D&R Headline News (February 2024)

Headlines for Thursday Feb. 29, 2024

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Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips

Synopsys, Inc. today delivered a dramatic increase in bandwidth and throughput for data-intensive AI workloads with the industry’s first complete 1.6T Ethernet IP solution.

• VeriSilicon NPU IP is shipped in over 100 million AI-enabled chips worldwide
• Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications
• proteanTecs Joins Arm Total Design, Brings Lifecycle Health and Performance Monitoring to Arm-based Custom SoCs

Headlines for Wednesday Feb. 28, 2024

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Ceva Joins Arm Total Design to Accelerate Development of End-to-End 5G SoCs for Infrastructure and NTN Satellites

Ceva announced today that it has joined Arm Total Design, with the aim of accelerating the development of end-to-end 5G custom SoCs based on Arm® Neoverse™ Compute Subsystems (CSS) and the Ceva PentaG-RAN 5G platform, for wireless infrastructure including 5G base stations, Open RAN equipment and 5G non-terrestrial-networks (NTN) satellites.

• QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process
• Cornell Tech Joins BrainChip University AI Accelerator Program
• RAAAM™ Memory Technologies Expands Leadership Team With the Addition of Eli Leizerovitz as Chief Business Officer

Headlines for Tuesday Feb. 27, 2024

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Andes and MachineWare Collaborate on Early RISC-V Software Development for AndesCore™ AX45MPV

MachineWare GmbH and Andes Technology (TWSE:6533), a leading supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International announce an exciting new chapter in their collaboration, marked by a strategic partnership.

• LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP
• Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan
• Xiphera and Missing Link Electronics Announce a Partnership for Encrypted Network Accelerator Solutions (ENAS)
• ASICFPGA releases new advanced Demosaicing core

Headlines for Monday Feb. 26, 2024

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Crypto Quantique IoT security solutions expands to support cellular connectivity

Crypto Quantique today announced an addition to its wireless based connectivity portfolio. The QuarkLink IoT device security platform now supports securely connecting IoT devices using Cellular network including GSMA IoT SAFE.

• Sequans Provides Statement on Renesas Termination of MOU and Announces Conference Call to Review Fourth Quarter and Full Year 2023 Results and Outlook for Full Year 2024
• Largest CHIPS Act Awards Seen Coming for U.S. Companies
• Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core
• Microchip's Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
• PQShield showcases high-performance PQC on AMD Versal at Mobile World Congress
• Ceva Introduces its Next Generation Low Power Ultra-Wideband IP for FiRa 2.0 to Provide Highly Accurate and Reliable Wireless Ranging Capabilities for Consumer and Industrial IoT Applications
• New Wave Design and Verification Appoints Darlene Weiss as Director of Human Resources
• Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs

Headlines for Friday Feb. 23, 2024

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Renesas Announces Termination of Memorandum of Understanding and Tender Offer for Proposed Acquisition of Sequans

Renesas Electronics Corporation today announced that it has terminated the previously announced Memorandum of Understanding (“MOU”) between Renesas and Sequans Communications S.A. (NYSE: SQNS, “Sequans”), pursuant to which Renesas had made a tender offer to purchase all of the issued and outstanding ordinary shares of Sequans

Headlines for Thursday Feb. 22, 2024

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Arm and Nuro Partner to Deliver AI-first Autonomous Technology for Commercial Scale

Arm and Nuro are announcing a multi-year collaboration to drive a scalable approach to the commercialization of autonomous vehicles with AI built into their foundations.

• CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2024
• Arm Updates CSS Designs for Hyperscalers' Custom Chips
• Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
• Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
• Faraday Reports Full-Year 2023 Results
• Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions

Headlines for Wednesday Feb. 21, 2024

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Siemens qualifies industry-leading IC design solutions for Intel Foundry processes

Siemens Digital Industries Software today announced that its industry-leading Calibre® nmPlatform tool for integrated circuit (IC) design verification and its world-class Analog FastSPICE (AFS) platform for analog, radio frequency (RF), custom digital and mixed-signal circuit verification, are now both certified for Intel 18A and Intel 16 process technologies.

• Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow
• Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
• Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
• Analog Bits Expands Engineering Presence by Opening a Design Center in Europe
• Arteris Announces Financial Results for the Fourth Quarter and Full Year 2023 and Estimated First Quarter and Full Year 2024 Guidance
• Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products
• BrainChip Begins Accepting Pre-Orders of the Akida Edge AI Box

Headlines for Tuesday Feb. 20, 2024

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Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology

Samsung Electronics today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology.

• Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
• Xiphera Releases High-Speed ECC Accelerator
• M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0
• T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
• Rapid Silicon Leads the Way with First Complete Open-Source FPGA EDA Tool-Chain
• Imec pioneers unique, low-power UWB receiver chip: 10x more resilient against Wi-Fi and (beyond) 5G interference
• IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities

Headlines for Monday Feb. 19, 2024

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GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing

The U.S. Department of Commerce today announced $1.5 billion in planned direct funding for GlobalFoundries (Nasdaq: GFS) (GF) as part of the U.S. CHIPS and Science Act.

• Logic Fruit's ARINC Innovation Journey: Delivering Diverse Products to DRDO Labs
• Imec launches the first design pathfinding process design kit for N2 node
• What does Renesas' acquisition of PCB toolmaker Altium mean?

Headlines for Thursday Feb. 15, 2024

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Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting

Thalia, a leader in analog, mixed signal and RF IP design migration, today announced the release of AMALIA 24.1. This latest version of the company’s efficient IP reuse and migration platform includes the recently announced support for 12nm FinFET technology and Circuit Porting simulation comparisons.

• New Report Suggests India Can Expand Role in Global Semiconductor Value Chains with the Right Policies
• IP block secures FPGAs with one external IC
• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
• Blumind Harnesses Analog for Ultra Low Power Intelligence
• RISC-V Processors Addressing Edge AI Devices to Reach 129 Million Shipments by 2030
• Renesas to Acquire PCB Design Software Leader Altium to Make Electronics Design Accessible to Broader Market and Accelerate Innovation

Headlines for Wednesday Feb. 14, 2024

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Ceva, Inc. Announces Fourth Quarter and Full Year 2023 Financial Results

Ceva Q4 royalty revenue of $12.3 million, up 13% year-over-year and third consecutive quarter of royalty revenue growth

• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
• Saankhya Labs receives approval under Semiconductor Design Linked Incentive (DLI) scheme for Development of a System-on-Chip (SoC) for 5G Telecom infrastructure equipment
• Logic Fruit Welcomes Vishal Sinha as a People Management Consultant

Headlines for Tuesday Feb. 13, 2024

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EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure

Arteris’ FlexNoC network-on-chip IP enables high-bandwidth, low latency on-chip connectivity for low power consumption and optimized performance.

• Join Secure-IC at Mobile World Congress 2024 to discover our cutting-edge solutions for mobile and connectivity
• Cadence Reports Fourth Quarter and Fiscal Year 2023 Financial Results

Headlines for Monday Feb. 12, 2024

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Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's

Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and reconfigurable DSP/AI solutions, announced today that it has joined the Intel Foundry Services (IFS) Accelerator IP Alliance.

• Alphawave Semi Announces Appointment of Charlie Roach as Chief Revenue Officer
• Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
• T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer

Headlines for Friday Feb. 09, 2024

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Arm shares jump 50% on AI, China boosts to results

• Xiphera Receives Its First US Patent

Headlines for Thursday Feb. 08, 2024

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Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet

Dolphin Design has reached a significant milestone with the successful tape-out of its first 12 nm FinFet test-chip containing its state-of-the-art audio IPs.

• Innatera Productizes SNN Accelerator As "Neuromorphic Microcontroller"
• Post-Quantum Cryptography Alliance Launches to Advance Post-Quantum Cryptography
• Kalray and Arm to collaborate to bring data intensive processing and AI acceleration DPU solutions to the global Arm ecosystem

Headlines for Wednesday Feb. 07, 2024

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VeriSilicon and Innobase jointly launch a 5G RedCap/4G LTE dual-mode modem solution

VeriSilicon (688521.SH) today announced that it has collaborated with Innobase, a wireless communication technology and chip provider, to jointly launch a 5G RedCap/4G LTE dual-mode modem solution.

• Worldwide Silicon Wafer Shipments and Revenue Fall in 2023, SEMI Reports
• TSMC January 2024 Revenue Report
• SMIC Reports 2023 Fourth Quarter Results

Headlines for Tuesday Feb. 06, 2024

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Trilinear Technologies Accelerates Innovation in Automotive Display Connectivity with DisplayPort Automotive Extensions Standard (DP AE)

Trilinear Technologies, a leading provider of cutting-edge technologies for display connectivity and semiconductor solutions, is proud to announce its strategic collaboration with key industry partners to support the integration of VESA’s DisplayPort Automotive Extensions (DP AE) into automotive systems.

• Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions
• Rambus Reports Fourth Quarter and Fiscal Year 2023 Financial Results
• Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio
• SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC
• Arasan's 2nd Gen CAN IP achieves ISO26262 ASIL-C Certification
• UMC Reports Sales for January 2024
• Socionext showcase cutting-edge SoC solutions at Embedded World 2024

Headlines for Monday Feb. 05, 2024

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Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology

Faraday Technology Corporation (TWSE: 3035), a leader in ASIC design services and IP solutions, announces its collaboration with Arm and Intel in spearheading the development of a 64-core System-on-Chip (SoC) utilizing Intel 18A technology.

• Global Semiconductor Sales Decrease 8.2% in 2023; Market Rebounds Late in Year
• GUC Monthly Sales Report - January 2024
• AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation
• Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP
• YorChip announces partnership with Digitho for enabling Secure Chiplets
• Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
• syn1588® IP Cores: Setting the Gold Standard in Precision for Clock Synchronization
• Elevate Your Display and Camera SOC Capabilities with our latest Silicon Proven MIPI C-D Combo Tx/Rx PHY and DSI Controller IP Cores

Headlines for Friday Feb. 02, 2024

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Tenstorrent Engineers Talk Open-Sourced Bare-Metal Stack

Tenstorrent, the Jim Keller–led AI chip and IP startup, is making available and open-sourcing its bare-metal software stack, which allows access to the hardware at the lowest level, Tenstorrent senior fellow Jasmina Vasiljevic told EE Times.

• Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform
• Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency
• SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer

Headlines for Thursday Feb. 01, 2024

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Marquee Semiconductor Engages Industry Veteran Gideon Intrater as Strategic Advisor

Marquee Semiconductor, a global leader in chip design solutions, announces it has brought on semiconductor industry veteran Gideon Intrater as a Strategic Advisor. Mr. Intrater brings to Marquee more than 30 years of experience gained through technical, marketing and sales leadership roles at semiconductor, intellectual property, and systems companies.

• Codasip achieves certification for automotive functional safety and cybersecurity
• Alphawave Semi and Teledyne LeCroy Unveil PCIe 7.0 Signal Generation and Measurement
• BellSoft releases Liberica JDK 21 for RISC-V with support