D&R Headline News (August 2023)

Headlines for Thursday Aug. 31, 2023

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Allegro DVT Fosters Adoption of MPEG-5 LCEVC Video Codec, Releases a Full Range of LCEVC Products

Allegro DVT, a leading provider of Video codec compliance streams and silicon video IP solutions has launched a complete range of MPEG-5 LCEVC products comprising LCEVC compliance streams and LCEVC hardware decoder and encoder video IPs (D301 and E301).

• Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows

Headlines for Wednesday Aug. 30, 2023

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Flexibility, durability and trust - RISC-V conquers the processor market

The accessibility of RISC-V has started a revolution and, thanks to its open architecture, allows developers to design processors tailored to specific requirements. The Fraunhofer IPMS also offers a processor IP based on the RISC V instruction set architecture. The institute has extensive RISC-V expertise, which is used in research projects and is actively developed.

• GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications
• GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles

Headlines for Tuesday Aug. 29, 2023

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Driving the Custom Silicon Revolution with Arm Neoverse Compute Subsystems

At Hot Chips today, we’re introducing Arm Neoverse Compute Subsystems (CSS). With CSS, Arm is enabling our ecosystem to build specialized silicon at lower cost, with less risk and a faster time-to-market compared to discrete IP.

• QuickLogic Unveils Customizable eFPGA IP on GlobalFoundries' 12LP Process
• BrainChip and Tata Elxsi Partner to Provide Intelligent, Ultralow-Power Solutions
• GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
• Cutting-edge 18-bit 100dB Stereo Audio ADC IP Core proven in 28nm Silicon, Offering Unmatched Audio Signal Processing Capabilities is available for immediate Licensing into Audio Chipsets, Digital Cameras, and Automotive Applications

Headlines for Monday Aug. 28, 2023

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QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI/ML solutions, and YorChip, a pioneering startup specializing in UCIe-compatible IP, have formed a strategic partnership to revolutionize the world of FPGA chiplets.

• M31's EPS Soared 24.7% in H1, showing sequential growth
• Racyics becomes Arm Approved Design Partner
• oneNav's Patented pureL5 GNSS Solution Proven in Silicon
• Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
• BrainChip Receives First Shipment of AKD1500 Chips in Silicon from Technology Partner GlobalFoundries
• Huawei and Ericsson Sign Long-Term Patent Cross-Licensing Agreement
• Nuclei, the World's First RISC-V CPU IP Vendor, Accomplishes ISO 26262 ASIL-D Product Certificate
• T2M Unveils Top-Selling Gigabit Ethernet PHY IP Core with Unlimited Usage and Full Modification rights, available for licensing immediately
• GlobalFoundries Unveils Key Innovations at Technology Summit 2023

Headlines for Friday Aug. 25, 2023

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Arm IPO Faces Serious Difficulties, Observers Say

SoftBank’s initial public offering (IPO) for Arm on the Nasdaq stock exchange, planned for as early as next month, faces major challenges because the British chip designer is overvalued and growth prospects are dim, analysts and a person close to the company told EE Times.

• BrainChip Continues to Expand IP Portfolio with Latest Australian Patent Issuance

Headlines for Thursday Aug. 24, 2023

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Nordic to acquire AI/ML technology in the US

Nordic Semiconductor today announced it has entered into an agreement to acquire the IP portfolio of US-based artificial intelligence and machine learning company Atlazo.

• PQSecure announces IPs for NIST recommended PQC algorithms under FIPS
• Synopsys Initiates $300 Million Accelerated Share Repurchase Agreement
• NIST to Standardize Encryption Algorithms That Can Resist Attack by Quantum Computers
• Huawei rumoured to be building secret fab stable
• sureCore-Led CryoCMOS IP: Toward Scalable Quantum Computers
• 2 Startups Tackle Counterfeits, Including TI Chips
• Weebit Nano appoints Ms Naomi Simson as Non-Executive Director
• AMD Acquires Mipsology to Deepen AI Inference Software Capabilities
• GDDR Does Math, Big-Screen Explosions
• Groq Selects Samsung Foundry to Bring Next-gen LPU™ to the AI Acceleration Market
• Synopsys Completes Acquisition of PikeTec GmbH
• Synopsys to add generative AI to design tools

Headlines for Wednesday Aug. 23, 2023

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Analysis: Arm IPO filing reveals depth of Chinese risk

The filing for an IPO in intellectual property licensor Arm has revealed details of problematic relations in China and risks to its continued business there.

• Esperanto Pivots to HPC and Generative AI
• Gartner Forecasts Worldwide AI Chips Revenue to Reach $53 Billion in 2023
• Rambus Safeguards Accelerated Computing with FPGA-targeted Security IP

Headlines for Tuesday Aug. 22, 2023

• Milk-V Launches Milk-V Vega, the World's First RISC-V Open Source 10 Gigabit Ethernet Switch

Headlines for Monday Aug. 21, 2023

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Arm Announces Public Filing of Registration Statement for Proposed Initial Public Offering

Arm Holdings Limited (“Arm”) today announced that it has publicly filed a registration statement on Form F-1 with the U.S. Securities and Exchange Commission (“SEC”) relating to the proposed initial public offering of American depositary shares (“ADS”) representing its ordinary shares.

• Empower Your Wi-Fi 6 and Wi-Fi 6E SoCs with 12-Bit 640Msps Dual Channel ADC and DAC IP Cores, Now Available for Immediate Licensing in Silicon Proven 22nm ULL and ULP Technology

Headlines for Friday Aug. 18, 2023

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Dream Chip Technologies tapes out a 10-TOPS SoC in 22nm with a novel AI Accelerator and an Automotive Functional Safety Processor

The main blocks on the SoC are two AI accelerators with 10 TOPS aggregated performance, two Dream Chip Realtime Pixel Processor (RPP) high-performance automotive Image Signal Processors (ISPs), an ARM Cortex-R52 based functional safety processor (Alcatraz), a dual-core ARM Cortex-A65 processor cluster, and an Arteris FlexNoC Network-on-Chip.

Headlines for Thursday Aug. 17, 2023

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Metanoia Adopts Omni Design's Multi Giga Sample Data Converters in 5G products

Omni Design Technologies today announced that Metanoia is adopting Omni Design’s multi-gigasample data converters and related IP in advanced FinFET nodes. Metanoia 5G products, incorporating Omni Design IP, will power future smart devices with ultra-fast mobile internet, self-driving cars, virtual reality, and a variety of smart home applications.

• Faraday Announces Infineon's SONOS eFlash is Fully Qualified on UMC's 40ULP Process
• OpenHW Group Announces Tape Out of RISC-V-based CORE-V MCU Development Kit for IoT Built with Open-Source Hardware & Software
• Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2023
• Sirius Wireless Partners with S2C on Wi-Fi6/BT RF IP Verification System for Finer Chip Design
• Marvell Introduces Industry's First 5nm Multi-Gigabit PHY Platform
• Silicon Motion Terminates Merger Agreement with MaxLinear and Intends to Pursue Substantial Damages in Excess of the Agreement's Termination Fee Due to MaxLinear's Willful and Material Breaches of the Merger Agreement
• Creonic Engages in Numerous Research Projects within the 6G Platform

Headlines for Wednesday Aug. 16, 2023

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Intel Announces Termination of Tower Semiconductor Acquisition

Intel Corporation (Nasdaq: INTC) today announced that it has mutually agreed with Tower Semiconductor (Nasdaq: TSEM) to terminate its previously disclosed agreement to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022.​

• Tower Announces Termination of Intel Acquisition Agreement
• Rapid Silicon Announces RapidGPT's Official Availability
• NEUCHIPS Announces the Appointment of Ken Lau as Chief Executive Officer
• Certus Semiconductor Partners with Pragma Design for Embedded ESD Detection Technology
• Interview: Arm's SystemReady 2.0 to Secure IoT Devices
• GBT Technologies, Inc. & Bannix Acquisition Corp. Announce Execution of Patent Purchase Agreement
• Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0
• Global Semiconductor Industry on Track for 2024 Recovery but Near-Term Headwinds Remain, SEMI Reports
• DVCon India 2023 | Keynote: "Journeying Beyond AI: Unleashing the Art of Verification" by Sivakumar P R, Founder & CEO, Maven Silicon
• Tachyum Achieves 192-Core Chip After Switch to New EDA Tools
• Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale

Headlines for Tuesday Aug. 15, 2023

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Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes

Intel (Nasdaq: INTC) and Synopsys (Nasdaq: SNPS) announced that they have entered into a definitive agreement to expand the companies’ long-standing IP (intellectual property) and EDA (electronic design automation) strategic partnership with the development of a portfolio of IP on Intel 3 and Intel 18A for Intel’s foundry customers.

• Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year

Headlines for Monday Aug. 14, 2023

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CEVA Joins Samsung SAFE™ Foundry Program to Accelerate Chip Design for the Mobile, Consumer, Automotive, Wireless Infrastructure and IoT Markets

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today announced that it has joined the Samsung Advanced Foundry Ecosystem (SAFE™) to streamline chip design and accelerate time-to-market for CEVA licensees using Samsung's advanced foundry processes.

• OPENEDGES and Telechips Collaborates for Automotive Applications
• Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications

Headlines for Friday Aug. 11, 2023

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Rambus Initiates $100 Million Accelerated Share Repurchase Program

Rambus today announced that it initiated an accelerated share repurchase program with Royal Bank of Canada, through its agent RBC Capital Markets, LLC to repurchase an aggregate of approximately $100 million of its common stock.

• TSMC July 2023 Revenue Report
• TSMC allocates $6bn for 2nm capacity in Taiwan
• Socionext Strengthens Design and Development Capabilities with New Office in Bangalore, India
• Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing

Headlines for Thursday Aug. 10, 2023

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UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification

Today, the UCIe Consortium announced the public release of UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification to deliver valuable improvements in the chiplet ecosystem, extending reliability mechanisms to more protocols and supporting broader usage models.

• Intel CEO Voices Concerns About CHIPS Funds, Export Controls
• SMIC Reports 2023 Second Quarter Results
• BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions
• Analog IP tackles side channel attacks

Headlines for Wednesday Aug. 09, 2023

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MIPI Alliance and Automotive SerDes Alliance Enter Liaison Agreement to Enable Native MIPI CSI-2 Implementation with ASA-ML PHY

Agreement benefits automotive industry by aligning MIPI camera specification with ASA and MIPI standardized SerDes solutions

• CEVA, Inc. Announces Second Quarter 2023 Financial Results
• Thalia announces new additions to its senior management team and Board
• Blueshift Memory announces successful development of computer vision AI accelerator chip
• Allegro MicroSystems to Acquire Crocus Technology to Accelerate Innovation in TMR Sensing Technology

Headlines for Tuesday Aug. 08, 2023

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Leading Semiconductor Industry Players Join Forces to Accelerate RISC-V

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP® Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally by enabling next-generation hardware development.

• Synopsys Partners with NowSecure and Secure Code Warrior to Expand Industry-Leading Application Security Testing Solutions Portfolio
• TSMC Board of Directors Meeting Resolutions
• Synopsys Appoints Rob Painter to Board of Directors
• UMC Reports Sales for July 2023
• TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe

Headlines for Monday Aug. 07, 2023

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CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

NeuPro-M delivers an industry leading 350 TOPS/Watt to bring the power of Generative AI to infrastructure, industrial, automotive, PC, consumer, and mobile markets with exceptional cost and power efficiency

• Global Semiconductor Sales Increase 4.7% in Q2 Compared to Q1
• Tenstorrent Raises a $100M Strategic Up-round Co-led by Hyundai Motor Group and the Samsung Catalyst Fund
• GUC Monthly Sales Report - July 2023
• DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core
• Arteris Announces Financial Results for the Second Quarter 2023 and Estimated Third Quarter and Full Year 2023 Guidance
• Renesas to Acquire Cellular IoT Technology Leader Sequans Through Tender Offer
• CEO Interview: Intrinsic ID's Pim Tuyls on Embedded Security
• Unlock seamless video transmission between graphics adapters and LCD displays with readily licensable, silicon-proven LVDS IP cores tailored for the advanced 22FDX process node

Headlines for Thursday Aug. 03, 2023

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Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores

Xiphera has finished a CAVP validation process of the National Institute of Standards and Technology (NIST) for eight IP cores. The CAVP validations reinforce the trustworthiness and credibility of Xiphera’s cryptographic security products and solutions and open new possibilities on the global market for the company.

• PCI-SIG® Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance
• Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP
• Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform
• CDAC, Arm partner to enable semiconductor startups in India through Arm Flexible Access for Startups

Headlines for Wednesday Aug. 02, 2023

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Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers

Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced a partnership with Winbond to deliver an IP controller targeting automotive, smart IoT, industrial, wearables, true wireless stereo (TWS), wireless headsets, smart speakers and connectivity applications.

• JEDEC Publishes New Standard to Support CXL Memory Module Implementation
• University of Virginia Joins the BrainChip University AI Accelerator Program

Headlines for Tuesday Aug. 01, 2023

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LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W

• Dolphin Design enables Orca's RF SoCs for direct-to-satellite communications
• Rambus Reports Second Quarter 2023 Financial Results
• Weebit Nano qualifies its ReRAM module for automotive grade temperature