D&R Headline News (March 2024)

Headlines for Friday Mar. 29, 2024

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China's Intel, AMD Ban Helps Local Rivals, Analysts Say

China’s ban on government use of Intel and AMD processors will help domestic competitors like Hygon build sales, according to analysts.

Headlines for Thursday Mar. 28, 2024

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PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support

PUFsecurity, the leading company in developing PUF-based security IP solutions, introduces its new Crypto Coprocessor member, PUFcc7. PUFcc7 features enhanced speed performance and upgraded crypto engines that fully support customers in meeting TLS 1.3 and FIPS 186-5 requirements.

• SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
• VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

Headlines for Wednesday Mar. 27, 2024

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TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP

TASKING proudly announces that its ISO 26262 (functional safety) and ISO/SAE 21434 (cybersecurity) compliant compilers now fully support the Andes FuSa certified RISC-V IP.

• Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
• Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
• SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
• T2M IP Unveils Cutting-Edge HDMI 2.0 Tx PHY & Controller IP Cores are available for immediate licensing for your advanced diverse applications

Headlines for Tuesday Mar. 26, 2024

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Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solution

Sonix adopted Faraday’s SONOS eFlash subsystem, which is specially designed to develop edge AI, smart grid, IoT, and MCU applications, to facilitate the integration of the eFlash function into the SoC without modifying the existing proven IP at 40ULP.

• ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
• Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
• Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
• Intel and Arm Team Up to Power Startups
• Qualitas Semiconductor and Ambarella Sign Licensing Agreement
• Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips

Headlines for Monday Mar. 25, 2024

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Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024

Alphawave Semi today announced its collaboration with InnoLight Technology, the leader in data center optics, to bring a low power, low latency linear pluggable optics (LPO) demonstration to OFC 2024.

• Synopsys Adds AI-Driven Tools, Acquires PUF Security Firm
• Arm Highlights Future of the Software-Defined Vehicle
• Edge Impulse Deploys its State-of-the-Art Edge AI Models to Arm Microcontrollers Tools
• StarIC and GlobalFoundries announce strategic partnership, release high-Speed TIA and drivers to advance silicon photonics ecosystem
• CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy
• ScaleFlux To Integrate Arm Cortex-R82 Processors in Its Next-Generation Enterprise SSD Controllers
• Industry veteran Volker Politz joins Semidynamics as Chief Sales Officer
• Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects
• Alpha Project: Secure-IC Leads the Cybersecurity Reinforcement in Baggage Transport
• Ex-DoD Official Says Chinese-Made PCBs Plague U.S. Systems

Headlines for Thursday Mar. 21, 2024

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Seven Years of Uninterrupted Growth: Andes Technology Achieves Milestone Annual Revenue Exceeding NT$1 Billion

Andes Technology Is the Number One Provider of RISC-V CPU IP According to the SHD Marketing Report

• indie Semiconductor Announces Strategic Investment in AI Processor Leader Expedera
• Tommi Lampila Is Xiphera's New Chief Revenue Officer
• StarFive's RISC-V based JH-7110 intelligent vision processing platform adopted VeriSilicon's Display Processor IP

Headlines for Wednesday Mar. 20, 2024

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Synopsys Expands Semiconductor IP Portfolio With Acquisition of Intrinsic ID

Synopsys, Inc. (Nasdaq: SNPS) today announced that it has completed the acquisition of Intrinsic ID, a leading provider of Physical Unclonable Function (PUF) IP used in the design of system-on-chips (SoCs).

• Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
• MIPS Expands Global Footprint with New Design Center and Talent for Systems Architects and AI Compute
• Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs
• 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports

Headlines for Tuesday Mar. 19, 2024

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Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse

Building on more than three decades of collaboration, Synopsys, Inc. (Nasdaq: SNPS) today announced it is working with NVIDIA to substantially accelerate chip design and advance automotive prototyping using the power of AI and accelerated computing.

• Cycuity Sets New Standard for Semiconductor Chip Security Assurance with Next Generation of Radix Technology
• Europe Leaps Ahead in Global AI Arms Race, Joining $20 Million Investment in NeuReality to Advance Affordable, Carbon-Neutral AI Data Centers
• Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
• TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
• Kudelski IoT and Dolphin Design unite to accelerate secure ASIC and IP projects
• HCLTech and CAST expand partnership for custom chips

Headlines for Monday Mar. 18, 2024

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After TSMC fab in Japan, advanced packaging facility is next

Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.

• A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
• Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform

Headlines for Friday Mar. 15, 2024

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SoC Secure Boot Hardware Engine IP Core Now Available from CAST

New IP provides fast, area-efficient, processor-agnostic protection against booting a system from malicious or otherwise insecure code

Headlines for Thursday Mar. 14, 2024

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Former Moortec executives create chip monitor startup

Stephen Crosher and other former executives with Moortec Semiconductor Ltd. have founded Monic Semiconductor Ltd. (Plymouth, England).

• QuickLogic and Zero-Error Systems Partner to Deliver Radiation-Tolerant eFPGA IP for Commercial Space Applications
• embedded world 2024: Codasip demonstrates CHERI memory protection
• Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs
• PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering

Headlines for Wednesday Mar. 13, 2024

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Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs

Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced the immediate availability of the latest release of Ncore cache coherent network-on-chip (NoC) IP.

• Tenstorrent and MosChip Partner on High Performant RISC-V Design
• Arm's Broadest Ever Automotive Enhanced IP Portfolio Designed for the Future of Computing in Vehicles
• Arteris Expands Automotive Solutions for Armv9 Architecture CPUs
• HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
• We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
• Arasan proudly releases its Radiation Hardened NAND Flash IP
• Arasan proudly introduces the VESA VDC-M Encoder and Decoder IP
• Siemens to demonstrate first pre-silicon simulation environment for Arm Cortex-A720AE for Software Defined Vehicles
• Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
• Ecosystem Collaborations Bring Full Stack Software Solutions to Develop Leading-edge Automotive Applications From Day One
• Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
• University of Western Australia Latest to Join the BrainChip University AI Accelerator Program

Headlines for Tuesday Mar. 12, 2024

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Tiempo Secure's TESIC RISC-V IP Secure Element successfully characterized on GlobalFoundries' 22FDX technology node

Tiempo Secure’s certified TESIC RISC-V Secure Element was implemented in GlobalFoundries' (GF) 22FDX® platform with MRAM, after a rigorous characterization process. The Secure Element also passed the CC EAL5+ AVA_VAN.5 security assessment testing with the ITSEF SERMA laboratory.

• Agile Analog delivers first full always-on IP subsystem
• Andes Technology: Cultivating Academic Collaboration for Over a Decade with Sustainable Spirit
• Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023, Says TrendForce

Headlines for Monday Mar. 11, 2024

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Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure

Alphawave Semi today announced the successful bring-up of its first chiplet-connectivity silicon platform on TSMC’s most advanced 3nm process.

• Re-imagining Imagination Technologies
• Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
• OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform
• Elevate the performance of your Automotive Application by integrating the IP cores of a 14-bit wideband Time-Interleaved Pipeline Data Converters

Headlines for Friday Mar. 08, 2024

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Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology

Credo expands its unique programmable power versus channel reach performance SerDes technology to TSMC N3 and N7/N6 processes

• TSMC February 2024 Revenue Report
• CAST Adds I3C Secondary Controller Core to MIPI IP Product Line
• M31's Revenue Grew Against the Trend by 18.5% Last Year and Will Increase Investment in Advanced Processes This Year

Headlines for Thursday Mar. 07, 2024

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sureCore announces ultra-low power memory IP for AI applications

SureCore has revisited its PowerMiser IP and further optimised it to drive down dynamic power further as well as exploiting the power efficiencies of FinFET technology. This has delivered a memory technology that minimises thermal impact whilst delivering the demanding performance profile needed by AI and has called it “PowerMiser AI”.

• Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon
• SignatureIP announces PCIe Gen 6 Controller IP

Headlines for Wednesday Mar. 06, 2024

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Industry Leading PPA DSP Available For All Existing EFLX eFPGA

Flex Logix® Technologies announced today that InferX DSP is in development for use with existing EFLX eFPGA from 40nm to 7nm.

• Niobium and Veriest collaborate to develop the world's fastest complete FHE accelerator chip
• BrainChip Adds Edge Box to Chip and IP Offerings
• Taalas emerges from stealth with $50 million in funding and a groundbreaking silicon AI technology
• Imsys develops RISC-V core, looks to AI in space
• UMC Reports Sales for February 2024
• Flex Logix Joins Intel Foundry USMAG Alliance
• Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm
• GUC Monthly Sales Report - February 2024
• JEDEC Publishes GDDR7 Graphics Memory Standard
• Cadence to Acquire BETA CAE, Expanding into Structural Analysis

Headlines for Tuesday Mar. 05, 2024

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Scalable Extreme-Speed IPsec Added to Xiphera's Security Protocols Portfolio

Xiphera releases extreme-speed IPsec (Internet Protocol security) IP (Intellectual Property) core. The new IP core completes the Security Protocols family providing protection for the layers 2, 3, and 4 of the OSI model. I

• Nuclei System Technology collaborates with Siemens to deliver RISC-V Processor Trace Encoder solution
• Semidynamics puts the power of full core customisation into hands of customers
• BrainChip Boosts Space Heritage with Launch of Akida into Low Earth Orbit

Headlines for Monday Mar. 04, 2024

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VeriSilicon's industry-leading embedded GPU IP powers HPMicro's high-performance HPM6800 series RISC-V MCU

VeriSilicon today announced that HPMicro’s HPM6800 series, a new generation digital dashboard display and human-machine interface system application platform has adopted VeriSilicon’s high-performance 2.5D Graphics Processor Unit (GPU) IP.

• Agile Analog's Christelle Faucon: "Diversity and Equality Are Critical"
• Interview: Mahesh Tirupattur, executive VP of Analog Bits - "Be Passionate, Fail Fast and Recover Quick"
• Intel Launches Altera, Its New Standalone FPGA Company
• Rambus Initiates Accelerated Share Repurchase Program
• Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes
• Scaleway launches its RISC-V servers in the cloud, a world first and a firm commitment to technological independence
• Agnisys to Showcase Expertise at DVCon US with Exclusive Short Workshop and Tutorial Sessions
• Accellera Approves Verilog-AMS 2023 Standard for Release

Headlines for Friday Mar. 01, 2024

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European Union Seeks Chip Sovereignty Using RISC-V

The European Union invests heavily in initiatives to achieve chip independence using the RISC-V open-source architecture. This effort is led by the Barcelona Supercomputing Center, which has been a pioneer in the development of RISC-V technology.

• Partners Applaud Intel Foundry's Wider Ecosystem Approach
• Sondrel announces two new design contract wins plus two existing Design Consultancy contracts extended
• ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC