D&R Headline News (July 2023)

Headlines for Monday Jul. 31, 2023

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Weebit Nano: Q4 FY23 Quarterly Activities Report

Weebit Nano Ltd (ASX: WBT, Weebit or Company) is pleased to provide this activity report for the quarter ended 30 June 2023 (Q4 FY23), along with the Company’s Appendix 4C cash flow report.

• Remi El-Ouazzane: "A Tsunami of TinyML Devices is Coming"
• PCIe Eyes Road Ahead with AI, Automotive
• Huawei planning on using SMIC to fab 7nm ICs this year
• Terapines ZCC Toolchain Fully Supports Andes RISC-V Processors
• Production-proven CAN Controller IP Core, equipped with a Safety package (Safe DCAN-FD, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing
• America Faces Significant Shortage of Tech Workers in Semiconductor Industry and Throughout U.S. Economy

Headlines for Thursday Jul. 27, 2023

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Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s

Creonic, a leading provider of state-of-the-art IP cores for digital communications, proudly announces the launch of its latest innovation, the CCSDS 131.2 Wideband Modulator IP core.

• A methodology for turning an SoC into chiplets

Headlines for Wednesday Jul. 26, 2023

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Intrinsic ID Announces QuiddiKey 100 - Providing a Strong Root of Trust Solution for Internet Connected Devices

QuiddiKey 100 enables all semiconductors – even the smallest microcontrollers with limited resources – to create a hardware-based root of trust, without the need for dedicated silicon.

• Worldwide Silicon Wafer Shipments Rise in Q2 2023, SEMI Reports
• Two IP announcements herald a new normal in chip world
• Arm and industry leaders launch Semiconductor Education Alliance to address the skills shortage

Headlines for Tuesday Jul. 25, 2023

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YorChip launches UniPHY™ - the first dual-use PHY for Chiplets

YorChip, Inc. today launched its patent pending UniPHY™️ dual-use PHY which enables developers to support both traditional Chiplet substrate-based packaging as well as Chip Scale Packaging for use on traditional printed circuit boards.

• Mobiveil and InPsytech Announce Successful Inter-Op Verification of Enterprise Flash Controller Design IP and ONFI 5.1 PHY IP
• Faraday Reports Second Quarter 2023 Results

Headlines for Monday Jul. 24, 2023

• Has the electronics market bottomed out?
• Chip Experts See Talent Shortage as Main Growth Hurdle
• Could AMD use IFS?
• 12bit 640Msps Dual-Channel IQ ADC High-Speed/High-Performance IP Cores for WiFi 6 RF SoC is available for immediate licensing

Headlines for Friday Jul. 21, 2023

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Cadence to Acquire Rambus PHY IP Assets

Cadence Design Systems and Rambus today announced that they have entered into a definitive agreement for Cadence to acquire the Rambus SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP.

• TSMC Reports Second Quarter EPS of NT$7.01

Headlines for Thursday Jul. 20, 2023

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Synopsys Accelerates Advanced Chip Design with First-Pass Silicon Success of IP Portfolio on TSMC 3nm Process

Synopsys, Inc. (Nasdaq: SNPS) technology is unleashing a new wave of advanced designs with the industry's broadest portfolio of interface IP for the TSMC N3E process. Silicon success of Synopsys IP across multiple product lines, including the most widely used protocols, delivers leading power, performance, area (PPA) and latency.

• Arm expands open-source partnerships to reinforce commitment to open collaboration
• SK hynix adopts Siemens' Polarion to help gain Korea's first ASPICE certification
• Thalia Secures $2.7 Million Funding to Strengthen Position as Leading IP Reuse Partner for Semiconductor Industry
• BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning
• Semidynamics announces fully customisable, 4-way, Atrevido 423 RISC-V core for big data applications

Headlines for Wednesday Jul. 19, 2023

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Lightelligence Partners With ZeroPoint Technologies to Increase Data Center Connectivity Performance by Up to 50%

Lightelligence, the global leader in photonic computing, and ZeroPoint Technologies, a leading provider of ultra-fast data compression IP, today announced a partnership to increase the bandwidth and performance of optical Compute Express Link (CXL) interconnect in data centers with data compression technology.

• Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology
• Expedera Announces LittleNPU AI Processors for Always-Sensing Camera Applications
• New Wave Design and Verification Appoints Ike Song to Advisory Committee
• VSORA Announces All-in-One Single Chip Architecture to Meet Generative AI Processing Challenges

Headlines for Tuesday Jul. 18, 2023

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DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products

Attopsemi Technology, a leading provider of OTP IP (One-Time Programmable intellectual property), announced today a series of collaboration with Denso Corporation, a global supplier of automotive technology, to upgrade 180nm SOI technology, facilitating future installations of automotive products.

• Startups Help RISC-V Reshape Computer Architecture

Headlines for Monday Jul. 17, 2023

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RED Semiconductor and Crypto Quantique agree MOU for Development of Chip with Advanced Processing Capability and Quantum-based Security

RED Semiconductor and Crypto Quantique agree MOU for Development of Chip with Advanced Processing Capability and Quantum-based Security

• GMAC Intelligence Goes Big with BrainChip Partnership
• The industry's first RISC-V IoT security chip, "Towngas Chip", had sold over 1,000,000 pieces
• Allegro DVT joins the DVB Project
• SMIC: Resignation of Chairman of the Board and Executive Director Appointment of Chairman of the Board and Change of Authorised Representative
• Accelerate the verification process of your design IP by licensing the Verification IP Cores, which come equipped with a solid track record of automotive compatibility

Headlines for Friday Jul. 14, 2023

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M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements

M31 Technology was recently invited to participate in the Design Automation Conference 2023 held in San Francisco, U.S.A. At the conference, Jayanta Lahiri, Vice President of Technical Marketing at M31, presented the latest R&D results of Intellectual Property and showcased the collaborations with Intel at the IFS (Intel Foundry Services) Theater.

Headlines for Thursday Jul. 13, 2023

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The Future of Mobility: Fraunhofer IPMS drives the Revolution in Vehicle Architecture

The vehicles of the future will be automated and networked to drive autonomously in road traffic and to relieve the driver. This requires new vehicle architectures and high-performance components. The Fraunhofer IPMS is working on various research projects to create the necessary conditions.

• Cadence Unveils Joules RTL Design Studio, Delivering Breakthrough Gains in RTL Productivity and Quality of Results
• Rambus Delivers Quantum Safe IP Solutions with Next-Generation Root of Trust for Data Center Security
• European Commission Approves Broadcom's Acquisition of VMware
• Truechip Announces First Customer Shipment Of USB4v2 Verification IP
• Global Semiconductor Equipment Sales Forecast: $87 Billion in 2023 With 2024 Rebound, SEMI Reports
• End-to-end design and verification for PCIe 6.0
• proteanTecs and Teradyne Partner to Bring Machine Learning-driven Telemetry to SoC Testing

Headlines for Wednesday Jul. 12, 2023

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Intelligent terminals applications given an innovation enhancement through AI acceleration

Imagination Technologies has announced that it has licensed the IMG Series3NX AI core to Hercules for integration into its latest programmable intelligent chip, Avatar FPGA.

• Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process
• Crypto Quantique Selected for European Innovation Council (EIC) Grant Funding
• Cycuity Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Compliance
• T2M Presents Silicon Proven MIPI D-PHY and DSI Controller IP Cores in 12FFC & 22ULL For Your Next Generation Display Products

Headlines for Tuesday Jul. 11, 2023

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Arasan's MIPI CSI-2 IP achieves ISO26262 ASIL-C Certification for MIPI C-PHY Connectivity

Arasan announces the ISO26262 ASIL-C functional certification of its latest MIPI CSI IP supporting MIPI D-PHY and C-PHY v2.0 speeds of upto 54.72Gbps

• Siemens' Calibre platform now certified for IFS' Intel 16 process technology
• Synopsys Delivers Certified EDA Flows and High-Quality IP for Intel 16 Process
• Faraday's Launched SerDes Advanced Service to Accelerate ASICs into Production
• Spectral Design & Test Inc joins TSMC OIP IP Alliance

Headlines for Monday Jul. 10, 2023

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Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP

Alphawave Semi today announced two successful tapeouts on TSMC’s most advanced 3nm process of its High Bandwidth Memory 3 (HBM3) PHY and Universal Chiplet Interconnect Express™ (UCIe™) PHY IPs, paving the way for a new generation of chiplet-enabled silicon platforms, tailored for hyperscaler and data infrastructure customers.

• TSMC June 2023 Revenue Report
• Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment
• Cadence and Imperas Support NSITEXE in the Development of Advanced RISC V Vector Processor IP for Automotive AI Applications
• Siemens unveils Calibre DesignEnhancer for Calibre correct-by-construction IC layout optimization
• Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports
• Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation
• Bespoke EDA Differentiates Silicon Chips
• Xpeedic Launches High-Speed Digital Signal Integrity, Power Integrity Suite at Design Automation Conference
• T2M invites Customers to explore High Performance, Cost-effective and Innovative IP Cores Solutions at DAC 2023

Headlines for Friday Jul. 07, 2023

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sureCore and Universal Quantum announce tape out of cryogenic IP demonstrator chip

The sureCore-led Innovate UK (IUK) - funded project “Development of CryoCMOS to Enable the Next Generation of Scalable Quantum Computers” has achieved a critical milestone with the tape out of its first cryogenic IP demonstrator chip.

• Global Semiconductor Sales Increase 1.7% Month-to-Month in May
• Efabless Corporation Launches Its Second AI-Generated Chip Design Contest

Headlines for Thursday Jul. 06, 2023

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New PNG Encoder IP Core Expands CAST's Lossless Compression Suite

Semiconductor intellectual property provider CAST today announced the availability of a PNG Encoder IP core that performs lossless image compression compliant with the ISO/IEC 15948 and RFC 2083 standards.

• Imperas Helps Navigate the Journey to RISC-V Based Silicon at DAC 2023
• Codasip welcomes Axel Strotbek as new chairman of the board
• Despite Export Ban on Equipment, China's Semiconductor Expansion in Mature Processes Remains Strong, Says TrendForce
• SilTerra Leverages Silvaco's Library Characterization and Optimization Tools to Boost Efficiency in the Development of its Foundry Standard Cell IPs
• proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023
• UMC Reports Sales for June 2023
• True Circuits Attends 60th Design Automation Conference, Celebrates 25 Years of Timing Excellence
• IC Manage GDP-XL Enterprise IP Catalog enables NXP to Improve IP Asset Management and Reuse

Headlines for Wednesday Jul. 05, 2023

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True Circuits Announces Availability of JSPICE™ Simulation and Design Environment

True Circuits announced today the availability of a beta test for its powerful simulation and design environment called JSPICE™ in advance of a full commercial release. JSPICE has been under continuous development and use by True Circuits for over 25 years to create complex analog and digital circuits and is the basis for the world-class timing and DDR PHY IP that have made True Circuits an industry leading IP company.

• Truechip: Exhibiting and Showcasing Latest Verification IPs and NOC IPs at Design Automation Conference (DAC) 2023
• EUROPRACTICE starts offering access to Pragmatic's flexible integrated circuit foundry services through imec
• Faraday to Exhibit FPGA-Go-ASIC, SONOS eFlash, and eFPGA Solutions at DAC 2023
• GUC Monthly Sales Report - June 2023

Headlines for Tuesday Jul. 04, 2023

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AI Can't Design Chips Without People

Machines are already building other machines, so it makes sense that artificial intelligence would help build the components necessary for them to exist, including processors and memory devices.

Headlines for Monday Jul. 03, 2023

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AccelerComm Announces 5G PUSCH Channel Equalizer

AccelerComm Announces 5G PUSCH Channel Equalizer Doubling Spectral Efficiency for 5G O-RAN Networks

• Tiempo Secure's new TESIC RISC-V IP successfully passes SERMA CC EAL5+ security assessment tests
• ADTechnology Joins Synopsys IP OEM Partner Program
• OPENEDGES Showcases Live Demo of PHY Vision at Design Automation Conference (DAC) 2023
• Single Carrier Modem Available For Immediate Licensing From Global IP Core
• StarFive and Youyeetoo jointly delivered the official metal case for VisionFive 2
• Synopsys and Golden Electronics Collaborate to Expand Chip Design Talent in Jordan
• Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing