D&R Headline News (September 2023)

Headlines for Thursday Sep. 28, 2023

Top Story

Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House

Capgemini announces the acquisition of HDL Design House, a leading independent provider of silicon design and verification services in Europe. The acquisition will extend the Group’s global silicon engineering capabilities that are already among the world’s largest.

• M31 Announces Low-Power IP Solutions for TSMC's N12e Process
• Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
• China Gears Up for Chip Dumping, Ex-DoC Official Says
• How the Worlds of Chiplets and Packaging Intertwine
• Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component
• Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
• Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
• Nanusens technology is key to enabling AI to be smarter
• Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification
• Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

Headlines for Wednesday Sep. 27, 2023

Top Story

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Comprehensive Multi-Die System Design Solution Supports 3Dblox 2.0 Standard and TSMC 3DFabric™ Technologies to Boost Productivity for Fast Heterogeneous Integration

• Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements
• Chips&Media Announces the Release of "CMNP," the New Neural Processor IP
• PrimisAI Forms to Revolutionize Hardware Design with Leading AI Solutions
• Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit

Headlines for Tuesday Sep. 26, 2023

Top Story

Ashling's RiscFree™ SDK Now Supports RISC-V® Processor Cores from CAST

CAST BA51 and BA53 IP core customers can now use Ashling’s RiscFree™ SDK to develop and debug systems that use these RISC-V processors.

• Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology
• Cadence AI-Powered Virtuoso Studio Supports RF and mmWave Design Reference Flows for TSMC N16RF, N6RF and N4PRF
• Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
• Codasip selects Verilock to provide secure hardware authentication technology
• Unlocking IoT Security: Crypto Quantique Introduces QuarkLink Ignite - A Free IoT Security SaaS Platform
• Introducing Tomi Jalonen - Xiphera's Sales Representative for Central European Markets
• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform
• Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
• SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform
• GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations

Headlines for Monday Sep. 25, 2023

Top Story

Arm shares return to offer price

Eight days after its IPO, Friday’s market close saw Arm shares at 32 cents above the $51 offer price after hitting $63 in the days immediately after the offer.

• proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem
• Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
• Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows
• EU Turns Rivals into Allies
• Alphawave Semi: Interim results for the six months ended 30 June 2023
• Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base
• GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding
• Unlock the Power of DisplayPort v1.4 Tx/Rx PHY and Controller IP Cores: Maximize the Potential of Your Next-Generation Products

Headlines for Friday Sep. 22, 2023

Top Story

Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings

Analog Bits is collaborating with Intel Foundry Services (IFS) to develop power optimized Multi-protocol SERDES up to PCIe Gen 5 datarates on Intel 3 process.

• Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
• Rambus MACsec-IP-361 is Certified ASIL-B Ready

Headlines for Thursday Sep. 21, 2023

Top Story

Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success.

• U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
• Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
• CEVA, Inc. Appoints Iri Trashanski as Chief Strategy Officer
• BrainChip Engages VVDN to Deliver Industry's First Commercial Edge Box Based on Neuromorphic Technology
• Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor
• SMIC Well on Its Way to 5-nm Breakthrough, Observers Say
• Kalray announces the availability of its new processor "Coolidge™2", the first DPU optimized for AI and data intensive processing
• Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal
• Intel launches compact RISC-V Nios processor core
• Nordic combines Arm and RISC-V for "remarkable" EEMBC benchmarks
• AccelerComm, Radisys, RFDSP & TTP unveil LEO Regenerative 5G RAN solution

Headlines for Wednesday Sep. 20, 2023

Top Story

AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships

AiM Future, the pioneer in concurrent multimodal inference accelerators for edge and end-point devices, announced a new family of NeuroMosAIc Processors delivering sixty percent higher performance efficiency over the previous generation.

• Cadence to Acquire Intrinsix Corporation from CEVA
• Thalia expands footprint in China with appointment of Business Partner Fionn Liu
• ADTechnology and BOS Semiconductor Collaborate to develop 5nm automotive semiconductors

Headlines for Tuesday Sep. 19, 2023

Top Story

QuickLogic and Xiphera Partner to Pioneer Post-Quantum Cryptography on eFPGAs

Xiphera today announced a partnership with QuickLogic to implement Xiphera’s xQlave® quantum-secure cryptographic IP cores on QuickLogic's eFPGA architecture.

• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
• OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs
• Rambus Added to PHLX Semiconductor Sector Index (SOX)
• Arm Announces Closing of Initial Public Offering and Full Exercise of Underwriters' Option to Purchase Additional American Depositary Shares
• SandBox Semiconductor Adds Hybrid Metrology Capabilities to Industry's Leading Physics-based, AI-enabled Process Optimization Platform, Creating the First Software Solution to Holistically Address Process Development Challenges

Headlines for Monday Sep. 18, 2023

Top Story

Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip

Synopsys, Inc. today announced that its collaboration with Intel has achieved end-to-end 64 GT/s interoperability between Synopsys’ IP for PCI Express (PCIe) 6.0 and Intel’s PCIe 6.0-enabled test chip.

• Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm
• TCL Joins Via Licensing Alliance's ATSC 3.0 Broadcasting Patent Pool
• Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs
• Driving Europe's Chip Renaissance: TSMC's Vision with ESMC
• Panmesia Raises $12.5 Million in Seed Funding with a Valuation Exceeding $81.4 Million in the CXL Semiconductor Arena
• Flex Logix Announces Reconfigurable Block RAM with ECC Option
• LIN Controller IP Core, equipped with a Safety package (Safe LIN, ISO 26262: Safety manual, FMEDA), tailored specifically for High-End Automotive and Consumer Applications is available for immediate licensing

Headlines for Thursday Sep. 14, 2023

Top Story

Arm Announces Pricing of Initial Public Offering

Arm Holdings plc (“Arm”) today announced the pricing of its initial public offering (the “IPO”) of 95,500,000 American depositary shares (“ADSs”), each representing one of its ordinary shares, at a price to the public of $51.00 per ADS.

• Arm Begins 2nd Term on Nasdaq, at $54.5 Billion Valuation
• Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023
• Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs
• Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
• Efabless Design Challenge Winners Advance the Power of AI in Chip Design

Headlines for Wednesday Sep. 13, 2023

Top Story

Alchip Collaborates With Arteris To Expand ASIC Design Services

Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, and Alchip Technologies, Ltd., a top-tier ASIC leader, today announced a collaboration to enhance the delivery of high-performance SoCs with unmatched bandwidth and ease of physical design.

• intoPIX and Cobalt unveil the future of content delivery with JPEG XS: Introducing the Sapphire mini-converters and Sapphire openGear card powered by intoPIX technology
• Fraunhofer IIS introduces Application Support Package to facilitate JPEG XS Integration
• Marquee Semiconductor Achieves ISO 9001 Certification for Exemplary Management System
• TSMC Special Board of Directors Meeting Resolutions
• Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications
• Optima Design Automation Receives ISO 26262 ASIL D Ready Certification from SGS-TÜV Saar

Headlines for Tuesday Sep. 12, 2023

Top Story

Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions

Allegro DVT, a leading provider of video encoding semiconductor IP solutions, today announced the availability of its E300 series, a new generation of video encoder IPs built upon a higher performance architecture with support for resolutions from 4K60 up to 8K120.

• Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras
• Faraday Unveils 2.5D/3D Advanced Package Service for Chiplets
• intoPIX showcases the new lightweight video compression standards and technologies driving automotive innovation at AutoSens 2023
• Signature IP Extends Global Footprint to Israel with Local Sales and Application Engineering Presence
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs
• 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
• Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets
• Bluespec's Accelerate-HLS Leverages RISC-V to Simplify and Speed the Development of HLS Applications
• Meet T2M at IBC 2023 to explore High Performance, Cost-effective, and Innovative Semiconductor IP Cores for your next generation SoCs

Headlines for Monday Sep. 11, 2023

Top Story

CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line

The new ASCON-F Ascon Authenticated Encryption & Hashing Engine core provides a competitively small and fast hardware engine for the lightweight security functions detailed in the Ascon v1.2 specification. Its lean standard version supports Ascon-128 and -128a, the primary AEAD (authenticated encryption with associated data) cryptographic functions.

• Renesas Commences Tender Offer for All Outstanding Shares and ADSs of Sequans
• SK hynix's memory chips next in Huawei's 5G phone saga
• Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions
• Semiconductor industry sees revenue increase for the first time since 2021
• TSMC August 2023 Revenue Report
• NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core
• Flex Logix Announces Upgraded Emulation Models For EFLX™ eFPGA
• Q2 2023 Global Semiconductor Equipment Billings Dip 2% Year-Over-Year, SEMI Reports
• Blue Pearl Adds Design Verification and Methodology Services to its Product Portfolio

Headlines for Friday Sep. 08, 2023

Top Story

Andes Announces General Availability of the New AndesCore™ RISC-V Multicore Vector Processor AX45MPV

The AX45MPV is the third generation of the award winning AndesCore™ vector processor series. Equipped with powerful RISC-V vector processing and parallel execution capability, it targets the applications with large volumes of data such as ADAS, AI inference and training, AR/VR, multimedia, robotics, and signal processing.

• GBT Receives Patent Grant Notification Covering its Integrated Circuits Reliability Verification Analysis and Auto-Correction Technology
• OneNav Closes $17 Million Round, Launches GNSS Augmentation Product
• intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023

Headlines for Thursday Sep. 07, 2023

Top Story

Arm IPO Likely to Lag Early Expectations, Observers Say

SoftBank’s sale of a stake in Arm is likely to raise less money than originally expected, due in part to the several uncertainties the British chip IP company continues to face, industry observers told EE Times.

• Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication
• Comcores now offers standalone Reed Solomon Forward Error Correction (RSFEC) IP cores
• Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT
• MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution
• Global Semiconductor Sales Increase 2.3% Month-to-Month in July
• BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit
• Rambus Completes Sale of PHY IP Assets to Cadence
• Flanders Semiconductors: The New Hub for Semiconductor Ecosystem at the Heart of Europe

Headlines for Wednesday Sep. 06, 2023

Top Story

CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market

Ultra-low power RivieraWaves Bluetooth 5.4 IP platform qualified for all features, including Periodic Advertising with Response (PAwR) required for ESL tags

• New MIPS CEO Sameer Wasson to Drive Company's RISC-V Market Penetration and Innovation
• GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps
• VisualSim Secure Model Protector enables companies to collaborate in new product development
• UMC Reports Sales for August 2023

Headlines for Tuesday Sep. 05, 2023

Top Story

Arm Announces Launch of IPO Roadshow

Arm Holdings plc (“Arm”) today announced that it has launched a roadshow for the initial public offering (the “IPO”) of American depositary shares (“ADSs”) representing its ordinary shares.

• Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
• Top Ten Semiconductor Foundries Report a 1.1% Quarterly Revenue Decline in 2Q23, Anticipated to Rebound in 3Q23, Says TrendForce
• GUC Monthly Sales Report - Aug 2023
• Codasip collaborates with Siemens to deliver trace solution for custom processors
• Cybertek Solution Wins Multiple Contracts in Asia
• Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
• SEMI to License Server Certification Protocol to Help Combat Software Piracy

Headlines for Monday Sep. 04, 2023

Top Story

Arm prices IPO

Arm has priced its IPO at $47-51 per share valuing the company at at $50-54 billion – compared to the estimated range of $19-73 billion.

• Logic Fruit Technologies Elevates FPGA Innovation with AMD Xilinx Premier Partnership
• Indie Semiconductor Expands Quality Operations
• OPENEDGES Highlights Advanced Memory Subsystem IPs at the AI Hardware & Edge AI Summit 2023
• Embrace the future of sensor communication in your SoC with proven MIPI I3C SMaster, Master, and Slave Controller IP Cores. Licensing opportunities are available for immediate implementation

Headlines for Friday Sep. 01, 2023

• Alphawave Semi Announces Appointment of David Reeder to Board of Directors
• Microchip's PolarFire® FPGA's Single-Chip Crypto Design Flow "Successfully Reviewed" By the United Kingdom Government's National Cyber Security Centre
• Nextera-Adeas ST 2110 IP cores are now available on Intel FPGAs