D&R Headline News (October 2023)

Headlines for Tuesday Oct. 31, 2023

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Codasip delivers processor security to actively prevent the most common cyberattacks

Codasip, the leader in RISC-V Custom Compute, today announced the first commercial implementation of CHERI, the advanced security mechanism the semiconductor industry needs.

• Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program
• Tenstorrent Teams with Imperas to Provide Model of the Tenstorrent Ascalon RISC-V Core
• lowRISC Announces New OpenTitan Project Partner, zeroRISC
• Rambus Reports Third Quarter 2023 Financial Results
• UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI
• Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor

Headlines for Monday Oct. 30, 2023

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Flex Logix adoption expands into datacenters

Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, announced today that the first application using EFLX eFPGA for datacenters is in design.

• Weebit Nano signs Tier-1 licensing agreement; on track to generate first IP revenues in 2023
• EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations
• Stephane Cordova joins Thalia as Director of Sales Europe
• Aniah simultaneously validates ISO9001 and ISO27001 certifications, reinforcing its commitment to Quality and Cybersecurity

Headlines for Thursday Oct. 26, 2023

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Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP

Rambus today announced that the Rambus HBM3 Memory Controller IP now delivers up to 9.6 Gigabits per second (Gbps) performance supporting the continued evolution of the HBM3 standard.

• Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports
• Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards
• Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards
• MosChip Technologies announces its new Managing Director & CEO
• AI Silicon IP Provider Expedera Opens R&D Office in Singapore

Headlines for Wednesday Oct. 25, 2023

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Layoffs at SiFive as RISC-V upstart faces a crossroads

SiFive, a prominent player in the RISC-V design arena, is going through a radical makeup. While layoffs at one of the early RISC-V startups are making headlines in trade media, what’s happening underneath is a significant shift in its business model.

• NeuReality and Veriest Achieve Great Engineering Feat to Advance AI Chips for World's Largest Data Centers
• DVB-C2 LDPC/ BCH Decoder FEC IP Core From Global IP Core
• Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference

Headlines for Tuesday Oct. 24, 2023

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Sofics releases its ESD technology on TSMC 3nm process

Sofics bv, a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) solutions portfolio is now available for TSMC’s advanced 3nm process technology.

• Faraday Reports Third Quarter 2023 Results
• Cadence Reports Third Quarter 2023 Financial Results
• PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
• Semidynamics launches first fully-coherent RISC-V Tensor unit to supercharge AI applications
• Intrinsic ID Looks Back on 15 Years of Building Digital Trust

Headlines for Monday Oct. 23, 2023

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Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors

Green Mountain Semiconductor Inc. (GMS), a custom circuit design provider, is proud to announce its recent achievement of a Phase I Small Business Innovation Research (SBIR) contract.

• Renesas Extends Tender Offer for Proposed Acquisition of Sequans
• Alphawave Semi Announces Appointment of Rahul Mathur as Chief Financial Officer
• lowRISC Announces Expansion of OpenTitan Project with New Hardware
• Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process
• Qualinx's Series A Financing for All-Digital GNSS IoT Wireless Technology Hits $20 Million
• Revolutionizing Automotive Connectivity: Cutting-Edge Silicon IP Cores Now Available with T2M

Headlines for Friday Oct. 20, 2023

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Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology

Neurxcore, a leading provider of cutting-edge Artificial Intelligence (AI) solutions, today announced the launch of its groundbreaking Neural Processor Unit (NPU) product line for AI inference applications.

• Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
• CXL Gets Off the Drawing Board
• How Arm Total Design is built around 5 key building blocks
• Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution
• New POLYN Patent Covers Smart Tires, Industrial IoT Applications

Headlines for Thursday Oct. 19, 2023

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Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU

Samsung Electronics today unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer process to the 8-inch legacy process.

• US extends China chip ban
• Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology
• Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices
• CXL Gets Off the Drawing Board
• Analysts Debate Latest U.S. Export Controls
• SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design
• Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry
• Cadence Collaborates with Broadcom to Implement AI-Driven Solutions with Impressive Quality of Results
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs

Headlines for Wednesday Oct. 18, 2023

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Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development

Socionext today announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-of-network markets.

• M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent
• Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs
• Qualcomm to Bring RISC-V Based Wearable Platform to Wear OS by Google
• Andes Technology Unveils Andes D23 and N225 Cores Pioneering the Next Generation of Compact, Performant, and Secure RISC-V Processor Technology
• Harnessing the power of the ecosystem in the era of custom silicon on Arm
• Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes
• Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design

Headlines for Tuesday Oct. 17, 2023

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Codasip announces next-generation RISC-V processor family for Custom Compute

Codasip®, the leader in RISC-V Custom Compute, announced today a new highly configurable family of RISC-V baseline processors for unlimited innovation. The family, called the “700 family”, includes application and embedded cores.

• Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
• Silicon Creations Named 2023 TSMC OIP Partner of the Year for Analog / Mixed-Signal IP
• Synopsys Partners with Indian Institute of Technology Bombay to Develop Talent for Semiconductor Industry

Headlines for Monday Oct. 16, 2023

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LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing

LeapMind Inc, has announced the commencement of the new AI chip development that accelerates the training and inference of large-scale AI models.

• Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports
• Access Advance Announces Newest VVC Advance Licensors and Licensees
• OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP
• eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year
• GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices
• 14-bit, 4.32GSps Wide Band ADC with Time-Interleaved Pipeline Architecture, Now Available for WhiteBox Licensing - Unlimited Usage and Modification Rights Included

Headlines for Friday Oct. 13, 2023

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Semiconductor startup, Enosemi, launches with a committed commercial license to key silicon photonics design IP created by Luminous Computing

Enosemi emerges from stealth mode today as a new fabless semiconductor startup focused on design enablement and design IP for silicon photonics.

• Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform

Headlines for Thursday Oct. 12, 2023

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SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation

SiFive’s Performance P870 and Intelligence X390 product debut sets new bar for high-performance compute in consumer, infrastructure, and automotive applications

• Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
• Thalia appoints Sou Bennani-McCord as Global VP of Sales
• Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution

Headlines for Wednesday Oct. 11, 2023

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Embedded Flash memory developer Floadia has raised 1.05 billion yen from INABATA and others

Floadia, which develops embedded flash memory IP cores based in the Tokyo suburb of Kodaira-shi, has raised approximately 1.05 billion yen in Series D round.

• ADTechnology to start 3nm 2.5D ASIC design project for HPC application
• JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
• Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications
• BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins"

Headlines for Tuesday Oct. 10, 2023

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Efabless Raises $6.3 Million in Series A-1 Extension, Featuring Investments from GlobalFoundries, Synopsys, and New North Ventures

Investors in the round include GlobalFoundries, Synopsys, New North Ventures and a select group of individuals. The proceeds will be strategically utilized to fortify business development, marketing, and further product development.

• Accellera Releases Portable Test and Stimulus Standard 2.1
• AMD to Acquire Open-Source AI Software Expert Nod.ai
• Update on Israel situation; Weebit's operations unaffected
• Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe

Headlines for Monday Oct. 09, 2023

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Siemens extends leadership in EDA design-for-test with the launch of Tessent RTL Pro

Siemens Digital Industries Software today unveiled Tessent™ RTL Pro, an innovative software solution developed to help integrated circuit (IC) design teams streamline and accelerate a broad array of critical design-for-test (DFT) tasks for their next-generation designs.

• TSMC looks to standardise chiplet protocols in "world changing" move
• TSMC September 2023 Revenue Report
• 1G Ethernet PHY IP Core is now available in 14nm LPP for Blackbox License and in 28FDSOI as Whitebox License for maximum flexibility

Headlines for Friday Oct. 06, 2023

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EDGX Announces Collaboration with BrainChip to Develop Disruptive Data Processing Solutions for Space

EDGX and BrainChip today announced a collaborative agreement to develop data processing units for very demanding environments.

• UMC Reports Sales for September 2023
• GUC Monthly Sales Report - September 2023
• Arteris Wins Autonomous Vehicle Technology of the Year Award
• ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
• Marquee Semiconductor Expands Presence in India with New Location at Veer Surendra Sai University of Technology Campus in Odisha

Headlines for Thursday Oct. 05, 2023

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SmartDV Rolls Out Multi-Phase Expansion Plan

SmartDV™ Technologies, provider of flexible, customizable semiconductor design IP (intellectual property) and verification solutions, has expanded engineering operations beyond its headquarters in Bengaluru with the opening of a new office space in Coimbatore, Tamil Nadu, India.

• Using Open-Source Hardware to Speed Product Development
• Global Semiconductor Sales Increase 1.9% Month-to-Month in August
• Swiss-Based Enclustra Announces US Operations in San Diego to Realize the Full Potential of Embedded Chip Technologies
• JUPITER Exascale Supercomputer, lead customer for SiPearl
• Renesas Extends Tender Offer and Receives CFIUS Clearance for Proposed Acquisition of Sequans
• MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
• Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
• ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
• Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub
• Cadence Completes Acquisition of Intrinsix

Headlines for Wednesday Oct. 04, 2023

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Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business

Intel Corporation today announced its intent to separate its Programmable Solutions Group (PSG) operations into a standalone business. This will give PSG the autonomy and flexibility it needs to fully accelerate its growth and more effectively compete in the FPGA industry.

• EdgeCortix Closes $20 Million in Additional Funding Round

Headlines for Tuesday Oct. 03, 2023

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CEA and Siemens collaborate on research to expand applications of Digital Twin for industry

Siemens Digital Industries Software and CEA-List, a technological research institute focused on smart digital systems research, announced today the signing of a memorandum of understanding to collaborate on research to further extend and enhance digital twin capabilities with artificial intelligence (AI) and explore greater integration of embedded software on both virtual and hybrid platforms.

• BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions
• Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers
• Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect

Headlines for Monday Oct. 02, 2023

• Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24