D&R Headline News (April 2024)

Headlines for Tuesday Apr. 30, 2024

• Silvaco Announces Launch of Initial Public Offering
• Rambus Reports First Quarter 2024 Financial Results

Headlines for Monday Apr. 29, 2024

Top Story

TSMC's A16 Process Moves Goalposts in Tech-Leadership Game

Taiwan Semiconductor Manufacturing Co. (TSMC) has changed the tech leadership game with the announcement of its latest A16 chipmaking process, which analysts say may be a leap ahead of Intel’s 18A node.

• EDA toolset parade at TSMC's U.S. design symposium
• Altera in negotiation on private equity partner
• Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs
• Arm China's ex-CEO sets up RISC-V company
• CAN FD Controller & LIN 2.1 Controller IP Cores, Available for Immediate Licensing with Proven Automotive Compatibility

Headlines for Friday Apr. 26, 2024

Top Story

TSMC plans 1.6nm process for 2026

TSMC is planning a 1.6nm process, called A16, for production in 2026 alongside a wafer-scale chiplet substrate and an automotive chiplet process.

• Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
• Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System

Headlines for Thursday Apr. 25, 2024

Top Story

M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process

M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced that the M31 MIPI C/D-PHY Combo IP has obtained silicon validation on the advanced TSMC 5nm process and the company has already started 3nm IP development.

• Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
• Controversial former Arm China CEO founds RISC-V chip startup
• Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
• Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
• Numem at the Design & Reuse IP SoC Silicon Valley 2024
• Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes

Headlines for Wednesday Apr. 24, 2024

Top Story

TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership

TSMC today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

• Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
• Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
• Leveraging Cryogenics and Photonics for Quantum Computing
• Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing

Headlines for Tuesday Apr. 23, 2024

Top Story

Rambus Advances AI 2.0 with GDDR7 Memory Controller IP

As the latest addition to the Rambus portfolio of industry-leading interface and security digital IP for AI 2.0, the GDDR7 memory controller will provide the breakthrough memory throughput required by servers and clients in the next wave of AI inference.

• Credo at TSMC 2024 North America Technology Symposium
• Cadence Reports First Quarter 2024 Financial Results
• Faraday Reports First Quarter 2024 Results
• RAAAM Memory Technologies Closes $4M Seed Round to Commercialize Super Cost Effective On-Chip Memory Solutions
• Alphawave Semi Audited Results for the Year Ended 31 December 2023
• Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
• Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process

Headlines for Monday Apr. 22, 2024

Top Story

Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC

Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced a significant milestone: surpassing 10 million wafers in production containing Silicon Creations IP in collaboration with TSMC, the world's leading dedicated semiconductor foundry.

• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
• T2M-IP Unveils Revolutionary MIPI D-PHY & DSI Controller IP Cores with speed 2.5Gbps/lane, Redefining High-Speed Data Transfer and Display Interfaces

Headlines for Friday Apr. 19, 2024

Top Story

Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance

Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.

• Efabless Announces the Release of the OpenLane 2 Development Platform, Transforming Custom Silicon Design Flows
• TSMC Reports First Quarter EPS of NT$8.70
• Brisbane Silicon publishes DPTx 1.4 IP Core
• GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
• DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core

Headlines for Thursday Apr. 18, 2024

Top Story

Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain

Dolphin Design, a pioneer in silicon IPs specializing in power-management, Audio and Very Edge Computing with AI capabilities, announces it is expanding its GoASIC! Program to enhance the semiconductor industry.

• Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
• Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
• M31 Successfully Validates 5nm IP Solution to Empower Global AI Applications
• Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
• Faraday Partners with Arm to Innovate AI-driven Vehicle ASICs

Headlines for Wednesday Apr. 17, 2024

Top Story

Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass-Produced

Zhuhai Chuangfeixin Technology Co., Ltd.(CFX), a leading one-stop NVMIP (Non-Volatile Memory IP) provider in China, recently announced that its OTP IP (One-Time Programmable memory IP core) for 90nm CMOS Image Sensor (CIS) process technology has successfully entered mass production at one of the top five global foundries.

• JEDEC Updates JESD79-5C DDR5 SDRAM Standard: Elevating Performance and Security for Next-Gen Technologies
• Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
• Silvaco Announces Expanded Partnership with Micron Technology
• U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
• Rivos Raises More Than $250M Targeting Data Analytics and Generative AI Markets

Headlines for Tuesday Apr. 16, 2024

Top Story

Movellus Extends Droop Management Leadership with Aeonic Generate™ AWM3

Movellus today announced the expansion of its award-winning1 droop response solutions with the Aeonic Generate™ AWM3. This pioneering solution responds to voltage droops within 1-2 clock cycles while providing enhanced observability for droop profiling.

• Fraunhofer IIS offers JPEG XS plugin for NVIDIA´s Holoscan for Media Architecture
• CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
• OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance

Headlines for Monday Apr. 15, 2024

Top Story

Microchip Technology Acquires Neuronix AI Labs

Microchip Technology (Nasdaq: MCHP) has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).

• Semiconductor Capacity Is Up, But Mind the Talent Gap
• New Wave Design and Verification Announces Strategic Brand Evolution to Sharpen Focus on Innovation and Growth
• intoPIX Unveils Titanium at NAB for Accelerating IP Media Workflows
• Khronos Releases OpenXR 1.1 to Further Streamline Cross-Platform XR Development
• Brazil and Europe sign innovative project with RISC-V technology for HPC
• Unveiling Silicon-proven USB 3.0 PHY IP Core in 22nm, Elevating High-Speed Data Transmission with Advanced Transceiver Technology, backward compatible with USB 2.0

Headlines for Friday Apr. 12, 2024

Top Story

Creonic GmbH Introduces Fast Fourier Transform IP Core

Creonic GmbH, the leading provider of cutting-edge communications IP cores, proudly announces the release of its (inverse) Fast Fourier Transform (FFT/IFFT) IP core with Error Correction Code (ECC) memory support. Designed to meet the growing demand for efficient, error-tolerant signal processing solutions.

• Logic Fruit Technologies Inc. Excitedly Welcomes Mr. Akshaya Sharma as the new CEO of US Operations
• intoPIX Unveils Latest JPEG XS FPGA Cores with Nextera-Adeas ST2110/IPMX, Streamlining IPMX Development at NAB Show

Headlines for Thursday Apr. 11, 2024

• Xiphera and Kaviaz Technology Announce a Partnership for IP Distribution in Taiwan
• Think Silicon and Edge Impulse Democratize ML on NEOX® for Wearables and AIoT

Headlines for Wednesday Apr. 10, 2024

Top Story

Tiempo Secure - CryptoNext Security partnership, bringing High-End Post-Quantic IP Security innovation to the next level.

Leveraging their combined expertise in post-quantum software and secure hardware cryptography, they will accelerate the introduction of robust, innovative, and post-quantum resilient security solutions, from hardware to software applications, and communications protocols for system-on-chip providers.

• TSMC March 2024 Revenue Report
• Innova finalizes its flow and resource management software platform and opens up to the international market
• Google Cloud Delivers Customized Silicon Powered by Arm Neoverse for General-Purpose Compute and AI Inference Workloads

Headlines for Tuesday Apr. 09, 2024

Top Story

Ambiq and PUFsecurity Join Forces on Energy-Efficient, Security-Enhanced SoC with PUF-based Root of Trust

Ambiq, a globally recognized leader in ultra-low power semiconductors, and PUFsecurity, a subsidiary of eMemory dedicated to innovating PUF-based security IP solutions, announced a successful collaboration on Ambiq's latest Apollo510 integrated with PUFsecurity's PUF-based Root of Trust IP, PUFrt.

• Electronic System Design Industry Posts $4.4 Billion in Revenue in Q4 2023, ESD Alliance Reports
• Rebellions Selects Arteris for Its Next-Generation Neural Processing Unit Aimed at Generative AI
• VeriSilicon showcased its latest power-efficient IP applications at Embedded World 2024
• Arm Accelerates Edge AI with Latest Generation Ethos-U NPU and New IoT Reference Design Platform
• Autotalks and Secure-IC Collaborate to Create the Most Secure V2X Communication Chipset
• Xiphera Launches nQrux™ Family of Hardware Trust Engines for Hardware-Isolated Cryptographic Services and Computing Environments
• TASKING presents compiler toolset for RISC-V in safety- and security-critical automotive applications
• TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
• MIPS Continues To Expand With The Addition Of Industry Leaders from NVIDIA, Google and SiFive
• SiFive Unveils the HiFive Premier P550, the First Commercially Available Out-of-Order RISC-V Development Board

Headlines for Monday Apr. 08, 2024

Top Story

Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications

Ceva-Waves™ Links™ IP Family delivers fully integrated multi-protocol connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs

• GUC Monthly Sales Report - March 2024
• PCIe 7.0 specification reaches "half way point"
• UMC Reports Sales for March 2024
• Imagination's new Catapult CPU is driving RISC-V device adoption
• Via LA Announces Extension of HEVC Patent Pool to Include VVC and Welcomes TCL Into Newly Formed Program
• RISC-V International Achieves Milestone with Ratification of 40 Specifications in Two Years
• MIPS Expands RISC-V Ecosystem Support to to Enable Early Software Development for Multi-threaded Cores
• Secure-IC partners with COONTEC to help strengthen Embedded Cybersecurity in South Korea
• IAR, Nuclei, and MachineWare Join Forces To Speed Up Innovation in RISC-V ASIL Compliant Automotive Solution
• Sondrel CEO steps down as chip firm faces re-organization
• Enhancing Security with Securyzr™ iSE with integrated Hypervisor
• Silicon-Proven 12-Bit 5Msps ADC IP Core for High-Speed Data Conversion, Now Available for Licensing

Headlines for Friday Apr. 05, 2024

Top Story

Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips

Semidynamics, the European RISC-V custom core AI specialist, has announced its ‘All-In-One AI’ IP that is designed for super powerful, next generation AI chips and algorithms such as transformers.

Headlines for Thursday Apr. 04, 2024

Top Story

RED Semiconductor announces VISC™ licensable high performance processor architecture for RISC-V

VISC is an accelerated RISC-V microprocessor core, which optimises complex mathematical algorithms for parallel execution in its reconfiguration hardware engine.

• NeuReality Boosts AI Acelerator Utilization With NAPU
• Global Semiconductor Sales Increase 16.3% Year-to-Year in February
• sureCore announces low power memory compiler for 16nm FinFET
• Defacto now part of Arm's Partner Catalog
• Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption!

Headlines for Wednesday Apr. 03, 2024

Top Story

Think Silicon to Showcase its Latest Ultra-Low-Power 3D Graphics and AI in One IP Architecture at Embedded World 2024

Think Silicon, the leading provider of ultra-low-power GPU and AI IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2024 taking place in Nuremberg, Germany from April 9-11.

• Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion

Headlines for Tuesday Apr. 02, 2024

Top Story

Hailo Closes New $120 Million Funding Round and Debuts Hailo-10, A New Powerful AI Accelerator Bringing Generative AI to Edge Devices

Hailo’s funding now exceeds $340 million as the company introduces its newest AI accelerator specifically designed to process LLMs at low power consumption for the personal computer and automotive industries, bringing generative AI to the edge.

• Proprietary Memories Are a High-Risk Endeavor
• NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration"
• Ezurio and Packetcraft Introduce Talking Sensor Rapid Prototyping Kit with Bluetooth Auracast Broadcast Audio Capability

Headlines for Monday Apr. 01, 2024

• JESD204B & JESD204C Tx-Rx PHY & Controller IP Cores in 28nm are available for immediate licensing with Proven Automotive Compatibility