D&R Headline News (December 2023)

Headlines for Friday Dec. 29, 2023

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BrainChip Awarded Latest Patent for Event-Based Pattern Detection

BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, was issued its latest U.S. patent, further strengthening its IP portfolio related to sustainable and efficient AI technologies.

Headlines for Thursday Dec. 28, 2023

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Established "Advanced SoC Research for Automotive" with 12 companies, led by automotive manufacturers

Twelve companies, automotive, electrical component, and semiconductor companies established the "Advanced SoC Research for Automotive" (ASRA) on December 1st to conduct research and develop high-performance digital semiconductors (System on Chip, SoC) for use in automobiles. ASRA will research and develop SoCs for automobiles using chiplet technology to install SoC in mass-production vehicles from 2030 onward.

• Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD

Headlines for Wednesday Dec. 27, 2023

• German Court Fines Netflix €7.05 Million for Continued Infringement of Broadcom HEVC Patent

Headlines for Friday Dec. 22, 2023

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Five Leading Semiconductor Industry Players Incorporate New Company, Quintauris, to Drive RISC-V Ecosystem Forward

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor ASA, NXP® Semiconductors, and Qualcomm Technologies, Inc., have formally established Quintauris GmbH. Headquartered in Munich, Germany, the company aims to advance the adoption of RISC-V globally by enabling next-generation hardware development.

Headlines for Thursday Dec. 21, 2023

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Synopsys Acquires RISC-V Processor Simulation Tools Firm

Synopsys appears to be on a mission to build out its total RISC-V ecosystem offerings, having quietly acquired Imperas Software last week.

• Is Software and Hardware Ready for TinyML Tsunami?
• XYALIS unveils Hartroid: A Strategic Initiative to Counter Hardware Trojans in Defense Systems
• Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
• Tiempo Secure's Unique IP Expertise Required to Secure First Post Quantum Sovereignty Chip

Headlines for Wednesday Dec. 20, 2023

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GlobalLogic Announces Acquisition of Mobiveil

GlobalLogic, a Hitachi Group Company and a leader in Digital Engineering, today announced that it has entered into a definitive agreement to acquire Mobiveil, a specialized embedded engineering services firm headquartered in the United States.

• Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce
• TSMC Announces Dr. Mark Liu Not to Participate in Next Board of Directors Election
• Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs
• Reed Solomon Encoder and Decoder FEC IP Core From Global IP Core

Headlines for Tuesday Dec. 19, 2023

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VeriSilicon and Google Collaborate on the Open-Source Project Open Se Cura

VeriSilicon (688521.SH) today announced its collaboration with Google in support of the newly launched Project Open Se Cura, an open-source framework consisting of design tools and IP libraries, to accelerate the development of secure, scalable, transparent, and efficient Artificial Intelligence (AI) systems.

• Intrinsic ID to Showcase New Embedded Security Solutions at CES 2024
• Takashi Yamada, Memory Industry Expert Joins OPENEDGES to Lead Japan Business
• ST Engineering Acquires D'Crypt to Strengthen its Cyber Capabilities

Headlines for Monday Dec. 18, 2023

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Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act

Siemens EDA has launched its collaborative venture initiative, Cre8Ventures, and is now accepting proposals for collaboration from European integrated circuit (IC) startups as part of its activities around the European Chips Act.

• Apple-TSMC-Amkor Pact Bolsters U.S. Chip Supply Chain
• BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server
• Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products

Headlines for Friday Dec. 15, 2023

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Alphawave Semi Partners with Keysight to Deliver Industry Leading Expertise and Interoperability for a Complete PCIe 6.0 Subsystem Solution

Alphawave Semi today announced successful collaboration with Keysight Technologies, a market-leading design, emulation, and test solutions provider, demonstrating interoperability between Alphawave Semi’s PCIe 6.0 64 GT/s Subsystem (PHY and Controller) Device and Keysight PCIe 6.0 64 GT/s Protocol Exerciser, negotiating a link to the maximum PCIe 6.0 data rate.

• BrainChip Previews Industry's First Edge Box Powered by Neuromorphic AI IP
• BSC presents Sargantana, the new generation of the first open-source chips designed in Spain

Headlines for Thursday Dec. 14, 2023

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PUFsecurity and Himax Prioritize User Security and Data Protection in Endpoint AI with PUF-based Root of Trust

PUFsecurity, a subsidiary of eMemory dedicated to innovating PUF-based security solutions, and Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the successful deployment of PUFsecurity's PUF-based Root of Trust IP, PUFrt, into Himax’s WiseEye2 AI processor (WE2).

• Neurxcore leverages Aedvices VIPs for the verification of its neural processors
• China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
• QC Design announces launch of fault-tolerance design automation tool Plaquette+ and first sale to QuiX Quantum
• Imec's extremely scaled SOT-MRAM devices show record low switching energy and virtually unlimited endurance
• Amidst export restrictions, RISC-V continues to advance
• GigaDevice partners with SEGGER on Embedded Studio for RISC-V
• Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity

Headlines for Wednesday Dec. 13, 2023

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Xylon Offers ARTIEYE - a Complete Technology Suite for Customizable AI-based Driver Monitoring Systems

The new ARTIEYE® computer vision technology suite enables users to skip years of internal development and to take full control over their sensitive driver monitoring and other in-cabin AI systems by offering pre-designed and pre-verified HW/SW IPs, data sets and optimized neural networks, bio-medically established ground truth data, lab setups, development know-how and test and validation tools and procedures

• Alchip Unveils AI 3DIC Design and IP Platform

Headlines for Tuesday Dec. 12, 2023

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SCALINX and Arteris Partner on Advanced Communications Innovation

Arteris today announced that SCALINX, a fabless semiconductor company specializing in mixed-signal SoC design, has licensed Ncore and FlexNoC interconnect IP for its next-generation Modem SoC dedicated to wireless communication infrastructures.

• AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
• Logic Fruit Technologies Launches CAN Controller IP Core
• Digital Core Design Presents DAES XTS Cryptographic CPU for Unparalleled Security
• Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
• Andes Awards Imperas 2023 Partner of the Year
• Rambus Wins 2023 "Most Respected Emerging Public Semiconductor Company" Award from Global Semiconductor Alliance
• Visit Quadric at CES to Discover the GPNPU that Solves The Biggest ML Inference Chip Design Challenges

Headlines for Monday Dec. 11, 2023

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EnSilica enters strategic partners with design and custom module developer IndesmaTech

EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the Denmark-headquartered design consultancy and custom module developer IndesmaTech.

• China Continues to Enhance AI Chip Self-Sufficiency, but High-End AI Chip Development Remains Constrained, Says TrendForce
• NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM
• 12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing

Headlines for Friday Dec. 08, 2023

• TSMC November 2023 Revenue Report
• Getting Ready for IoT Security in the AI Era

Headlines for Thursday Dec. 07, 2023

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Bluetooth Channel Sounding: Achieving 10cm Ranging Accuracy

Packetcraft is collaborating with Imec, a world-renowned semiconductor R&D and innovation pioneer to enhance Bluetooth ranging and location capability.

• CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task
• Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
• NovaSparks Expands Its Operations in Asia-Pacific
• Access Advance Announces Major Additions to its HEVC and VVC Patent Pools
• What Is Holding Back Neuromorphic Computing?

Headlines for Wednesday Dec. 06, 2023

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Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market

Intrinsic ID, the leading provider of Physical Unclonable Function (PUF) technology field-proven in more than 600 million devices across the globe, today released QuiddiKey® 400, a hardware-based root-of-trust (RoT) solution for semiconductors in the automotive market that must meet stringent functional safety standards.

• Top 10 Foundries Experience 7.9% QoQ Growth in 3Q23, with a Continued Upward Trend Predicted for Q4, Says TrendForce
• JEDEC Publishes New CAMM2 Memory Module Standard
• UMC Reports Sales for November 2023
• Global Semiconductor Sales Increase 3.9% Month-to-Month in October; Annual Sales Projected to Increase 13.1% in 2024
• Pragmatic Semiconductor secures £182m ($231m) investment led by M&G and UK Infrastructure Bank
• ProvenRun secures €15 million Series A to accelerate its growth in security-by-design for the Internet of Things (IoT)
• Lattice Collaborates with NVIDIA to Accelerate Edge AI
• Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
• Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities

Headlines for Tuesday Dec. 05, 2023

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Rambus Protects Data Center Infrastructure with Quantum Safe Engine IP

The Rambus QSE IP core uses NIST-selected quantum-resistant algorithms to protect valuable data center and government hardware against attacks emerging in the post quantum computing era.

• GUC Monthly Sales Report - November 2023
• Agile Analog partners with sureCore on CryoCMOS Innovate UK project
• Xiphera Announces Support for Extreme-Speed IPsec

Headlines for Monday Dec. 04, 2023

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Gartner Forecasts Worldwide Semiconductor Revenue to Grow 17% in 2024

Global semiconductor revenue is projected to grow 16.8% in 2024 to total $624 billion, according to the latest forecast from Gartner, Inc. In 2023, the market is forecast to decline 10.9% and reach $534 billion.

• BrainChip Attracts Former Intel AI Sales Executive to Head Up Sales
• Canonical joins the RISC-V Software Ecosystem (RISE)
• USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program
• EMA Design Automation to Spin-Off IP & Services Group to Enable Digital Transformation for the Entire CAD Industry
• Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
• ADTechnology is accelerating its performance and targeting infrastructure markets by joining Arm Total Design.
• Silicon Proven DisplayPort v1.4 Tx PHY IP Core in 12nm, Alongside Production-Ready Controller IP core available for Immediate Licensing

Headlines for Friday Dec. 01, 2023

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Faraday Receives ISO/IEC 27001:2022 Certification for Information Security Management System

Faraday Technology, a leading ASIC design service and IP provider, today announced that it has achieved the ISO/IEC 27001:2022 certification for its information security management system (ISMS).

• Leadership Spotlight: Sanjeev Kumar Earns Global CEO Business Excellence Award
• Lockheed Martin Prepares First 5G.MIL® Payload for Orbit