D&R Headline News (June 2024)

Headlines for Thursday Jun. 27, 2024

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Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight

The European Space Agency (ESA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space applications, a contract under the ARTES Core Competitiveness programme to qualify the GR716B microcontroller for flight.

• Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications

Headlines for Wednesday Jun. 26, 2024

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Tenstorrent To Offer AI Workstation For Developers

Tenstorrent’s first generation AI chips will soon come in a workstation format for AI developers, the company’s CEO Jim Keller told EE Times.

• Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity
• FortifyIQ Introduces FortiPKA-RISC-V: A Breakthrough in Public Key Cryptography Acceleration
• M31 Debuts at the North American Design Automation Conference, Showcasing IP Solutions for Advanced Processes

Headlines for Tuesday Jun. 25, 2024

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Comcores Unveils Industry-First MAC Privacy Protection IP for Enhanced Ethernet Security

Comcores announces the availability of its cutting-edge MAC Privacy Protection IP, keeping in mind the evolving security needs of Ethernet networks, especially low and high-speed Ethernet used in cloud, data center, 5G, industrial, and automotive networks.

• SiFive Announces 4th Generation of Popular Essential Product Line to Spur Innovation Across Embedded Applications
• Semidynamics releases Tensor Unit efficiency data for its new All-In-One AI IP
• Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
• Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
• Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal
• Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing
• Enosemi announces availability of C-band-compatible electronic-photonic design IP
• ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC
• CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
• X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices

Headlines for Monday Jun. 24, 2024

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Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere

Ceva today announced that it has extended its Ceva-NeuPro family of Edge AI NPUs with the introduction of Ceva-NeuPro-Nano NPUs.

• SignatureIP Makes Network-on-Chip (NoC) Design Widely Accessible with Cloud-Based iNoCulator™ Platform
• Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
• True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference
• Flex Logix Celebrates 10 Years of Success and Innovation
• Semiwise, sureCore, and Cadence Showcase Breakthrough in Cryogenic CMOS Circuit Development for Quantum Computing and Energy-Efficient Data Centers
• Crypto Quantique, ZARIOT and Kigen unveil quantum-safe hardware root-of-trust for cellular IoT
• Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite
• Ventana CEO to Deliver a Keynote at RISC-V Summit Europe
• T2M-IP Announces Silicon-Proven MIPI D-PHY v2.5 Tx and DSI-2 Tx Controller Low-Power, Cost-Effective IP Cores Solutions for Advanced SoCs

Headlines for Friday Jun. 21, 2024

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Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions

Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and future workloads and deliver highly scalable chiplet solutions to meet the emerging demand.

• Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
• Andes Technology Showcases Leadership in AI and Automotive Applications at RISC-V Summit Europe 2024

Headlines for Thursday Jun. 20, 2024

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Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem

Robust, chiplet-enabled platform based on Micron HBM3E supports best-in-class performance and exceptional power efficiency

• PQShield raises $37m in Series B funding to deliver the widespread commercial adoption of quantum resistant cryptography
• System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
• Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform
• Breker Verification Systems Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
• lowRISC and Microsoft Collaborate to Help Bring the Revolutionary CHERIoT-Ibex Core to Production Grade

Headlines for Wednesday Jun. 19, 2024

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M31 Announces the Launch of Advanced LPDDR Memory IP to Support HPC Applications

M31 Technology announced the launch of the latest LPDDR memory IP solution to meet the growing demand in the high-performance computing (HPC) application market.

• Rapidus Set to Open 2-nm Pilot Fab, CEO Says
• Movellus Introduces Aeonic Power™ Product Family for On-Die Voltage Regulation
• OPENEDGES to Premiere PHY Vision 2.0 at Design Automation Conference 2024
• YorChip announces Low Latency 200G Chiplet for edge AI
• Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024

Headlines for Tuesday Jun. 18, 2024

• Intel 3 Represents an Intel Foundry Milestone
• QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs
• Sequans Announces a New $15 Million Licensing Agreement
• Faraday to Exhibit Next-gen ASIC Solutions at DAC 2024

Headlines for Monday Jun. 17, 2024

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Initial members join CHERI Alliance to drive adoption of memory safety and scalable software compartmentalization

The CHERI Alliance CIC (Community Interest Company) today announced it has been established to advance the industry-wide adoption of the security technology CHERI (Capability Hardware Enhanced RISC Instructions).

• Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency
• SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024

Headlines for Thursday Jun. 13, 2024

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Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure

Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s 7nm process.

• Consortium led by Crosshill Oy signs defense technology development agreement for F-35 Program with Lockheed Martin
• Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process
• ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024
• Flow Computing Emerges from Stealth with Licensable, On-Die Parallel Processing Enabling 100X Improved Performance For Any CPU Architecture
• Sondrel secures major funding today
• Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
• Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes

Headlines for Wednesday Jun. 12, 2024

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Rambus Unveils PCIe 7.0 IP Portfolio for High-Performance Data Center and AI SoCs

The relentless innovation in Artificial Intelligence (AI) and High-Performance computing (HPC) demands a cutting-edge hardware infrastructure capable of handling unprecedented data loads.

• Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024
• SEMIFIVE joins Arm Total Design with plans to develop Arm Neoverse-powered HPC Platform

Headlines for Tuesday Jun. 11, 2024

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Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions

CSRCompiler, an SoC integration automation software solution, enables faster time-to-market and energy-efficient designs for AI inference and HPC applications at a fraction of the cost

• Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes

Headlines for Monday Jun. 10, 2024

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Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs with Industry's First PCIe 7.0 IP Solution

Synopsys, Inc. (Nasdaq: SNPS) today announced the industry's first complete PCIe 7.0 IP solution consisting of controller, IDE security module, PHY, and verification IP.

• eXpreso eFPGA Compiler Achieves 98.6% Packing Density
• HCLTech and Arm Collaborate on Custom Silicon Chips Optimized for AI Workloads
• OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology
• intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency
• Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
• Global Semiconductor Sales Increase 15.8% Year-to-Year in April; New Industry Forecast Projects Market Growth of 16.0% in 2024

Headlines for Friday Jun. 07, 2024

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Mobiveil's PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory's Ultra High Speed (UHS) PSRAM Memory

Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced it has adapted its PSRAM controller IP to leverage the unique characteristics of AP Memory’s Ultra High Speed (UHS) PSRAM device.

• Nuvoton Develops OpenTitan® based Security Chip as Next Gen Security Solution for Chromebooks
• TSMC May 2024 Revenue Report
• MediaTek Joins Arm Total Design to Shape the Future of AI Computing
• Andes Technology Announces the Annual ANDES RISC-V CON on June 11th at the DoubleTree San Jose Hotel
• Sigasi Redefines Chip Design Creation, Integration, Validation Leveraging Shift-Left Principles

Headlines for Thursday Jun. 06, 2024

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Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet

Alphawave Semi’s chiplet-based custom silicon design platform adds a differentiator in our portfolio that includes IO extension chiplets, memory chiplets, and compute chiplets, as well as Alphawave Semi’s ultra-high-speed connectivity IP and advanced packaging capabilities.

• Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports
• Siemens brings formal methods to high-level verification with C++ coverage closure and property checking
• GUC Monthly Sales Report - May 2024
• BrainChip Introduces TENNs-PLEIADES in New White Paper
• UMC Reports Sales for May 2024
• Arm looking for 50% of Windows PC market
• Synthara Raises Over USD 11M to expand the embedded computing market and enable AI applications

Headlines for Wednesday Jun. 05, 2024

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Qualitas Semiconductor Announces 5nm MIPI C-PHY IP with 8Gsps Data Rate

QUALITAS SEMICONDUCTOR announces the successful development MIPI C-PHY TX/RX IP supporting a maximum data rate of 8.0Gsps and compliant with MIPI C-PHY Standard v2.1.

• Skymizer Launches Groundbreaking LLM Accelerator IP for on-device LLM Inferencing, EdgeThought, the game-changer in on-device GenAI era
• RaiderChip launches its Generative AI hardware accelerator for LLM models on low-cost FPGAs
• AI Edge Inference IP Leader Expedera Opens R&D Office in India

Headlines for Tuesday Jun. 04, 2024

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Codasip introduces best-in-class RISC-V core for power-efficient applications

Codasip L110 delivers up to 50% improvements in performance per watt and 20% smaller code size compared to similar cores in the market

• New LZ4 & Snappy IP Core from CAST Enables Fast Lossless Data Decompression
• SureCore announces low power cryogenic memory technology that could help dramatically cut data centre power usage
• Kalray and Pliops enters into exclusive negotiations to create a global leader in data accelerators for AI and storage acceleration
• Raspberry Pi Selects Hailo to Enable Advanced AI Capabilities for Raspberry Pi 5

Headlines for Monday Jun. 03, 2024

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Rain AI Unveils Andes Technology as Its RISC-V Partner

Andes Technology announces that Rain AI, a pioneer in compute-in-memory (CIM) technology, licensed Andes’ AX45MPV RISC-V vector processor.

• Cadence Completes Acquisition of BETA CAE
• Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP core Time-Interleaved Pipeline Solution Now Available for Whitebox Licensing with No Royalty