatives in India's rising semiconductor market: acquisitions, collaborations, and innovations
• Droop response system IP made available for SoC designs
• Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
• Nanusens secures first IP license for its revolutionary MEMS-in-ASICs™ sensor technology
• Cadence Announces $200 Million Accelerated Share Repurchase Agreement
• Capturing Innovation: Logic Fruit Technologies Triumphs with ARINC 818 Video Processing and Switching Module Copyright

Headlines for Wednesday Jun. 14, 2023

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Alphawave Semi Expands Collaboration with Samsung, Adds 3nm Connectivity IP to Meet Accelerated AI and Data Center Demand

3nm Connectivity IP Unleashes Unprecedented Performance in Chiplet-Enabled Silicon Platforms to power next generation AI and data centers

• proteanTecs Achieves ASIL-B Automotive Functional Safety Certification
• Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
• Signature IP chooses IPro for Sales Representation in Israel
• Intel talking to Arm about becoming an anchor investor in Arm IPO
• Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
• Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
• Chiplets advancing one design breakthrough at a time
• PCI-SIG® Announces New Research Projecting PCI Express® Technology TAM Expected to Reach $10 Billion by 2027
• Exec tried to set up copy-cat Samsung fab in China

Headlines for Tuesday Jun. 13, 2023

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Movellus Announces Industry-First Integrated Droop Response System for SoCs

Movellus, today announced an industry-first integrated droop response system. This innovative solution is designed to simultaneously address the challenges of voltage droop and enable fine-grained DVFS capability, which in combination can significantly reduce the power consumption of complex integrated circuits while increasing operational reliability.

• Tachyum Among Recipients of 8.1 Billion Euro IPCEI Grant
• First Generation SiMa.ai Edge AI Platform Enters Mass Production Amidst Surge in Company Momentum
• Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
• AONDevices Introduces Breakthrough Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement
• Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs
• BittWare selects EdgeCortix's SAKURA-I AI Processors as its Edge Focused Artificial Intelligence Acceleration Solution
• Efabless Reveals Winners of AI-Generated Silicon Design Challenge

Headlines for Monday Jun. 12, 2023

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Top 10 Foundries Report Nearly 20% QoQ Revenue Decline in 1Q23, Continued Slide Expected in Q2, Says TrendForce

TrendForce reports that the global top 10 foundries witnessed a significant 18.6% QoQ decline in revenue during the first quarter of 2023.

• Intel German fab in doubt
• Securing Embedded Systems - Making it the Norm
• SynSense releases the Speck™ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications
• Jim Keller on AI, RISC-V, Tenstorrent's Move to Edge IP
• BrainChip Examines New Approach to Optimizing Time-series Data
• Apple completes its ARM lineup with 5nm, 134billion transistor M2 Ultra

Headlines for Friday Jun. 09, 2023

• TSMC May 2023 Revenue Report
• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology

Headlines for Thursday Jun. 08, 2023

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Leading Aerospace and Defense Company purchases Interlaken IP core from Comcores

A leading company in the defense and aerospace industry, has purchased the Interlaken IP core from Comcores to meet its high-speed data transfer requirements. This strategic investment aims to enhance data transfer capabilities in both their Application-Specific Integrated Circuit (ASIC) and Field-Programmable Gate Array (FPGA) implementations utilizing speeds of 256 Gbps.

• Cortus Launches ULYSS automotive MCU family
• Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
• Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports
• Computex 2023 Reveals Taiwan's Critical Role in AI
• Arasan announces the Industry's First CAN FD Light Bus Controller IP

Headlines for Wednesday Jun. 07, 2023

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intoPIX and PlexusAV Pioneer IPMX Standard-Based AV-over-IP Solutions

intoPIX is pleased to announce the integration of its advanced TicoXS FIP IP core into the new PlexusAV AVN4 4K transceiver, based on SMPTE ST2110, which eliminates the stress of selecting an AV-over-IP technology by leveraging a standards-based solution.

• Arm SystemReady surpasses 100 certifications, driving standardization where it matters
• Green Hills Software adds support for production-ready RTOS and tools to Imagination Technologies' RISC-V CPUs
• Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing
• Global Semiconductor Sales Increase 0.3% Month-to-Month in April
• Defacto will celebrate its 20th anniversary at DAC with customer presentations and major technical announcements
• S2C Accelerates Development Timeline of Bluetooth LE Audio SoC

Headlines for Tuesday Jun. 06, 2023

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VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution

VeriSilicon (688521.SH) today announced its complete Bluetooth Low Energy (BLE) solution has passed the Bluetooth 5.3 certification issued by Bluetooth SIG. This complete BLE solution integrates VeriSilicon’s self-developed radio frequency (RF) IP, baseband IP, and software protocol stack, offering a one-stop solution compliant with the Bluetooth Core Specification Version 5.3.

• UMC Reports Sales for May 2023
• Actions Technology Partners with PUFsecurity to Secure Wireless Bluetooth and IoT Applications
• Marquee Semiconductor Acquires Semikunn Technology Services, Expanding Design Services Portfolio

Headlines for Monday Jun. 05, 2023

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Agile Analog launches first complete RISC-V analog IP subsystem at RISC-V Summit Europe

The initial subsystem includes all the analog IP required for a typical battery powered IoT system, including a power management unit (PMU), a sleep management unit (SMU), and data converters. This unique, process agnostic, customizable and digitally wrapped analog IP subsystem will help solve many of the issues that System on Chip (SoC) designers currently encounter, as it pairs with a RISC-V core to form a complete solution.

• GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France
• Microchip Slashes Time to Innovation with Industry's Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools
• Consortium's Move Will Boost RISC-V Ecosystem, Thankfully
• Are Chiplets Enough to Save Moore's Law?
• Andes Technology Showcases Pioneering RISC-V CPU IP Solutions at RISC-V Summit Europe
• GUC Monthly Sales Report - May 2023
• BrainChip and Lorser Industries to Develop Neuromorphic Computing Systems for Software-Defined Radio Devices
• Imperas at the RISC-V Summit Europe, June 5-9 2023
• Dolphin Design Selects Imperas for Processor Functional Design Verification
• Silicon Proven 12bit 1Gsps DAC IP Core designed for Wireless RF Applications is available for immediate license

Headlines for Friday Jun. 02, 2023

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Axiomise Launches Next-Generation formalISA App for RISC-V Processors

Axiomise, the leading provider of cutting-edge formal verification solutions that include training, consulting, services and custom apps, today launched its next-generation formalISA® app with open-source, formally verified RISC-V processors such as cv32e40p and WARP-V.

Headlines for Thursday Jun. 01, 2023

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Semidynamics announces largest, fully customisable Vector Unit in the RISC-V market, delivering up to 2048b of computation per cycle for unprecedented data handling

Semidynamics has announced its new, entirely customisable Vector Unit to go with its innovative range of fully customisable 64-bit RISC-V cores. The Vector Unit is totally compliant with the RISC-V Vector Specification 1.0 with many, additional, customisable features to provide enhanced data handling capabilities.

• NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
• UltraRISC Selects Valtrix STING for Verification of RISC-V SoC Designs
• The game-changing addition of intoPIX JPEG XS codec by Providius heralds a new era of IP media analysis
• Xiphera extends its Transport Layer Security product family
• Tachyum Testing Applications on Prodigy FPGA
• Vtool appoints Incusolution to be its sales-channel partner in Korea
• University of Oklahoma Joins the BrainChip University AI Accelerator Program
• Industry Leaders Launch RISE to Accelerate the Development of Open Source Software for RISC-V
• The Six Semiconductor of OPENEDGES Joins Canada's Semiconductor Council